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NXP |
FET RF 125V 2.5GHZ NI360
- Transistor Type: HEMT
- Frequency: 2.5GHz
- Gain: 18dB
- Voltage - Test: 50V
- Current Rating: -
- Noise Figure: -
- Current - Test: 350mA
- Power - Output: 125W
- Voltage - Rated: 125V
- Package / Case: NI-360H-2SB
- Supplier Device Package: NI-360H-2SB
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Package: NI-360H-2SB |
Stock4,000 |
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NXP |
TRIAC TO92-3
- Triac Type: Standard
- Voltage - Off State: -
- Current - On State (It (RMS)) (Max): -
- Voltage - Gate Trigger (Vgt) (Max): -
- Current - Non Rep. Surge 50, 60Hz (Itsm): -
- Current - Gate Trigger (Igt) (Max): -
- Current - Hold (Ih) (Max): -
- Configuration: Single
- Operating Temperature: -
- Mounting Type: Through Hole
- Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
- Supplier Device Package: TO-92-3
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Package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) |
Stock2,240 |
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NXP |
IC ADDRESS DVR 18-36BIT 80TSSOP
- Logic Type: Address Driver
- Number of Elements: 1
- Number of Bits per Element: 1:2
- Input Type: -
- Output Type: Push-Pull
- Current - Output High, Low: 24mA, 24mA
- Voltage - Supply: 2.3 V ~ 3.6 V
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 80-TFSOP (0.240", 6.10mm Width)
- Supplier Device Package: 80-TSSOP
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Package: 80-TFSOP (0.240", 6.10mm Width) |
Stock7,872 |
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NXP |
IC I2C SWITCH 8CH 24-TSSOP
- Applications: Translating Switch
- Interface: I2C, SMBus
- Voltage - Supply: 2.3 V ~ 3.6 V, 4.5 V ~ 5.5 V
- Package / Case: 24-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 24-TSSOP
- Mounting Type: Surface Mount
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Package: 24-TSSOP (0.173", 4.40mm Width) |
Stock20,532 |
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NXP |
IC REDRIVER I2C 1CH 8TSSOP
- Type: Buffer, ReDriver
- Applications: I2C
- Input: 2-Wire Bus
- Output: 2-Wire Bus
- Data Rate (Max): 400kHz
- Number of Channels: 1
- Delay Time: -
- Signal Conditioning: -
- Capacitance - Input: 6pF
- Voltage - Supply: 3 V ~ 3.6 V
- Current - Supply: 2.3mA
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: -
- Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Supplier Device Package: 8-TSSOP
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Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock7,712 |
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NXP |
IC MPU MPC85XX 800MHZ 783FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: -
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: SATA 3Gbps (1)
- USB: USB 2.0 (2)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 783-BBGA, FCBGA |
Stock2,368 |
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NXP |
IC MPU MPC85XX 1.0GHZ 783FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.0GHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DDR, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: -
- USB: USB 2.0 (1)
- Voltage - I/O: 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 783-BBGA, FCBGA |
Stock4,960 |
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NXP |
IC MPU MPC8XX 50MHZ 357BGA
- Core Processor: MPC8xx
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 50MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (4), 10/100 Mbps (1)
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: -40°C ~ 95°C (TA)
- Security Features: -
- Package / Case: 357-BBGA
- Supplier Device Package: 357-PBGA (25x25)
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Package: 357-BBGA |
Stock2,192 |
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NXP |
IC MPU I.MC6UL 528MHZ 272BGA
- Core Processor: ARM? Cortex?-A7
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 528MHz
- Co-Processors/DSP: Multimedia; NEON? SIMD
- RAM Controllers: LPDDR2, DDR3, DDR3L
- Graphics Acceleration: No
- Display & Interface Controllers: LCD, LVDS
- Ethernet: 10/100 Mbps (2)
- SATA: -
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TJ)
- Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock3,952 |
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NXP |
IC MCU 8BIT 16KB FLASH 28TSSOP
- Core Processor: 8051
- Core Size: 8-Bit
- Speed: 18MHz
- Connectivity: I2C, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
- Number of I/O: 26
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 512 x 8
- RAM Size: 768 x 8
- Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
- Data Converters: A/D 8x8b; D/A 2x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 28-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 28-TSSOP
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Package: 28-TSSOP (0.173", 4.40mm Width) |
Stock3,728 |
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NXP |
IC MCU 8BIT 60KB FLASH 32LQFP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: CAN, I2C, LIN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 25
- Program Memory Size: 60KB (60K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 3K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 10x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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Package: 32-LQFP |
Stock3,984 |
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NXP |
IC MCU 8BIT 60KB FLASH 48LQFP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: I2C, LIN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 39
- Program Memory Size: 60KB (60K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 16x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP |
Stock4,224 |
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NXP |
IC MCU 8BIT 16KB FLASH 32LQFP
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: LIN, SCI, SPI
- Peripherals: POR, PWM
- Number of I/O: 24
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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Package: 32-LQFP |
Stock73,896 |
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NXP |
IC MCU 8BIT ROMLESS 68PLCC
- Core Processor: 8051
- Core Size: 8-Bit
- Speed: 16MHz
- Connectivity: CAN, EBI/EMI, UART/USART
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 48
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 512 x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 68-LCC (J-Lead)
- Supplier Device Package: 68-PLCC (24.23x24.23)
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Package: 68-LCC (J-Lead) |
Stock5,392 |
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NXP |
IC MCU 16BIT 128KB FLASH 80QFP
- Core Processor: HCS12
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: CAN, I2C, SCI, SPI
- Peripherals: PWM, WDT
- Number of I/O: 59
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
- Data Converters: A/D 16x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 80-QFP
- Supplier Device Package: 80-QFP (14x14)
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Package: 80-QFP |
Stock6,576 |
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NXP |
TVS DIODE 8VC SOT886
- Type: Steering (Rail to Rail)
- Unidirectional Channels: 2
- Bidirectional Channels: -
- Voltage - Reverse Standoff (Typ): -
- Voltage - Breakdown (Min): 6V
- Voltage - Clamping (Max) @ Ipp: 8V (Typ)
- Current - Peak Pulse (10/1000µs): -
- Power - Peak Pulse: -
- Power Line Protection: Yes
- Applications: HDMI
- Capacitance @ Frequency: -
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 6-XFDFN
- Supplier Device Package: 6-XSON, SOT886 (1.45x1)
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Package: 6-XFDFN |
Stock5,778 |
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NXP |
ACCEL 112.5G/33.75G ANAL 20SOIC
- Type: Analog
- Axis: X, Y
- Acceleration Range: ±112.5g (X), ±33.75g (Y)
- Sensitivity (LSB/g): -
- Sensitivity (mV/g): 20 (X), 66.67 (Y)
- Bandwidth: 400Hz
- Output Type: Analog Voltage
- Voltage - Supply: 4.75 V ~ 5.25 V
- Features: -
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 20-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 20-SOIC
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Package: 20-SOIC (0.295", 7.50mm Width) |
Stock26,400 |
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NXP |
IC REMOTE KEYLESS ENTRY 20TSSOP
- Frequency: -
- Applications: -
- Modulation or Protocol: -
- Data Rate (Max): -
- Power - Output: -
- Current - Transmitting: -
- Data Interface: -
- Antenna Connector: -
- Memory Size: -
- Features: -
- Voltage - Supply: -
- Operating Temperature: -
- Package / Case: -
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Package: - |
Stock6,120 |
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NXP |
IC MCU WIRELESS HVQFN40
- Type: -
- RF Family/Standard: -
- Protocol: -
- Modulation: -
- Frequency: -
- Data Rate (Max): -
- Power - Output: -
- Sensitivity: -
- Memory Size: -
- Serial Interfaces: -
- GPIO: -
- Voltage - Supply: -
- Current - Receiving: -
- Current - Transmitting: -
- Operating Temperature: -
- Package / Case: -
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Package: - |
Stock7,398 |
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NXP |
IC PWR AMP RF 2100MHZ TO-270-14
- Frequency: 1.88GHz ~ 2.1GHz
- P1dB: 47.8dBm (60W)
- Gain: 30.5dB
- Noise Figure: -
- RF Type: W-CDMA
- Voltage - Supply: 28V
- Current - Supply: 230mA
- Test Frequency: 2.01GHz
- Package / Case: TO-270-14 Variant, Flat Leads
- Supplier Device Package: TO-270 WB-14
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Package: TO-270-14 Variant, Flat Leads |
Stock14,484 |
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NXP |
SYSTEM BASIS CHIP DCDC 0.8A VCO
- Applications: System Basis Chip
- Current - Supply: -
- Voltage - Supply: -1.0 V ~ 40 V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP Exposed Pad |
Stock5,936 |
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NXP |
BCC6
- Function: Battery Cell Controller
- Battery Chemistry: Lithium-Ion
- Number of Cells: 3 ~ 6
- Fault Protection: Over/Under Voltage
- Interface: SPI
- Operating Temperature: -40°C ~ 125°C (TA)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock5,184 |
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NXP |
CAR DSP
- Type: -
- Interface: -
- Clock Rate: -
- Non-Volatile Memory: -
- On-Chip RAM: -
- Voltage - I/O: -
- Voltage - Core: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock2,800 |
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NXP |
DRAGONBALL MXL 225 PB-FR
- Core Processor: -
- Number of Cores/Bus Width: -
- Speed: -
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: -
- Operating Temperature: -
- Security Features: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock5,584 |
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NXP |
16-BIT MCU S12X CORE 1MB FLASH
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 50MHz
- Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 91
- Program Memory Size: 1MB (1M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
- Data Converters: A/D 16x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 112-LQFP
- Supplier Device Package: 112-LQFP (20x20)
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Package: 112-LQFP |
Stock4,928 |
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NXP |
IC POWER MANAGEMENT
- Applications: High Performance i.MX 8, S32x Processor Based
- Current - Supply: -
- Voltage - Supply: 2.5V ~ 5.5V
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount, Wettable Flank
- Package / Case: 56-VFQFN Exposed Pad
- Supplier Device Package: 56-HVQFN (8x8)
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Package: 56-VFQFN Exposed Pad |
Stock8,328 |
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NXP |
IC MCU 32BIT 256KB FLASH 48HVQFN
- Core Processor: ARM® Cortex®-M0+
- Core Size: 32-Bit Single-Core
- Speed: 48MHz
- Connectivity: I2C, LINbus, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
- Number of I/O: -
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 8K x 8
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
- Data Converters: A/D 16b SAR
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount, Wettable Flank
- Package / Case: 48-VFQFN Exposed Pad
- Supplier Device Package: 48-HVQFN (7x7)
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Package: - |
Request a Quote |
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NXP |
H-BRIDGE, BRUSHED DC MOTOR DRIVE
- Motor Type - Stepper: Bipolar
- Motor Type - AC, DC: Brushed DC
- Function: Driver - Fully Integrated, Control and Power Stage
- Output Configuration: Half Bridge (2)
- Interface: Parallel
- Technology: CMOS
- Step Resolution: -
- Applications: DC Motors
- Current - Output: 5A
- Voltage - Supply: 5V ~ 28V
- Voltage - Load: 5V ~ 28V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount, Wettable Flank
- Package / Case: 10-WFDFN Exposed Pad
- Supplier Device Package: 10-DFN (3x3)
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Package: - |
Stock2,844 |
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