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NXP |
JFET N-CH 40V 250MW SOT23
- FET Type: N-Channel
- Voltage - Breakdown (V(BR)GSS): 40V
- Drain to Source Voltage (Vdss): 40V
- Current - Drain (Idss) @ Vds (Vgs=0): 20mA @ 15V
- Current Drain (Id) - Max: -
- Voltage - Cutoff (VGS off) @ Id: 5V @ 0.5nA
- Input Capacitance (Ciss) (Max) @ Vds: -
- Resistance - RDS(On): 40 Ohm
- Power - Max: 250mW
- Operating Temperature: 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Supplier Device Package: SOT-23 (TO-236AB)
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Package: TO-236-3, SC-59, SOT-23-3 |
Stock2,432 |
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NXP |
FET RF 15V 3.55GHZ 1.5-PLD
- Transistor Type: pHEMT FET
- Frequency: 3.55GHz
- Gain: 10dB
- Voltage - Test: 12V
- Current Rating: -
- Noise Figure: -
- Current - Test: 180mA
- Power - Output: 9W
- Voltage - Rated: 15V
- Package / Case: PLD-1.5
- Supplier Device Package: PLD-1.5
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Package: PLD-1.5 |
Stock5,184 |
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NXP |
IC COPROCESSOR FLOAT PT 68-PGA
- Type: Floating-Point Co-Processor
- Applications: -
- Mounting Type: Through Hole
- Package / Case: 68-BCPGA
- Supplier Device Package: 68-PGA (27x27)
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Package: 68-BCPGA |
Stock5,952 |
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NXP |
IC VREF SHUNT ADJ SOT23-3
- Reference Type: Shunt
- Output Type: Adjustable
- Voltage - Output (Min/Fixed): 1.24V
- Voltage - Output (Max): 18V
- Current - Output: 70mA
- Tolerance: ±1%
- Temperature Coefficient: -
- Noise - 0.1Hz to 10Hz: -
- Noise - 10Hz to 10kHz: -
- Voltage - Input: -
- Current - Supply: -
- Current - Cathode: 80µA
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Supplier Device Package: TO-236AB (SOT23)
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Package: TO-236-3, SC-59, SOT-23-3 |
Stock5,712 |
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NXP |
IC SWITCH SERIAL OCTAL 24-SOIC
- Switch Type: General Purpose
- Number of Outputs: 8
- Ratio - Input:Output: 1:8
- Output Configuration: Low Side
- Output Type: N-Channel
- Interface: SPI
- Voltage - Load: 9 V ~ 26.5 V
- Voltage - Supply (Vcc/Vdd): 2.5 V ~ 4.5 V
- Current - Output (Max): 1A
- Rds On (Typ): 350 mOhm
- Input Type: -
- Features: -
- Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
- Operating Temperature: -40°C ~ 150°C (TJ)
- Package / Case: 24-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 24-SOIC
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Package: 24-SOIC (0.295", 7.50mm Width) |
Stock9,240 |
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NXP |
IC LED DRIVER OFFL DIM 2A 12SO
- Type: AC DC Offline Switcher
- Topology: Step-Down (Buck), Step-Up (Boost)
- Internal Switch(s): Yes
- Number of Outputs: 1
- Voltage - Supply (Min): 8V
- Voltage - Supply (Max): 16V
- Voltage - Output: 300V
- Current - Output / Channel: 2A (Switch)
- Frequency: -
- Dimming: Triac
- Applications: Lighting
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 14-SOIC (0.154", 3.90mm Width) 12 Leads
- Supplier Device Package: 12-SO
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Package: 14-SOIC (0.154", 3.90mm Width) 12 Leads |
Stock3,344 |
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NXP |
IC XLATR BI-DIREC 24-TSSOP
- Translator Type: Mixed Signal
- Channel Type: Bidirectional
- Number of Circuits: 1
- Channels per Circuit: 8
- Voltage - VCCA: -
- Voltage - VCCB: -
- Input Signal: LVTTL
- Output Signal: GTL
- Output Type: Non-Inverted
- Data Rate: -
- Operating Temperature: -40°C ~ 85°C (TA)
- Features: -
- Mounting Type: Surface Mount
- Package / Case: 24-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 24-TSSOP
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Package: 24-TSSOP (0.173", 4.40mm Width) |
Stock2,992 |
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NXP |
IC BUS SWITCH 8BIT 20-SSOP
- Type: Bus Switch
- Circuit: 4 x 1:1
- Independent Circuits: 2
- Current - Output High, Low: -
- Voltage Supply Source: Single Supply
- Voltage - Supply: 2.3 V ~ 3.6 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 20-SSOP (0.154", 3.90mm Width)
- Supplier Device Package: 20-SSOP
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Package: 20-SSOP (0.154", 3.90mm Width) |
Stock5,712 |
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NXP |
IC AMP AUDIO PWR 40W QUAD 23SIL
- Type: Class B
- Output Type: 4-Channel (Quad)
- Max Output Power x Channels @ Load: 40W x 4 @ 2 Ohm
- Voltage - Supply: 6 V ~ 18 V
- Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
- Mounting Type: Through Hole
- Operating Temperature: -40°C ~ 85°C (TA)
- Supplier Device Package: DBS23P
- Package / Case: 23-SIP Formed Leads
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Package: 23-SIP Formed Leads |
Stock5,856 |
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NXP |
IC MPU MPC8XX 66MHZ 357BGA
- Core Processor: MPC8xx
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 66MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (4), 10/100 Mbps (1)
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: -40°C ~ 95°C (TA)
- Security Features: -
- Package / Case: 357-BBGA
- Supplier Device Package: 357-PBGA (25x25)
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Package: 357-BBGA |
Stock2,864 |
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NXP |
IC MPU MPC74XX 1.25GHZ 360FCCBGA
- Core Processor: PowerPC G4
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.25GHz
- Co-Processors/DSP: Multimedia; SIMD
- RAM Controllers: -
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 1.5V, 1.8V, 2.5V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 360-CBGA, FCCBGA
- Supplier Device Package: 360-FCCBGA (25x25)
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Package: 360-CBGA, FCCBGA |
Stock5,520 |
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NXP |
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
- Core Processor: ARM? Cortex?-A9
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.0GHz
- Co-Processors/DSP: Multimedia; NEON? SIMD
- RAM Controllers: LPDDR2, LVDDR3, DDR3
- Graphics Acceleration: Yes
- Display & Interface Controllers: Keypad, LCD
- Ethernet: 10/100 Mbps (1)
- SATA: -
- USB: USB 2.0 + PHY (3)
- Voltage - I/O: 1.2V, 1.8V, 3.0V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Package / Case: 432-TFBGA
- Supplier Device Package: 432-MAPBGA (13x13)
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Package: 432-TFBGA |
Stock6,272 |
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NXP |
IC MCU 32BIT 512KB FLASH 144BGA
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 100MHz
- Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
- Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
- Number of I/O: 102
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 46x16b, D/A 2x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 144-LBGA
- Supplier Device Package: 144-MAPBGA (13x13)
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Package: 144-LBGA |
Stock4,608 |
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NXP |
IC MCU 32BIT 1MB FLASH 176LQFP
- Core Processor: e200z0h
- Core Size: 32-Bit
- Speed: 64MHz
- Connectivity: CAN, I2C, LIN, SCI, SPI
- Peripherals: POR, PWM, WDT
- Number of I/O: 149
- Program Memory Size: 1MB (1M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 16
- RAM Size: 80K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
- Data Converters: A/D 29x10b, 5x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 176-LQFP
- Supplier Device Package: 176-LQFP (24x24)
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Package: 176-LQFP |
Stock2,816 |
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NXP |
IC MCU 8BIT ROMLESS 52PLCC
- Core Processor: HC11
- Core Size: 8-Bit
- Speed: 3MHz
- Connectivity: SCI, SPI
- Peripherals: POR, WDT
- Number of I/O: 38
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: 512 x 8
- RAM Size: 256 x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Data Converters: A/D 8x8b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 52-LCC (J-Lead)
- Supplier Device Package: 52-PLCC (19.1x19.1)
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Package: 52-LCC (J-Lead) |
Stock5,664 |
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NXP |
IC MCU 16BIT 128KB FLASH 112LQFP
- Core Processor: HCS12
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: CAN, I2C, SCI, SPI
- Peripherals: POR, PWM, WDT
- Number of I/O: 91
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 1K x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
- Data Converters: A/D 16x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 112-LQFP
- Supplier Device Package: 112-LQFP (20x20)
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Package: 112-LQFP |
Stock7,536 |
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NXP |
IC MCU 32BIT 4MB FLASH 256MAPBGA
- Core Processor: e200z2, e200z4
- Core Size: 32-Bit Dual-Core
- Speed: 80MHz/160MHz
- Connectivity: CAN, Ethernet, I2C, LIN, SAI, SPI, USB, USB OTG
- Peripherals: DMA, LVD, POR, WDT
- Number of I/O: 178
- Program Memory Size: 4MB (4M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 80x10b, 64x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 256-LBGA
- Supplier Device Package: 256-MAPPBGA (17x17)
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Package: 256-LBGA |
Stock4,560 |
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NXP |
IC MCU 32BIT 128KB FLASH 144LQFP
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 120MHz
- Connectivity: CAN, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
- Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
- Number of I/O: -
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 40K x 8
- Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
- Data Converters: A/D 8x12b, D/A 1x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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Package: 144-LQFP |
Stock3,984 |
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NXP |
IC MCU 32BIT 64KB FLASH 64LQFP
- Core Processor: ARM? Cortex?-M0+
- Core Size: 32-Bit
- Speed: 40MHz
- Connectivity: I2C, LIN, SPI, UART/USART
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 57
- Program Memory Size: 64KB (64K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 256 x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 16x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
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Package: 64-LQFP |
Stock7,328 |
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NXP |
IC MCU 32BIT 8KB FLASH 16TSSOP
- Core Processor: ARM? Cortex?-M0+
- Core Size: 32-Bit
- Speed: 48MHz
- Connectivity: I2C, LIN, SPI, UART/USART
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 14
- Program Memory Size: 8KB (8K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 12x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 16-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 16-TSSOP
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Package: 16-TSSOP (0.173", 4.40mm Width) |
Stock12,228 |
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NXP |
ACCELEROMETER PSI5 16QFN
- Type: -
- Axis: -
- Acceleration Range: -
- Sensitivity (LSB/g): -
- Sensitivity (mV/g): -
- Bandwidth: -
- Output Type: -
- Voltage - Supply: -
- Features: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock3,312 |
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NXP |
ACCELEROMETER 60G PCM/SPI 16QFN
- Type: Digital
- Axis: Z
- Acceleration Range: ±60g
- Sensitivity (LSB/g): 8
- Sensitivity (mV/g): -
- Bandwidth: -
- Output Type: PCM, SPI
- Voltage - Supply: 4.2 V ~ 17 V
- Features: Selectable Low Pass Filter
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 16-QFN Exposed Pad
- Supplier Device Package: 16-QFN (6x6)
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Package: 16-QFN Exposed Pad |
Stock5,958 |
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NXP |
IC MIXER 150MHZ UP CONVRT 20SSOP
- RF Type: Cellular, ASK, FSK, NAMPS, NTACS, VHF
- Frequency: 150MHz
- Number of Mixers: 2
- Gain: 17dB
- Noise Figure: 6.2dB
- Secondary Attributes: Up Converter
- Current - Supply: 4.2mA
- Voltage - Supply: 2.7 V ~ 7 V
- Package / Case: 20-LSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 20-SSOP
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Package: 20-LSSOP (0.173", 4.40mm Width) |
Stock3,562 |
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NXP |
FLASH-BASED LOW-POWER DISPLAYPOR
- Applications: DisplayPort
- Interface: -
- Voltage - Supply: 2.8 V ~ 3.6 V
- Package / Case: -
- Supplier Device Package: -
- Mounting Type: -
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Package: - |
Stock2,560 |
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NXP |
I.MX6SX ROM PERF ENHAN
- Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 200MHz, 800MHz
- Co-Processors/DSP: Multimedia; NEON™ MPE
- RAM Controllers: LPDDR2, LVDDR3, DDR3
- Graphics Acceleration: Yes
- Display & Interface Controllers: Keypad, LCD, LVDS
- Ethernet: 10/100/1000 Mbps (2)
- SATA: -
- USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
- Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
- Operating Temperature: -40°C ~ 125°C (TJ)
- Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
- Package / Case: 529-LFBGA
- Supplier Device Package: 529-MAPBGA (19x19)
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Package: 529-LFBGA |
Stock7,056 |
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NXP |
NXP 32-BIT MCU POWER ARCH CORE
- Core Processor: e200z0h
- Core Size: 32-Bit
- Speed: 64MHz
- Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 108
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 40K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 30x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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Package: 144-LQFP |
Stock5,696 |
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NXP |
RF MOSFET HEMT 50V NI400
- Transistor Type: HEMT
- Frequency: 30MHz ~ 2.2GHz
- Gain: 18.4dB
- Voltage - Test: 50 V
- Current Rating: -
- Noise Figure: -
- Current - Test: 200 mA
- Power - Output: 125W
- Voltage - Rated: 150 V
- Package / Case: NI-400S-2S
- Supplier Device Package: NI-400S-2S
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Package: - |
Stock3 |
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NXP |
IC MCU 32BIT 1MB FLASH 100MAPBGA
- Core Processor: ARM® Cortex®-M4F
- Core Size: 32-Bit Single-Core
- Speed: 80MHz
- Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
- Peripherals: POR, PWM, WDT
- Number of I/O: 89
- Program Memory Size: 1MB (1M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 128K x 8
- Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
- Data Converters: A/D 24x12b SAR; D/A1x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 100-LFBGA
- Supplier Device Package: 100-MAPBGA (11x11)
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Package: - |
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