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Intel |
IC FPGA 528 I/O 1517FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 64KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 700MHz
- Primary Attributes: FPGA - 350K Logic Elements
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA (40x40)
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Package: 1517-BBGA, FCBGA |
Stock3,776 |
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Intel |
1760-PIN FBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 2800K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock7,872 |
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Intel |
IC SOC FPGA 696 I/O 1517FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 570K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA (40x40)
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Package: 1517-BBGA, FCBGA |
Stock6,944 |
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Intel |
IC SOC FPGA 384 I/O 1152FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 320K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock2,048 |
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Intel |
IC FPGA
- Number of LABs/CLBs: 832
- Number of Logic Elements/Cells: 8320
- Total RAM Bits: 106496
- Number of I/O: -
- Number of Gates: 526000
- Voltage - Supply: 1.71 V ~ 1.89 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 672-BBGA, FCBGA
- Supplier Device Package: 672-FBGA (27x27)
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Package: 672-BBGA, FCBGA |
Stock5,776 |
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Intel |
IC FPGA 502 I/O 672FBGA
- Number of LABs/CLBs: 1664
- Number of Logic Elements/Cells: 16640
- Total RAM Bits: 212992
- Number of I/O: 502
- Number of Gates: 1052000
- Voltage - Supply: 2.375 V ~ 2.625 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 672-BBGA, FCBGA
- Supplier Device Package: 672-FBGA (27x27)
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Package: 672-BBGA, FCBGA |
Stock4,848 |
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Intel |
IC FPGA 488 I/O 780FBGA
- Number of LABs/CLBs: 4300
- Number of Logic Elements/Cells: 107500
- Total RAM Bits: 4992000
- Number of I/O: 488
- Number of Gates: -
- Voltage - Supply: 0.86 V ~ 1.15 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 780-BBGA, FCBGA
- Supplier Device Package: 780-FBGA (29x29)
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Package: 780-BBGA, FCBGA |
Stock7,248 |
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Intel |
IC FPGA 384 I/O 896FBGA
- Number of LABs/CLBs: 8962
- Number of Logic Elements/Cells: 190000
- Total RAM Bits: 13284352
- Number of I/O: 384
- Number of Gates: -
- Voltage - Supply: 1.12 V ~ 1.18 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 896-BBGA, FCBGA
- Supplier Device Package: 896-FBGA (31x31)
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Package: 896-BBGA, FCBGA |
Stock6,928 |
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Intel |
IC FPGA 296 I/O 484FBGA
- Number of LABs/CLBs: 1900
- Number of Logic Elements/Cells: 47500
- Total RAM Bits: 2184192
- Number of I/O: 296
- Number of Gates: -
- Voltage - Supply: 0.86 V ~ 1.15 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 484-BBGA, FCBGA
- Supplier Device Package: 484-FBGA (23x23)
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Package: 484-BBGA, FCBGA |
Stock4,304 |
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Intel |
IC FPGA 341 I/O 780FBGA
- Number of LABs/CLBs: 1676
- Number of Logic Elements/Cells: 33520
- Total RAM Bits: 1348416
- Number of I/O: 341
- Number of Gates: -
- Voltage - Supply: 1.15 V ~ 1.25 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 780-BBGA
- Supplier Device Package: 780-FBGA (29x29)
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Package: 780-BBGA |
Stock6,720 |
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Intel |
IC FPGA 128 I/O 256FBGA
- Number of LABs/CLBs: 18480
- Number of Logic Elements/Cells: 49000
- Total RAM Bits: 3464192
- Number of I/O: 128
- Number of Gates: -
- Voltage - Supply: 1.07 V ~ 1.13 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 256-LBGA
- Supplier Device Package: 256-FBGA (17x17)
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Package: 256-LBGA |
Stock8,232 |
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Intel |
IC CPLD 320MC 10NS 208RQFP
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 10.0ns
- Voltage Supply - Internal: 4.5 V ~ 5.5 V
- Number of Logic Elements/Blocks: 20
- Number of Macrocells: 320
- Number of Gates: 6000
- Number of I/O: 132
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 208-BFQFP Exposed Pad
- Supplier Device Package: 208-RQFP (28x28)
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Package: 208-BFQFP Exposed Pad |
Stock5,712 |
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Intel |
IC CPLD 128MC 7.5NS 64EQFP
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 7.5ns
- Voltage Supply - Internal: 1.71 V ~ 1.89 V
- Number of Logic Elements/Blocks: 160
- Number of Macrocells: 128
- Number of Gates: -
- Number of I/O: 54
- Operating Temperature: -40°C ~ 100°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 64-TQFP Exposed Pad
- Supplier Device Package: 64-EQFP (7x7)
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Package: 64-TQFP Exposed Pad |
Stock2,448 |
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Intel |
IC FPGA 612 I/O 1152FBGA
- Number of LABs/CLBs: 10260
- Number of Logic Elements/Cells: 244188
- Total RAM Bits: 12038144
- Number of I/O: 612
- Number of Gates: -
- Voltage - Supply: 0.87V ~ 0.93V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock2,224 |
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Intel |
IC FPGA 384 I/O 896FBGA
- Number of LABs/CLBs: 14151
- Number of Logic Elements/Cells: 300000
- Total RAM Bits: 17358848
- Number of I/O: 384
- Number of Gates: -
- Voltage - Supply: 1.07V ~ 1.13V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 896-BBGA, FCBGA
- Supplier Device Package: 896-FBGA (31x31)
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Package: 896-BBGA, FCBGA |
Stock6,608 |
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Intel |
IC FPGA AGILEX-F 2340FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 764K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Intel |
IC FPGA 372 I/O 780FBGA
- Number of LABs/CLBs: -
- Number of Logic Elements/Cells: -
- Total RAM Bits: -
- Number of I/O: -
- Number of Gates: -
- Voltage - Supply: -
- Mounting Type: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Intel |
IC FPGA 696 I/O 1517FBGA
- Number of LABs/CLBs: 262400
- Number of Logic Elements/Cells: 695000
- Total RAM Bits: 51200000
- Number of I/O: 696
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA (40x40)
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Package: - |
Request a Quote |
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Intel |
DRAM CONTROLLER, 1M X 8 PDIP48
- Controller Type: Dynamic RAM (DRAM)
- Voltage - Supply: 4.5V ~ 5.5V
- Operating Temperature: 0°C ~ 70°C (TA)
- Package / Case: 48-DIP
- Supplier Device Package: 48-DIP
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Package: - |
Request a Quote |
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Intel |
IC CPLD 980MC 6.2NS 144TQFP
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 6.2 ns
- Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
- Number of Logic Elements/Blocks: 1270
- Number of Macrocells: 980
- Number of Gates: -
- Number of I/O: 116
- Operating Temperature: 0°C ~ 85°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 144-LQFP
- Supplier Device Package: 144-TQFP (20x20)
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Package: - |
Request a Quote |
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Intel |
IC FPGA STRATIX 10 1760FBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 850K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FBGA (42.5x42.5)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 704 I/O 2397BGA
- Number of LABs/CLBs: 350000
- Number of Logic Elements/Cells: 2800000
- Total RAM Bits: -
- Number of I/O: 704
- Number of Gates: -
- Voltage - Supply: 0.77V ~ 0.97V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 2397-BBGA, FCBGA
- Supplier Device Package: 2397-FBGA, FC (50x50)
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Package: - |
Request a Quote |
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Intel |
IC FPGA STRATIX 10 2397FBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 2800K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 2397-BBGA, FCBGA
- Supplier Device Package: 2397-FBGA, FC (50x50)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 360 I/O 780HBGA
- Number of LABs/CLBs: 89000
- Number of Logic Elements/Cells: 236000
- Total RAM Bits: 13312000
- Number of I/O: 360
- Number of Gates: -
- Voltage - Supply: 0.87V ~ 0.93V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 780-BBGA, FCBGA
- Supplier Device Package: 780-HBGA (33x33)
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Package: - |
Request a Quote |
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Intel |
IC FPGA AGILEX-I 1805BGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 2.3M Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1805-BBGA Exposed Pad
- Supplier Device Package: 1805-BGA (42.5x42.5)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 360 I/O 780HBGA
- Number of LABs/CLBs: 89000
- Number of Logic Elements/Cells: 236000
- Total RAM Bits: 13312000
- Number of I/O: 360
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 780-BBGA, FCBGA
- Supplier Device Package: 780-HBGA (33x33)
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Package: - |
Request a Quote |
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Intel |
8-BIT MCU, OTPROM, 8051 CPU
- Core Processor: 80C51
- Core Size: 8-Bit
- Speed: 12MHz
- Connectivity: Serial Port
- Peripherals: POR, WDT
- Number of I/O: 32
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: EPROM
- EEPROM Size: -
- RAM Size: 256 x 8
- Voltage - Supply (Vcc/Vdd): 4V ~ 6V
- Data Converters: -
- Oscillator Type: External, Internal
- Operating Temperature: -55°C ~ 125°C (TC)
- Mounting Type: Surface Mount
- Package / Case: 44-CLCC
- Supplier Device Package: 44-CLCC
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Package: - |
Request a Quote |
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Intel |
IC FPGA 696 I/O 1517FBGA
- Number of LABs/CLBs: 234720
- Number of Logic Elements/Cells: 622000
- Total RAM Bits: 51200000
- Number of I/O: 696
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA (40x40)
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Package: - |
Request a Quote |
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