Page 306 - Intel Products | Heisener Electronics

10AS022E3F27I1SG
Intel

IC SOC FPGA 240 I/O 672FBGA

Package: 672-BBGA, FCBGA

Stock6,096
5CSEBA6U19C8NES
Intel

IC FPGA 66 I/O 484UBGA

Package: 484-FBGA

Stock5,840
10AS048H2F34E1HG
Intel

IC SOC FPGA 492 I/O 1152FBGA

Package: 1152-BBGA, FCBGA

Stock4,992
EP2A70B724C8
Intel

IC FPGA 540 I/O 724BGA

Package: 724-BBGA, FCBGA

Stock4,608
EP3SL150F780I4LN
Intel

IC FPGA 488 I/O 780FBGA

Package: 780-BBGA, FCBGA

Stock2,688
10AX066H3F34I2LG
Intel

IC FPGA 492 I/O 1152FCBGA

Package: 1152-BBGA, FCBGA

Stock2,688
10AX048K4F35I3LG
Intel

1152-PIN FBGA

Package: 1152-BBGA, FCBGA

Stock3,584
EP3SL70F780C2N
Intel

IC FPGA 488 I/O 780FBGA

Package: 780-BBGA, FCBGA

Stock7,808
10AX032E2F27I2SG
Intel

672-PIN FBGA

Package: 672-BBGA, FCBGA

Stock5,024
EP4CE115F23C9LN
Intel

IC FPGA 280 I/O 484FBGA

Package: 484-BGA

Stock4,592
5CGXBC7B6M15C7N
Intel

IC FPGA 240 I/O 484MBGA

Package: 484-LFBGA

Stock4,880
5CGXFC4C7M13C8N
Intel

IC FPGA 175 I/O 383MBGA

Package: 383-TFBGA

Stock3,520
EP1C6T144C7
Intel

IC FPGA 98 I/O 144TQFP

Package: 144-LQFP

Stock6,560
EPM7256ERC208-12MM
Intel

IC CPLD 256MC 12NS 208RQFP

Package: 208-BFQFP Exposed Pad

Stock7,024
EPM7160EQC160-12
Intel

IC CPLD 160MC 12NS 160QFP

Package: 160-BQFP

Stock11,340
EPM7128BFC256-7
Intel

IC CPLD 128MC 7.5NS 256FBGA

Package: 256-BGA

Stock7,360
5SGXMB5R2F43I2LG
Intel

IC FPGA 600 I/O 1760FBGA

Package: -

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5SGXMA7H3F35C2NCV
Intel

IC FPGA 552 I/O 1152FBGA

Package: -

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5SGXMA7K3F40C2WN
Intel

IC FPGA 696 I/O 1517FBGA

Package: -

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EPM240T100I5NAB
Intel

IC CPLD 192MC 7.5NS 100TQFP

Package: -

Request a Quote

Part Number	Manufacturer	Description	Package	Stock
10AS022E3F27I1SG	Intel	IC SOC FPGA 240 I/O 672FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 220K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27x27)	Package: 672-BBGA, FCBGA	Stock6,096
5CSEBA6U19C8NES	Intel	IC FPGA 66 I/O 484UBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz Primary Attributes: FPGA - 110K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-FBGA Supplier Device Package: 484-UBGA (19x19)	Package: 484-FBGA	Stock5,840
10AS048H2F34E1HG	Intel	IC SOC FPGA 492 I/O 1152FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 480K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: 1152-BBGA, FCBGA	Stock4,992
EP2A70B724C8	Intel	IC FPGA 540 I/O 724BGA Number of LABs/CLBs: 6720 Number of Logic Elements/Cells: 67200 Total RAM Bits: 1146880 Number of I/O: 540 Number of Gates: 5250000 Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 724-BBGA, FCBGA Supplier Device Package: 724-BGA (35x35)	Package: 724-BBGA, FCBGA	Stock4,608
EP3SL150F780I4LN	Intel	IC FPGA 488 I/O 780FBGA Number of LABs/CLBs: 5700 Number of Logic Elements/Cells: 142500 Total RAM Bits: 6543360 Number of I/O: 488 Number of Gates: - Voltage - Supply: 0.86 V ~ 1.15 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	Package: 780-BBGA, FCBGA	Stock2,688
10AX066H3F34I2LG	Intel	IC FPGA 492 I/O 1152FCBGA Number of LABs/CLBs: 250540 Number of Logic Elements/Cells: 660000 Total RAM Bits: 49610752 Number of I/O: 492 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35)	Package: 1152-BBGA, FCBGA	Stock2,688
10AX048K4F35I3LG	Intel	1152-PIN FBGA Number of LABs/CLBs: 183590 Number of Logic Elements/Cells: 480000 Total RAM Bits: 5664768 Number of I/O: 396 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.98 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: 1152-BBGA, FCBGA	Stock3,584
EP3SL70F780C2N	Intel	IC FPGA 488 I/O 780FBGA Number of LABs/CLBs: 2700 Number of Logic Elements/Cells: 67500 Total RAM Bits: 2699264 Number of I/O: 488 Number of Gates: - Voltage - Supply: 0.86 V ~ 1.15 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	Package: 780-BBGA, FCBGA	Stock7,808
10AX032E2F27I2SG	Intel	672-PIN FBGA Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 Total RAM Bits: 21040128 Number of I/O: 240 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.98 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA, FC (27x27)	Package: 672-BBGA, FCBGA	Stock5,024
EP4CE115F23C9LN	Intel	IC FPGA 280 I/O 484FBGA Number of LABs/CLBs: 7155 Number of Logic Elements/Cells: 114480 Total RAM Bits: 3981312 Number of I/O: 280 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FBGA (23x23)	Package: 484-BGA	Stock4,592
5CGXBC7B6M15C7N	Intel	IC FPGA 240 I/O 484MBGA Number of LABs/CLBs: 56480 Number of Logic Elements/Cells: 149500 Total RAM Bits: 7880704 Number of I/O: 240 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-LFBGA Supplier Device Package: 484-MBGA (15x15)	Package: 484-LFBGA	Stock4,880
5CGXFC4C7M13C8N	Intel	IC FPGA 175 I/O 383MBGA Number of LABs/CLBs: 18868 Number of Logic Elements/Cells: 50000 Total RAM Bits: 2862080 Number of I/O: 175 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 383-TFBGA Supplier Device Package: 383-MBGA (13x13)	Package: 383-TFBGA	Stock3,520
EP1C6T144C7	Intel	IC FPGA 98 I/O 144TQFP Number of LABs/CLBs: 598 Number of Logic Elements/Cells: 5980 Total RAM Bits: 92160 Number of I/O: 98 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	Package: 144-LQFP	Stock6,560
EPM7256ERC208-12MM	Intel	IC CPLD 256MC 12NS 208RQFP Programmable Type: EE PLD Delay Time tpd(1) Max: 12.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 16 Number of Macrocells: 256 Number of Gates: 5000 Number of I/O: 164 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 208-BFQFP Exposed Pad Supplier Device Package: 208-RQFP (28x28)	Package: 208-BFQFP Exposed Pad	Stock7,024
EPM7160EQC160-12	Intel	IC CPLD 160MC 12NS 160QFP Programmable Type: EE PLD Delay Time tpd(1) Max: 12.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 10 Number of Macrocells: 160 Number of Gates: 3200 Number of I/O: 104 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 160-BQFP Supplier Device Package: 160-PQFP (28x28)	Package: 160-BQFP	Stock11,340
EPM7128BFC256-7	Intel	IC CPLD 128MC 7.5NS 256FBGA Programmable Type: In System Programmable Delay Time tpd(1) Max: 7.5ns Voltage Supply - Internal: 2.375 V ~ 2.625 V Number of Logic Elements/Blocks: 8 Number of Macrocells: 128 Number of Gates: 2500 Number of I/O: 100 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	Package: 256-BGA	Stock7,360
5SGXMB5R2F43I2LG	Intel	IC FPGA 600 I/O 1760FBGA Number of LABs/CLBs: 185000 Number of Logic Elements/Cells: 490000 Total RAM Bits: 41984000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5)	Package: -	Request a Quote
5SGXMA7H3F35C2NCV	Intel	IC FPGA 552 I/O 1152FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 51200000 Number of I/O: 552 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: -	Request a Quote
5SGXMA7K3F40C2WN	Intel	IC FPGA 696 I/O 1517FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 51200000 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	Package: -	Request a Quote
EPM240T100I5NAB	Intel	IC CPLD 192MC 7.5NS 100TQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 7.5 ns Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V Number of Logic Elements/Blocks: 240 Number of Macrocells: 192 Number of Gates: - Number of I/O: 80 Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 100-TQFP Supplier Device Package: 100-TQFP (14x14)	Package: -	Request a Quote
AGFA019R25A1E1V	Intel	IC FPGA AGILEX-F 2581FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.9M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
1SX280LN2F43E2LGAS	Intel	IC FPGA STRATIX 10 1760FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2800K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	Package: -	Request a Quote
5ASXFB3H6F40C6G	Intel	IC SOC CORTEX-A9 700MHZ 1517FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 700MHz Primary Attributes: FPGA - 350K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA, FC (40x40)	Package: -	Request a Quote
AGFB022R31C2E2VB	Intel	IC FPGA AGILEX-F 3184BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.2M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 3184-BFBGA Exposed Pad Supplier Device Package: 3184-BGA (56x45)	Package: -	Request a Quote
EPM1270F256C5NAA	Intel	IC CPLD 980MC 10NS 256FBGA Programmable Type: In System Programmable Delay Time tpd(1) Max: 10 ns Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V Number of Logic Elements/Blocks: 1270 Number of Macrocells: 980 Number of Gates: - Number of I/O: 212 Operating Temperature: 0°C ~ 85°C (TJ) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	Package: -	Request a Quote
1SX210HU3F50I3VGAS	Intel	IC FPGA STRATIX 10 2397FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2100K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50x50)	Package: -	Request a Quote
1SX280HH2F55E2LG	Intel	IC FPGA STRATIX 10 2912FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2800K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2912-BBGA, FCBGA Supplier Device Package: 2912-FBGA, FC (55x55)	Package: -	Request a Quote
AGFA019R24C2E2VB	Intel	IC FPGA AGILEX-F 2340BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.9M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2340-BFBGA Exposed Pad Supplier Device Package: 2340-BGA (45x42)	Package: -	Request a Quote