|
|
NXP |
FET RF 2CH 70V 960MHZ NI-1230HS
- Transistor Type: LDMOS (Dual)
- Frequency: 960MHz
- Gain: 19.4dB
- Voltage - Test: 28V
- Current Rating: -
- Noise Figure: -
- Current - Test: 2.4A
- Power - Output: 100W
- Voltage - Rated: 70V
- Package / Case: NI-1230S
- Supplier Device Package: NI-1230S
|
Package: NI-1230S |
Stock6,896 |
|
|
|
NXP |
FET RF 66V 880MHZ NI-880S
- Transistor Type: LDMOS
- Frequency: 880MHz
- Gain: 21dB
- Voltage - Test: 28V
- Current Rating: -
- Noise Figure: -
- Current - Test: 1.4A
- Power - Output: 58W
- Voltage - Rated: 66V
- Package / Case: NI-880S
- Supplier Device Package: NI-880S
|
Package: NI-880S |
Stock5,632 |
|
|
|
NXP |
IC REG LINEAR 2.1V 300MA UNCASED
- Output Configuration: Positive
- Output Type: Fixed
- Number of Regulators: 1
- Voltage - Input (Max): 5.5V
- Voltage - Output (Min/Fixed): 2.1V
- Voltage - Output (Max): -
- Voltage Dropout (Max): 0.16V @ 300mA
- Current - Output: 300mA
- Current - Quiescent (Iq): -
- Current - Supply (Max): 100µA ~ 250µA
- PSRR: 55dB (1kHz)
- Control Features: Enable
- Protection Features: Over Current, Over Temperature
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 4-XFBGA
- Supplier Device Package: -
|
Package: 4-XFBGA |
Stock6,208 |
|
|
|
NXP |
IC LCD DRIVER UNIV 56TSSOP
- Display Type: LCD
- Configuration: 176 Segment
- Interface: I2C
- Digits or Characters: -
- Current - Supply: 30µA
- Voltage - Supply: 1.8 V ~ 5.5 V
- Operating Temperature: -40°C ~ 95°C
- Mounting Type: Surface Mount
- Package / Case: 56-TFSOP (0.240", 6.10mm Width)
- Supplier Device Package: 56-TSSOP
|
Package: 56-TFSOP (0.240", 6.10mm Width) |
Stock17,790 |
|
|
|
NXP |
IC SBC CAN/LIN HS 3.3V 32HTSSOP
- Applications: Automotive
- Interface: CAN, LIN
- Voltage - Supply: 4.5 V ~ 28 V
- Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
- Supplier Device Package: 32-HTSSOP
- Mounting Type: Surface Mount
|
Package: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad |
Stock3,088 |
|
|
|
NXP |
IC I2C MUX 2CH 14-SOIC
- Applications: 2-Channel I2C Multiplexer
- Interface: I2C
- Voltage - Supply: 2.3 V ~ 5.5 V
- Package / Case: 14-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 14-SO
- Mounting Type: Surface Mount
|
Package: 14-SOIC (0.154", 3.90mm Width) |
Stock24,642 |
|
|
|
NXP |
IC CAN TRANSCEIVER HS 8-SOIC
- Type: Transceiver
- Protocol: CAN
- Number of Drivers/Receivers: 1/1
- Duplex: Half
- Receiver Hysteresis: 70mV
- Data Rate: -
- Voltage - Supply: 4.75 V ~ 5.25 V
- Operating Temperature: -40°C ~ 150°C
- Mounting Type: Surface Mount
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SO
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock3,728 |
|
|
|
NXP |
IC MPU MPC83XX 533MHZ 689TEBGA
- Core Processor: PowerPC e300c4s
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 533MHz
- Co-Processors/DSP: Security; SEC 3.0
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: SATA 3Gbps (2)
- USB: USB 2.0 + PHY (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 125°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 689-BBGA Exposed Pad
- Supplier Device Package: 689-TEPBGA II (31x31)
|
Package: 689-BBGA Exposed Pad |
Stock6,800 |
|
|
|
NXP |
IC MPU MPC8XX 50MHZ 357BGA
- Core Processor: MPC8xx
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 50MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (4)
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: -40°C ~ 95°C (TA)
- Security Features: -
- Package / Case: 357-BBGA
- Supplier Device Package: 357-PBGA (25x25)
|
Package: 357-BBGA |
Stock5,808 |
|
|
|
NXP |
IC MPU MPC85XX 667MHZ 783FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 667MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DDR, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: -
- USB: USB 2.0 (1)
- Voltage - I/O: 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
|
Package: 783-BBGA, FCBGA |
Stock7,488 |
|
|
|
NXP |
IC MPU MPC8XX 66MHZ 357BGA
- Core Processor: MPC8xx
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 66MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (4)
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: -40°C ~ 95°C (TA)
- Security Features: -
- Package / Case: 357-BBGA
- Supplier Device Package: 357-PBGA (25x25)
|
Package: 357-BBGA |
Stock6,848 |
|
|
|
NXP |
IC MPU I.MX6D 1.0GHZ 624FCBGA
- Core Processor: ARM? Cortex?-A9
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 1.0GHz
- Co-Processors/DSP: Multimedia; NEON? SIMD
- RAM Controllers: LPDDR2, LVDDR3, DDR3
- Graphics Acceleration: Yes
- Display & Interface Controllers: Keypad, LCD
- Ethernet: 10/100/1000 Mbps (1)
- SATA: SATA 3Gbps (1)
- USB: USB 2.0 + PHY (4)
- Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature: -40°C ~ 125°C (TJ)
- Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Package / Case: 624-FBGA, FCBGA
- Supplier Device Package: 624-FCBGA (21x21)
|
Package: 624-FBGA, FCBGA |
Stock2,768 |
|
|
|
NXP |
IC MCU 32BIT 512KB FLASH 388BGA
- Core Processor: PowerPC
- Core Size: 32-Bit
- Speed: 56MHz
- Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
- Peripherals: POR, PWM, WDT
- Number of I/O: 56
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 2.5 V ~ 2.7 V
- Data Converters: A/D 32x10b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 388-BBGA
- Supplier Device Package: 388-PBGA (27x27)
|
Package: 388-BBGA |
Stock5,696 |
|
|
|
NXP |
IC MCU 8BIT 7.5KB FLASH 28SOIC
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: SCI, SPI
- Peripherals: LVD, POR, PWM
- Number of I/O: 17
- Program Memory Size: 7.5KB (7.5K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 384 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 6x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 28-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 28-SOIC
|
Package: 28-SOIC (0.295", 7.50mm Width) |
Stock7,824 |
|
|
|
NXP |
IC MCU 16BIT 256KB FLASH 112LQFP
- Core Processor: HCS12
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: CAN, EBI/EMI, I2C, SCI, SPI
- Peripherals: LCD, Motor control PWM, POR, PWM, WDT
- Number of I/O: 85
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 12K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
- Data Converters: A/D 16x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 112-LQFP
- Supplier Device Package: 112-LQFP (20x20)
|
Package: 112-LQFP |
Stock33,528 |
|
|
|
NXP |
IC MCU 8BIT 32KB FLASH 64QFP
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: SCI, SPI
- Peripherals: POR, PWM
- Number of I/O: 51
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 512 x 8
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Data Converters: A/D 8x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 64-QFP
- Supplier Device Package: 64-QFP (14x14)
|
Package: 64-QFP |
Stock4,160 |
|
|
|
NXP |
IC MCU 32BIT 128KB FLASH 121BGA
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 72MHz
- Connectivity: EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
- Peripherals: DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O: 63
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 36x16b, D/A 1x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 121-LFBGA
- Supplier Device Package: 121-MAPBGA (8x8)
|
Package: 121-LFBGA |
Stock6,672 |
|
|
|
NXP |
IC DRVR INJECTOR/IGN 100LQFP
- Applications: Engine Control
- Core Processor: S12P
- Program Memory Type: FLASH (128 kB)
- Controller Series: HCS12
- RAM Size: 6K x 8
- Interface: CAN, SCI, SPI
- Number of I/O: 8
- Voltage - Supply: 4.7 V ~ 36 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 100-LQFP Exposed Pad
- Supplier Device Package: 100-LQFP-EP (14x14)
|
Package: 100-LQFP Exposed Pad |
Stock6,016 |
|
|
|
NXP |
IC PAR-IN PLL FREQ SYNTH 28-SOIC
- Type: PLL Clock/Frequency Synthesizer
- PLL: Yes
- Input: Clock
- Output: CMOS
- Number of Circuits: 1
- Ratio - Input:Output: 1:1
- Differential - Input:Output: No/No
- Frequency - Max: 25MHz
- Divider/Multiplier: Yes/No
- Voltage - Supply: 3 V ~ 9 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 28-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 28-SOIC
|
Package: 28-SOIC (0.295", 7.50mm Width) |
Stock21,120 |
|
|
|
NXP |
SENSOR DIFF PRESS 14.5PSI MAX
- Pressure Type: Differential
- Operating Pressure: 14.5 PSI (100 kPa)
- Output Type: Wheatstone Bridge
- Output: 0 mV ~ 40 mV (10V)
- Accuracy: -0.6% ~ 0.4%
- Voltage - Supply: 10 V ~ 16 V
- Port Size: -
- Port Style: No Port
- Features: Temperature Compensated
- Termination Style: PCB
- Maximum Pressure: 58.02 PSI (400 kPa)
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 4-SIP Module
- Supplier Device Package: -
|
Package: 4-SIP Module |
Stock3,528 |
|
|
|
NXP |
SENSOR IC TOUCH/PROXMTY 24SOIC
- Amplifier Type: -
- Voltage - Supply: -
- Output Type: -
- Current - Supply: -
- Operating Temperature: -
- Mounting Type: -
|
Package: - |
Stock3,546 |
|
|
|
NXP |
SYSTEM BASIS CHIP DCDC 1.5A VCO
- Applications: System Basis Chip
- Current - Supply: -
- Voltage - Supply: -1.0 V ~ 40 V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-LQFP (7x7)
|
Package: 48-LQFP Exposed Pad |
Stock7,104 |
|
|
|
NXP |
S32K144 32-BIT MCU ARM CORTEX-M
- Core Processor: ARM® Cortex®-M4F
- Core Size: 32-Bit
- Speed: 112MHz
- Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
- Peripherals: POR, PWM, WDT
- Number of I/O: -
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 16x12b, D/A 1x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
|
Package: 64-LQFP |
Stock4,864 |
|
|
|
NXP |
IC MCU 8BIT 8KB FLASH 16TSSOP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 20MHz
- Connectivity: LINbus, SCI
- Peripherals: LVD, PWM, WDT
- Number of I/O: 14
- Program Memory Size: 8KB (8K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
- Data Converters: A/D 8x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 16-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 16-TSSOP
|
Package: 16-TSSOP (0.173", 4.40mm Width) |
Stock11,532 |
|
|
|
NXP |
IC MCU 32BIT 256KB FLSH 100LQFP
- Core Processor: ARM® Cortex®-M33
- Core Size: 32-Bit Single-Core
- Speed: 150MHz
- Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
- Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
- Number of I/O: 64
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 96K x 8
- Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
- Data Converters: A/D 10x16b SAR
- Oscillator Type: External, Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 100-LQFP Exposed Pad
- Supplier Device Package: 100-HLQFP (14x14)
|
Package: - |
Request a Quote |
|
|
|
NXP |
IC MCU 16BIT 16KB FLASH 32LQFP
- Core Processor: S12
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: IrDA, LINbus, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 26
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 512 x 8
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
|
Package: - |
Request a Quote |
|
|
|
NXP |
S12Z CPU, 64K FLASH
- Core Processor: -
- Core Size: -
- Speed: -
- Connectivity: -
- Peripherals: -
- Number of I/O: -
- Program Memory Size: -
- Program Memory Type: -
- EEPROM Size: -
- RAM Size: -
- Voltage - Supply (Vcc/Vdd): -
- Data Converters: -
- Oscillator Type: -
- Operating Temperature: -
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
|
Package: - |
Request a Quote |
|
|
|
NXP |
S12Z, 48LQFP, 192K FLASH
- Core Processor: S12Z
- Core Size: 16-Bit
- Speed: 32MHz
- Connectivity: CANbus, I2C, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 28
- Program Memory Size: 192KB (192K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 12K x 8
- Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
- Data Converters: A/D 10x12b SAR; D/A 1x8b
- Oscillator Type: External, Internal
- Operating Temperature: -40°C ~ 150°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
|
Package: - |
Request a Quote |
|