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Microchip Technology |
PROG OSC 1MHZ-80MHZ CMOS
- Type: MEMS (Silicon)
- Programmable Type: Programmed as Request
- Available Frequency Range: 1MHz ~ 80MHz
- Function: Enable/Disable
- Output: CMOS
- Voltage - Supply: 1.71 V ~ 3.63 V
- Frequency Stability: -
- Frequency Stability (Total): ±25ppm
- Operating Temperature: -40°C ~ 85°C
- Spread Spectrum Bandwidth: -
- Current - Supply (Max): 1.3mA (Typ)
- Ratings: AEC-Q100
- Mounting Type: Surface Mount
- Package / Case: 4-SMD, No Lead
- Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
- Height: 0.035" (0.89mm)
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Package: 4-SMD, No Lead |
Stock5,148 |
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Microchip Technology |
OSC MEMS 80.000MHZ CMOS SMD
- Type: MEMS (Silicon)
- Frequency: 80MHz
- Function: Standby (Power Down)
- Output: CMOS
- Voltage - Supply: 1.8V
- Frequency Stability: ±50ppm
- Operating Temperature: 0°C ~ 70°C
- Current - Supply (Max): 5mA
- Ratings: -
- Mounting Type: Surface Mount
- Package / Case: 4-SMD, No Lead
- Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
- Height - Seated (Max): 0.035" (0.90mm)
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Package: 4-SMD, No Lead |
Stock8,118 |
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Microchip Technology |
OSC MEMS 24.000MHZ CMOS SMD
- Type: MEMS (Silicon)
- Frequency: 24MHz
- Function: Standby (Power Down)
- Output: CMOS
- Voltage - Supply: 1.8 V ~ 3.3 V
- Frequency Stability: ±25ppm
- Operating Temperature: -20°C ~ 70°C
- Current - Supply (Max): 6.3mA
- Ratings: AEC-Q100
- Mounting Type: Surface Mount
- Package / Case: 4-SMD, No Lead Exposed Pad
- Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
- Height - Seated (Max): 0.035" (0.90mm)
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Package: 4-SMD, No Lead Exposed Pad |
Stock8,100 |
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Microchip Technology |
OSC MEMS 27.0000MHZ CMOS SMD
- Type: MEMS (Silicon)
- Frequency: 27MHz
- Function: Enable/Disable
- Output: CMOS
- Voltage - Supply: 1.71 V ~ 3.63 V
- Frequency Stability: ±25ppm
- Operating Temperature: -40°C ~ 85°C
- Current - Supply (Max): 3mA (Typ)
- Ratings: AEC-Q100
- Mounting Type: Surface Mount
- Package / Case: 4-SMD, No Lead
- Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
- Height - Seated (Max): 0.035" (0.90mm)
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Package: 4-SMD, No Lead |
Stock20,316 |
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Microchip Technology |
IC REG LINEAR 1.5V 5A S-PAK-7
- Output Configuration: Positive
- Output Type: Fixed
- Number of Regulators: 1
- Voltage - Input (Max): 6V
- Voltage - Output (Min/Fixed): 1.5V
- Voltage - Output (Max): -
- Voltage Dropout (Max): -
- Current - Output: 5A
- Current - Quiescent (Iq): -
- Current - Supply (Max): 100mA
- PSRR: -
- Control Features: Enable
- Protection Features: Over Current, Over Temperature, Reverse Polarity
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: SPak-7 (7 leads + Tab)
- Supplier Device Package: S-PAK-7
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Package: SPak-7 (7 leads + Tab) |
Stock7,552 |
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Microchip Technology |
IC VOLT DETECTOR TO-92-3
- Type: Simple Reset/Power-On Reset
- Number of Voltages Monitored: 1
- Output: Push-Pull, Totem Pole
- Reset: Active Low
- Reset Timeout: -
- Voltage - Threshold: 6V
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Through Hole
- Package / Case: TO-226-3, TO-92-3 (TO-226AA)
- Supplier Device Package: TO-92-3
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Package: TO-226-3, TO-92-3 (TO-226AA) |
Stock5,856 |
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Microchip Technology |
IC LED DRVR RGLTR DIM 30MA 8DFN
- Type: DC DC Regulator
- Topology: Step-Down (Buck)
- Internal Switch(s): Yes
- Number of Outputs: 1
- Voltage - Supply (Min): 4.5V
- Voltage - Supply (Max): 40V
- Voltage - Output: -
- Current - Output / Channel: 30mA
- Frequency: 2MHz
- Dimming: Analog, PWM
- Applications: Lighting, Signage
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 8-WDFN Exposed Pad
- Supplier Device Package: 8-DFN (3x3)
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Package: 8-WDFN Exposed Pad |
Stock5,616 |
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Microchip Technology |
IC FLASH 8MBIT 70NS 48CBGA
- Memory Type: Non-Volatile
- Memory Format: FLASH
- Technology: FLASH
- Memory Size: 8Mb (512K x 16)
- Memory Interface: Parallel
- Clock Frequency: -
- Write Cycle Time - Word, Page: 120µs
- Access Time: 70ns
- Voltage - Supply: 2.65 V ~ 3.6 V
- Operating Temperature: -40°C ~ 85°C (TC)
- Mounting Type: Surface Mount
- Package / Case: 48-VFBGA, CSBGA
- Supplier Device Package: 48-CBGA (6x8)
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Package: 48-VFBGA, CSBGA |
Stock3,024 |
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Microchip Technology |
IC FLASH 2MBIT 55NS 32TSOP
- Memory Type: Non-Volatile
- Memory Format: FLASH
- Technology: FLASH
- Memory Size: 2Mb (256K x 8)
- Memory Interface: Parallel
- Clock Frequency: -
- Write Cycle Time - Word, Page: 50µs
- Access Time: 55ns
- Voltage - Supply: 4.5 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C (TC)
- Mounting Type: Surface Mount
- Package / Case: 32-TFSOP (0.724", 18.40mm Width)
- Supplier Device Package: 32-TSOP
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Package: 32-TFSOP (0.724", 18.40mm Width) |
Stock4,032 |
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Microchip Technology |
IC OTP 4MBIT 150NS 32VSOP
- Memory Type: Non-Volatile
- Memory Format: EPROM
- Technology: EPROM - OTP
- Memory Size: 4Mb (512K x 8)
- Memory Interface: Parallel
- Clock Frequency: -
- Write Cycle Time - Word, Page: -
- Access Time: 150ns
- Voltage - Supply: 2.7 V ~ 3.6 V, 4.5 V ~ 5.5 V
- Operating Temperature: 0°C ~ 70°C (TC)
- Mounting Type: Surface Mount
- Package / Case: 32-TFSOP (0.488", 12.40mm Width)
- Supplier Device Package: 32-VSOP
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Package: 32-TFSOP (0.488", 12.40mm Width) |
Stock6,528 |
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Microchip Technology |
IC EEPROM 8KBIT 3MHZ 8SOIC
- Memory Type: Non-Volatile
- Memory Format: EEPROM
- Technology: EEPROM
- Memory Size: 8Kb (512 x 16)
- Memory Interface: SPI
- Clock Frequency: 3MHz
- Write Cycle Time - Word, Page: 5ms
- Access Time: -
- Voltage - Supply: 1.8 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SOIC
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock7,136 |
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Microchip Technology |
IC OPAMP GP 10MHZ RRO 8SOIC
- Amplifier Type: General Purpose
- Number of Circuits: 2
- Output Type: Rail-to-Rail
- Slew Rate: 10 V/µs
- Gain Bandwidth Product: 10MHz
- -3db Bandwidth: -
- Current - Input Bias: 10pA
- Voltage - Input Offset: 1mV
- Current - Supply: 2mA
- Current - Output / Channel: 41mA
- Voltage - Supply, Single/Dual (±): 3.5 V ~ 12 V, ±1.75 V ~ 6 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SOIC
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock15,276 |
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Microchip Technology |
IC TRANSCEIVER LIN 8SOIC
- Type: Transceiver
- Protocol: LIN
- Number of Drivers/Receivers: 1/1
- Duplex: Half
- Receiver Hysteresis: -
- Data Rate: 20kBaud
- Voltage - Supply: 5.5 V ~ 30 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SOIC
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock5,600 |
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Microchip Technology |
IC ETHERNET SWITCH 3PORT 64-LQFP
- Protocol: Ethernet
- Function: Switch
- Interface: I2C, SPI
- Standards: 10/100 Base-T/TX PHY
- Voltage - Supply: 1.8V, 2.5V, 3.3V
- Current - Supply: 115mA
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 64-LQFP
- Supplier Device Package: 64-PQFP (10x10)
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Package: 64-LQFP |
Stock5,584 |
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Microchip Technology |
IC MCU 8BIT 16KB FLASH 28SDIP
- Core Processor: PIC
- Core Size: 8-Bit
- Speed: 48MHz
- Connectivity: UART/USART, USB
- Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
- Number of I/O: 23
- Program Memory Size: 16KB (8K x 16)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 768 x 8
- Voltage - Supply (Vcc/Vdd): 2 V ~ 5.5 V
- Data Converters: A/D 10x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 28-DIP (0.300", 7.62mm)
- Supplier Device Package: 28-SPDIP
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Package: 28-DIP (0.300", 7.62mm) |
Stock3,888 |
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Microchip Technology |
IC MCU 16BIT 256KB FLASH 28SSOP
- Core Processor: PIC
- Core Size: 16-Bit
- Speed: 70 MIPs
- Connectivity: I2C, IrDA, LIN, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O: 21
- Program Memory Size: 256KB (85.5K x 24)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 16K x 16
- Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
- Data Converters: A/D 6x10b/12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 28-SSOP (0.209", 5.30mm Width)
- Supplier Device Package: 28-SSOP
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Package: 28-SSOP (0.209", 5.30mm Width) |
Stock5,952 |
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Microchip Technology |
IC MCU 16BIT 16KB FLASH 28QFN
- Core Processor: PIC
- Core Size: 16-Bit
- Speed: 32MHz
- Connectivity: I2C, IrDA, LIN, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
- Number of I/O: 23
- Program Memory Size: 16KB (5.5K x 24)
- Program Memory Type: FLASH
- EEPROM Size: 512 x 8
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 2 V ~ 5 V
- Data Converters: A/D 19x10b/12b, D/A 2x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 28-VQFN Exposed Pad
- Supplier Device Package: 28-QFN (6x6)
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Package: 28-VQFN Exposed Pad |
Stock7,664 |
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Microchip Technology |
IC MCU 8BIT 3.5KB FLASH 14DIP
- Core Processor: PIC
- Core Size: 8-Bit
- Speed: 32MHz
- Connectivity: I2C, LIN, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O: 12
- Program Memory Size: 3.5KB (2K x 14)
- Program Memory Type: FLASH
- EEPROM Size: 256 x 8
- RAM Size: 256 x 8
- Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
- Data Converters: A/D 11x10b, D/A 1x5b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 14-DIP (0.300", 7.62mm)
- Supplier Device Package: 14-PDIP
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Package: 14-DIP (0.300", 7.62mm) |
Stock3,920 |
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Microchip Technology |
IC MCU 32BIT 128KB FLASH 64WLCSP
- Core Processor: ARM? Cortex?-M0+
- Core Size: 32-Bit
- Speed: 48MHz
- Connectivity: I2C, LIN, SCI, SPI, UART/USART, USB
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 51
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 16K x 8
- Voltage - Supply (Vcc/Vdd): 1.62 V ~ 3.63 V
- Data Converters: A/D 20x12b, D/A 2x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 64-XFBGA, WLCSP
- Supplier Device Package: 64-WLCSP
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Package: 64-XFBGA, WLCSP |
Stock5,056 |
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Microchip Technology |
IC MCU 8BIT 32KB FLASH 40DIP
- Core Processor: PIC
- Core Size: 8-Bit
- Speed: 64MHz
- Connectivity: I2C, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
- Number of I/O: 35
- Program Memory Size: 32KB (16K x 16)
- Program Memory Type: FLASH
- EEPROM Size: 256 x 8
- RAM Size: 1.5K x 8
- Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
- Data Converters: A/D 14x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 40-DIP (0.600", 15.24mm)
- Supplier Device Package: 40-PDIP
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Package: 40-DIP (0.600", 15.24mm) |
Stock7,456 |
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Microchip Technology |
IC CLK BUFFER 1:2 3GHZ 8MSOP
- Type: Fanout Buffer (Distribution)
- Number of Circuits: 1
- Ratio - Input:Output: 1:2
- Differential - Input:Output: Yes/Yes
- Input: LVECL, LVPECL
- Output: LVECL, LVPECL
- Frequency - Max: 3GHz
- Voltage - Supply: 2.375 V ~ 5.5 V
- Operating Temperature: 0°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Supplier Device Package: 8-MSOP
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Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock37,164 |
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Microchip Technology |
STD RECTIFIER
- Diode Type: -
- Voltage - DC Reverse (Vr) (Max): -
- Current - Average Rectified (Io): -
- Voltage - Forward (Vf) (Max) @ If: -
- Speed: -
- Reverse Recovery Time (trr): -
- Current - Reverse Leakage @ Vr: -
- Capacitance @ Vr, F: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
- Operating Temperature - Junction: -
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Package: - |
Request a Quote |
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Microchip Technology |
BRIDGE RECTIFIER
- Diode Type: Three Phase
- Technology: Standard
- Voltage - Peak Reverse (Max): 50 V
- Current - Average Rectified (Io): 25 A
- Voltage - Forward (Vf) (Max) @ If: 950 mV @ 6 A
- Current - Reverse Leakage @ Vr: 10 µA @ 50 V
- Operating Temperature: -65°C ~ 150°C (TJ)
- Mounting Type: Chassis Mount
- Package / Case: ME
- Supplier Device Package: ME
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Package: - |
Request a Quote |
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Microchip Technology |
VOLTAGE REGULATOR
- Voltage - Zener (Nom) (Vz): -
- Tolerance: -
- Power - Max: -
- Impedance (Max) (Zzt): -
- Current - Reverse Leakage @ Vr: -
- Voltage - Forward (Vf) (Max) @ If: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Microchip Technology |
DIODE GEN PURP 200V 3A D-5B
- Diode Type: Standard
- Voltage - DC Reverse (Vr) (Max): 200 V
- Current - Average Rectified (Io): 3A
- Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 9 A
- Speed: Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr): 150 ns
- Current - Reverse Leakage @ Vr: 1 µA @ 200 V
- Capacitance @ Vr, F: -
- Mounting Type: Surface Mount
- Package / Case: SQ-MELF, E
- Supplier Device Package: D-5B
- Operating Temperature - Junction: -65°C ~ 175°C
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Package: - |
Request a Quote |
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Microchip Technology |
14KB FLASH, 1024B RAM, 10B ADC,
- Core Processor: PIC
- Core Size: 8-Bit
- Speed: 32MHz
- Connectivity: I2C, LINbus, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O: 5
- Program Memory Size: 14KB (14K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
- Data Converters: A/D 10x10b SAR; D/A 1x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Through Hole
- Package / Case: 8-DIP (0.300", 7.62mm)
- Supplier Device Package: 8-PDIP
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Package: - |
Stock2,160 |
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Microchip Technology |
DIODE GEN PURP 200V 1A A AXIAL
- Diode Type: Standard
- Voltage - DC Reverse (Vr) (Max): 200 V
- Current - Average Rectified (Io): 1A
- Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 500 mA
- Speed: Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr): 250 ns
- Current - Reverse Leakage @ Vr: 3 µA @ 200 V
- Capacitance @ Vr, F: 80pF @ 0V, 1MHz
- Mounting Type: Through Hole
- Package / Case: A, Axial
- Supplier Device Package: A, Axial
- Operating Temperature - Junction: -65°C ~ 175°C
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Package: - |
Request a Quote |
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Microchip Technology |
TRANS NPN 100V 0.5A U4
- Transistor Type: NPN
- Current - Collector (Ic) (Max): 500 mA
- Voltage - Collector Emitter Breakdown (Max): 100 V
- Vce Saturation (Max) @ Ib, Ic: 600mV @ 30mA, 300mA
- Current - Collector Cutoff (Max): 50nA (ICBO)
- DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 150mA, 10V
- Power - Max: 1 W
- Frequency - Transition: -
- Operating Temperature: -65°C ~ 200°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 3-SMD, No Lead
- Supplier Device Package: U4
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Package: - |
Request a Quote |
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