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Intel |
672-PIN UBGA
- Architecture: -
- Core Processor: -
- Flash Size: -
- RAM Size: -
- Peripherals: -
- Connectivity: -
- Speed: -
- Primary Attributes: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock5,120 |
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Intel |
IC EXCALIBUR ARM 484FBGA
- Core Type: 32-Bit ARM9
- Speed: 266MHz
- Interface: EBI/EMI, UART/USART
- Program SRAM Bytes: 32K
- FPGA SRAM: -
- EEPROM Size: -
- Data SRAM Bytes: 16K
- FPGA Core Cells: 4160
- FPGA Gates: 100K
- FPGA Registers: -
- Voltage - Supply: 1.8V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C
- Package / Case: 484-BBGA
- Supplier Device Package: 484-FBGA (23x23)
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Package: 484-BBGA |
Stock5,728 |
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Intel |
IC FPGA 92 I/O 144TQFP
- Number of LABs/CLBs: 2560
- Number of Logic Elements/Cells: 2560
- Total RAM Bits: 32768
- Number of I/O: 92
- Number of Gates: 162000
- Voltage - Supply: 1.71 V ~ 1.89 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 144-LQFP
- Supplier Device Package: 144-TQFP (20x20)
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Package: 144-LQFP |
Stock6,560 |
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Intel |
IC FPGA 120 I/O 208QFP
- Number of LABs/CLBs: 72
- Number of Logic Elements/Cells: 576
- Total RAM Bits: 12288
- Number of I/O: 120
- Number of Gates: 56000
- Voltage - Supply: 2.375 V ~ 2.625 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 70°C (TA)
- Package / Case: 208-BFQFP
- Supplier Device Package: 208-PQFP (28x28)
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Package: 208-BFQFP |
Stock7,408 |
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Intel |
IC FPGA 488 I/O 780HBGA
- Number of LABs/CLBs: 8000
- Number of Logic Elements/Cells: 200000
- Total RAM Bits: 10901504
- Number of I/O: 488
- Number of Gates: -
- Voltage - Supply: 0.86 V ~ 1.15 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 780-BBGA, FCBGA
- Supplier Device Package: 780-HBGA (33x33)
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Package: 780-BBGA, FCBGA |
Stock2,672 |
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Intel |
IC FPGA 552 I/O 1152FBGA
- Number of LABs/CLBs: 234720
- Number of Logic Elements/Cells: 622000
- Total RAM Bits: 59939840
- Number of I/O: 552
- Number of Gates: -
- Voltage - Supply: 0.82 V ~ 0.88 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock7,280 |
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Intel |
1152-PIN FBGA
- Number of LABs/CLBs: 101620
- Number of Logic Elements/Cells: 270000
- Total RAM Bits: 17870848
- Number of I/O: 384
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.93 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock5,920 |
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Intel |
IC FPGA 488 I/O 780FBGA
- Number of LABs/CLBs: 2700
- Number of Logic Elements/Cells: 67500
- Total RAM Bits: 2699264
- Number of I/O: 488
- Number of Gates: -
- Voltage - Supply: 0.86 V ~ 1.15 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 780-BBGA, FCBGA
- Supplier Device Package: 780-FBGA (29x29)
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Package: 780-BBGA, FCBGA |
Stock4,048 |
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Intel |
IC FPGA 361 I/O 780FBGA
- Number of LABs/CLBs: 1694
- Number of Logic Elements/Cells: 33880
- Total RAM Bits: 1369728
- Number of I/O: 361
- Number of Gates: -
- Voltage - Supply: 1.15 V ~ 1.25 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 780-BBGA
- Supplier Device Package: 780-FBGA (29x29)
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Package: 780-BBGA |
Stock3,376 |
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Intel |
IC FPGA 488 I/O 780FBGA
- Number of LABs/CLBs: 1900
- Number of Logic Elements/Cells: 47500
- Total RAM Bits: 2184192
- Number of I/O: 488
- Number of Gates: -
- Voltage - Supply: 0.86 V ~ 1.15 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 780-BBGA, FCBGA
- Supplier Device Package: 780-FBGA (29x29)
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Package: 780-BBGA, FCBGA |
Stock2,640 |
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Intel |
IC FPGA 156 I/O 256FBGA
- Number of LABs/CLBs: 1539
- Number of Logic Elements/Cells: 24624
- Total RAM Bits: 608256
- Number of I/O: 156
- Number of Gates: -
- Voltage - Supply: 1.15 V ~ 1.25 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 256-LBGA
- Supplier Device Package: 256-FBGA (17x17)
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Package: 256-LBGA |
Stock6,800 |
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Intel |
IC FPGA 150 I/O 324FBGA
- Number of LABs/CLBs: 1330
- Number of Logic Elements/Cells: 21280
- Total RAM Bits: 774144
- Number of I/O: 150
- Number of Gates: -
- Voltage - Supply: 1.16 V ~ 1.24 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 324-LBGA
- Supplier Device Package: 324-FBGA (19x19)
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Package: 324-LBGA |
Stock5,104 |
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Intel |
IC CPLD 128MC 10NS 160QFP
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 10.0ns
- Voltage Supply - Internal: 4.75 V ~ 5.25 V
- Number of Logic Elements/Blocks: 8
- Number of Macrocells: 128
- Number of Gates: 2500
- Number of I/O: 100
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 160-BQFP
- Supplier Device Package: 160-PQFP (28x28)
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Package: 160-BQFP |
Stock6,960 |
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Intel |
IC CPLD 440MC 5.4NS 144TQFP
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 5.4ns
- Voltage Supply - Internal: 2.5V, 3.3V
- Number of Logic Elements/Blocks: 570
- Number of Macrocells: 440
- Number of Gates: -
- Number of I/O: 116
- Operating Temperature: 0°C ~ 85°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 144-LQFP
- Supplier Device Package: 144-TQFP (20x20)
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Package: 144-LQFP |
Stock7,404 |
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Intel |
IC FPGA FLIPCHIP
- Number of LABs/CLBs: -
- Number of Logic Elements/Cells: -
- Total RAM Bits: -
- Number of I/O: -
- Number of Gates: -
- Voltage - Supply: -
- Mounting Type: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock5,616 |
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Intel |
IC FPGA 488 I/O 1152FBGA
- Number of LABs/CLBs: 4224
- Number of Logic Elements/Cells: 105600
- Total RAM Bits: 9793536
- Number of I/O: 488
- Number of Gates: -
- Voltage - Supply: 0.87V ~ 0.93V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock4,464 |
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Intel |
IC FPGA 600 I/O 1152FBGA
- Number of LABs/CLBs: 158500
- Number of Logic Elements/Cells: 420000
- Total RAM Bits: 37888000
- Number of I/O: 600
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: - |
Request a Quote |
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Intel |
IC FPGA AGILEX-F 2340BGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 1.9M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2340-BFBGA Exposed Pad
- Supplier Device Package: 2340-BGA (45x42)
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Package: - |
Request a Quote |
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Intel |
IC FPGA AGILEX-F 2340FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 1.2M Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Intel |
IC FPGA 696 I/O 1517HBGA
- Number of LABs/CLBs: 359200
- Number of Logic Elements/Cells: 952000
- Total RAM Bits: 53248000
- Number of I/O: 696
- Number of Gates: -
- Voltage - Supply: 0.87V ~ 0.93V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-HBGA (45x45)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 600 I/O 1152FBGA
- Number of LABs/CLBs: 128300
- Number of Logic Elements/Cells: 340000
- Total RAM Bits: 19456000
- Number of I/O: 600
- Number of Gates: -
- Voltage - Supply: 0.87V ~ 0.93V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: - |
Request a Quote |
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Intel |
IC FPGA AGILEX-F 2340BGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 1.9M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2340-BFBGA Exposed Pad
- Supplier Device Package: 2340-BGA (45x42)
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Package: - |
Request a Quote |
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Intel |
CLOCK RECOVERY CIRCUIT, 1-FUNC
- PLL: Yes
- Main Purpose: Gigabit Ethernet, SONET/SDH, STM
- Input: CML, LVTTL
- Output: Clock, CML
- Number of Circuits: 1
- Ratio - Input:Output: 4:7
- Differential - Input:Output: Yes/Yes
- Frequency - Max: 2.488GHz
- Voltage - Supply: 2.97V ~ 3.6V
- Operating Temperature: -40°C ~ 85°C (TC)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-TQFP-EDQUAD (7x7)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 704 I/O 2397BGA
- Number of LABs/CLBs: 350000
- Number of Logic Elements/Cells: 2800000
- Total RAM Bits: -
- Number of I/O: 704
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2397-BBGA, FCBGA
- Supplier Device Package: 2397-FBGA, FC (50x50)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 704 I/O 2397BGA
- Number of LABs/CLBs: 262500
- Number of Logic Elements/Cells: 2100000
- Total RAM Bits: -
- Number of I/O: 704
- Number of Gates: -
- Voltage - Supply: 0.77V ~ 0.97V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2397-BBGA, FCBGA
- Supplier Device Package: 2397-FBGA, FC (50x50)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 674 I/O 1517FBGA
- Number of LABs/CLBs: 21225
- Number of Logic Elements/Cells: 450000
- Total RAM Bits: 40249344
- Number of I/O: 674
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA (40x40)
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Package: - |
Request a Quote |
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Intel |
IC FPGA AGILEX-F 2340FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 573K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Intel |
IC FPGA 552 I/O 1152FBGA
- Number of LABs/CLBs: 234720
- Number of Logic Elements/Cells: 622000
- Total RAM Bits: 51200000
- Number of I/O: 552
- Number of Gates: -
- Voltage - Supply: 0.87V ~ 0.93V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: - |
Request a Quote |
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