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Intel |
IC FPGA FBGA
- Number of LABs/CLBs: -
- Number of Logic Elements/Cells: -
- Total RAM Bits: -
- Number of I/O: -
- Number of Gates: -
- Voltage - Supply: -
- Mounting Type: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock3,200 |
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Intel |
IC FPGA 360 I/O 484FBGA
- Number of LABs/CLBs: 2500
- Number of Logic Elements/Cells: 40000
- Total RAM Bits: 1290240
- Number of I/O: 360
- Number of Gates: -
- Voltage - Supply: 1.15 V ~ 1.25 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 484-BGA
- Supplier Device Package: 484-FBGA (23x23)
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Package: 484-BGA |
Stock5,088 |
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Intel |
IC FPGA
- Number of LABs/CLBs: 832
- Number of Logic Elements/Cells: 8320
- Total RAM Bits: 106496
- Number of I/O: 277
- Number of Gates: 526000
- Voltage - Supply: 2.375 V ~ 2.625 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 356-LBGA
- Supplier Device Package: 356-BGA (35x35)
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Package: 356-LBGA |
Stock2,640 |
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Intel |
IC FPGA
- Number of LABs/CLBs: 640
- Number of Logic Elements/Cells: 6400
- Total RAM Bits: 81920
- Number of I/O: -
- Number of Gates: 404000
- Voltage - Supply: 1.71 V ~ 1.89 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 400-BGA
- Supplier Device Package: 400-BGA
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Package: 400-BGA |
Stock2,496 |
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Intel |
IC FPGA 147 I/O 208QFP
- Number of LABs/CLBs: 360
- Number of Logic Elements/Cells: 2880
- Total RAM Bits: 40960
- Number of I/O: 147
- Number of Gates: 199000
- Voltage - Supply: 2.3 V ~ 2.7 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 70°C (TA)
- Package / Case: 208-BFQFP
- Supplier Device Package: 208-PQFP (28x28)
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Package: 208-BFQFP |
Stock5,104 |
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Intel |
IC FPGA 470 I/O 672FBGA
- Number of LABs/CLBs: 1248
- Number of Logic Elements/Cells: 9984
- Total RAM Bits: 98304
- Number of I/O: 470
- Number of Gates: 513000
- Voltage - Supply: 2.375 V ~ 2.625 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 70°C (TA)
- Package / Case: 672-BBGA
- Supplier Device Package: 672-FBGA (27x27)
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Package: 672-BBGA |
Stock4,256 |
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Intel |
IC FPGA 840 I/O 1932FBGA
- Number of LABs/CLBs: 359200
- Number of Logic Elements/Cells: 952000
- Total RAM Bits: 65561600
- Number of I/O: 840
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.93 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1932-BBGA, FCBGA
- Supplier Device Package: 1932-FBGA, FC (45x45)
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Package: 1932-BBGA, FCBGA |
Stock4,928 |
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Intel |
IC FPGA 600 I/O 1760FBGA
- Number of LABs/CLBs: 225400
- Number of Logic Elements/Cells: 597000
- Total RAM Bits: 61688832
- Number of I/O: 600
- Number of Gates: -
- Voltage - Supply: 0.82 V ~ 0.88 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
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Package: 1760-BBGA, FCBGA |
Stock3,344 |
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Intel |
IC FPGA 696 I/O 1517FBGA
- Number of LABs/CLBs: 262400
- Number of Logic Elements/Cells: 695000
- Total RAM Bits: 60968960
- Number of I/O: 696
- Number of Gates: -
- Voltage - Supply: 0.82 V ~ 0.88 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA (40x40)
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Package: 1517-BBGA, FCBGA |
Stock2,048 |
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Intel |
IC FPGA 544 I/O 1152FBGA
- Number of LABs/CLBs: 23780
- Number of Logic Elements/Cells: 504000
- Total RAM Bits: 27695104
- Number of I/O: 544
- Number of Gates: -
- Voltage - Supply: 1.07 V ~ 1.13 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA Exposed Pad
- Supplier Device Package: 1152-FBGA (35x35)
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Package: 1152-BBGA, FCBGA Exposed Pad |
Stock4,864 |
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Intel |
IC FPGA 396 I/O 1152FCBGA
- Number of LABs/CLBs: 250540
- Number of Logic Elements/Cells: 660000
- Total RAM Bits: 49610752
- Number of I/O: 396
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.93 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FCBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock5,040 |
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Intel |
780-PIN FBGA
- Number of LABs/CLBs: 183590
- Number of Logic Elements/Cells: 480000
- Total RAM Bits: 5664768
- Number of I/O: 360
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.93 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 780-BBGA, FCBGA
- Supplier Device Package: 780-FBGA (29x29)
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Package: 780-BBGA, FCBGA |
Stock2,384 |
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Intel |
IC CPLD 192MC 15NS 160QFP
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 15.0ns
- Voltage Supply - Internal: 4.75 V ~ 5.25 V
- Number of Logic Elements/Blocks: 12
- Number of Macrocells: 192
- Number of Gates: 3750
- Number of I/O: 124
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 160-BQFP
- Supplier Device Package: 160-PQFP (28x28)
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Package: 160-BQFP |
Stock2,912 |
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Intel |
IC CPLD 512MC 7.5NS 256FBGA
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 7.5ns
- Voltage Supply - Internal: 3 V ~ 3.6 V
- Number of Logic Elements/Blocks: 32
- Number of Macrocells: 512
- Number of Gates: 10000
- Number of I/O: 208
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 256-BGA
- Supplier Device Package: 256-FBGA (17x17)
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Package: 256-BGA |
Stock3,344 |
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Intel |
IC CPLD 32MC 15NS 44PLCC
- Programmable Type: EE PLD
- Delay Time tpd(1) Max: 15.0ns
- Voltage Supply - Internal: 4.5 V ~ 5.5 V
- Number of Logic Elements/Blocks: 2
- Number of Macrocells: 32
- Number of Gates: 600
- Number of I/O: 36
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 44-LCC (J-Lead)
- Supplier Device Package: 44-PLCC (16.59x16.59)
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Package: 44-LCC (J-Lead) |
Stock4,608 |
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Intel |
IC CPLD 440MC 9NS 256MBGA
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 9.0ns
- Voltage Supply - Internal: 1.71 V ~ 1.89 V
- Number of Logic Elements/Blocks: 570
- Number of Macrocells: 440
- Number of Gates: -
- Number of I/O: 160
- Operating Temperature: -40°C ~ 100°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 256-TFBGA
- Supplier Device Package: 256-MBGA (11x11)
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Package: 256-TFBGA |
Stock3,904 |
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Intel |
IC FPGA 552 I/O 1152FBGA
- Number of LABs/CLBs: 158500
- Number of Logic Elements/Cells: 420000
- Total RAM Bits: 37888000
- Number of I/O: 552
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: - |
Request a Quote |
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Intel |
IC FPGA AGILEX-F 2581FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 2.2M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Intel |
IC FPGA AGILEX-I 2957BGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 4M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2957-BFBGA Exposed Pad
- Supplier Device Package: 2957-BGA (56x45)
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Package: - |
Request a Quote |
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Intel |
IC FPGA AGILEX-I 1805BGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 1.9M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1805-BBGA Exposed Pad
- Supplier Device Package: 1805-BGA (42.5x42.5)
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Package: - |
Request a Quote |
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Intel |
IC FPGA AGILEX-I 3184BGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 1.9M Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 3184-BFBGA Exposed Pad
- Supplier Device Package: 3184-BGA (56x45)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 696 I/O 1517FBGA
- Number of LABs/CLBs: 185000
- Number of Logic Elements/Cells: 490000
- Total RAM Bits: 46080000
- Number of I/O: 696
- Number of Gates: -
- Voltage - Supply: 0.87V ~ 0.93V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA (40x40)
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Package: - |
Request a Quote |
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Intel |
IC FPGA AGILEX-F 1546FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 573K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Intel |
IC FPGA 688 I/O 1760FBGA
- Number of LABs/CLBs: 106250
- Number of Logic Elements/Cells: 850000
- Total RAM Bits: -
- Number of I/O: 688
- Number of Gates: -
- Voltage - Supply: 0.77V ~ 0.97V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FBGA (42.5x42.5)
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Package: - |
Request a Quote |
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Intel |
IC FPGA AGILEX-F 2486FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 1.2M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Intel |
IC FPGA AGILEX-F 2340FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 764K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Intel |
IC FPGA 432 I/O 1152FBGA
- Number of LABs/CLBs: 234720
- Number of Logic Elements/Cells: 622000
- Total RAM Bits: 51200000
- Number of I/O: 432
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: - |
Request a Quote |
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Intel |
IC FPGA AGILEX-F 2340FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 1.2M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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