Page 13 - NXP Products | Heisener Electronics

IRF640,127
NXP

MOSFET N-CH 200V 16A TO220AB

Package: TO-220-3

Stock7,536
BUK9E04-30B,127
NXP

MOSFET N-CH 30V 75A I2PAK

Package: TO-262-3 Long Leads, I2Pak, TO-262AA

Stock2,368
LD6805K/14H,115
NXP

IC REG LIN 1.4V 150MA DFN1010C-4

Package: 4-UDFN Exposed Pad

Stock2,032
MC34702EK
NXP

IC POWER SUPPLY MCU 3A 32-SOIC

Package: 32-SOIC (0.295", 7.50mm Width)

Stock34,560
MC10XS6225EK
NXP

IC SWITCH HIGH SIDE 32SOIC

Package: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad

Stock7,904
74HC4511N,652
NXP

IC LATCH/DECODER/DRIVER 16-DIP

Package: 16-DIP (0.300", 7.62mm)

Stock3,312
PCF85116-3P/01,112
NXP

IC EEPROM 16KBIT 400KHZ 8DIP

Package: 8-DIP (0.300", 7.62mm)

Stock3,264
74HCT160D,653
NXP

IC SYNC BCD DECADE COUNT 16SOIC

Package: 16-SOIC (0.154", 3.90mm Width)

Stock7,712
74HCT4059D,112
NXP

IC PROG DIVIDE-BY-N COUNT 24SOIC

Package: 24-SOIC (0.295", 7.50mm Width)

Stock4,320
MCZ33780EG
NXP

IC MASTER DUAL DBUS DIFF 16-SOIC

Package: 16-SOIC (0.295", 7.50mm Width)

Stock67,296
PCA6416APW,118
NXP

IC I/O EXPANDER I2C/SMB 24TSSOP

Package: 24-TSSOP (0.173", 4.40mm Width)

Stock19,320
T4160NSE7QTB
NXP

IC SOC 64BIT 16X 1.67GHZ 1932BGA

Package: 1932-BBGA, FCBGA

Stock3,488
MPC8555EVTAPF
NXP

IC MPU MPC85XX 833MHZ 783FCBGA

Package: 783-BBGA, FCBGA

Stock7,072
MPC8360VVALFHA
NXP

IC MPU MPC83XX 667MHZ 740TBGA

Package: 740-LBGA

Stock10,380
MPC8271VRTIEA
NXP

IC MPU MPC82XX 400MHZ 516BGA

Package: 516-BBGA

Stock3,616
MPC8309VMADDCA
NXP

IC MPU MPC83XX 266MHZ 489BGA

Package: 489-LFBGA

Stock6,656
LPC2921FBD100,551
NXP

IC MCU 32BIT 128KB FLASH 100LQFP

Package: 100-LQFP

Stock5,536
MC9S12C64MFA
NXP

IC MCU 16BIT 64KB FLASH 48LQFP

Package: 48-LQFP

Stock6,736
MC9S08AC8MFDE
NXP

IC MCU 8BIT 8KB FLASH 48QFN

Package: 48-VFQFN Exposed Pad

Stock5,840
LPC11U35FHI33/501,
NXP

IC MCU 32BIT 64KB FLASH 33HVQFN

Package: 32-VFQFN Exposed Pad

Stock20,484

Part Number	Manufacturer	Description	Package	Stock
IRF640,127	NXP	MOSFET N-CH 200V 16A TO220AB FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 200V Current - Continuous Drain (Id) @ 25°C: 16A (Tc) Drive Voltage (Max Rds On, Min Rds On): 10V Vgs(th) (Max) @ Id: 4V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 63nC @ 10V Input Capacitance (Ciss) (Max) @ Vds: 1850pF @ 25V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 136W (Tc) Rds On (Max) @ Id, Vgs: 180 mOhm @ 8A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Through Hole Supplier Device Package: TO-220AB Package / Case: TO-220-3	Package: TO-220-3	Stock7,536
BUK9E04-30B,127	NXP	MOSFET N-CH 30V 75A I2PAK FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 30V Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs(th) (Max) @ Id: 2V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 56nC @ 5V Input Capacitance (Ciss) (Max) @ Vds: 6526pF @ 25V Vgs (Max): ±15V FET Feature: - Power Dissipation (Max): 254W (Tc) Rds On (Max) @ Id, Vgs: 3 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Through Hole Supplier Device Package: I2PAK Package / Case: TO-262-3 Long Leads, I2Pak, TO-262AA	Package: TO-262-3 Long Leads, I2Pak, TO-262AA	Stock2,368
LD6805K/14H,115	NXP	IC REG LIN 1.4V 150MA DFN1010C-4 Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 1.4V Voltage - Output (Max): - Voltage Dropout (Max): 0.25V @ 150mA Current - Output: 150mA Current - Quiescent (Iq): - Current - Supply (Max): 35µA ~ 150µA PSRR: 75dB (1kHz) Control Features: Enable Protection Features: Over Current, Transient Voltage Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 4-UDFN Exposed Pad Supplier Device Package: DFN1010C-4	Package: 4-UDFN Exposed Pad	Stock2,032
MC34702EK	NXP	IC POWER SUPPLY MCU 3A 32-SOIC Applications: Power Supplies Current - Supply: 60mA Voltage - Supply: 2.8 V ~ 6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 32-SOIC (0.295", 7.50mm Width) Supplier Device Package: 32-SOIC	Package: 32-SOIC (0.295", 7.50mm Width)	Stock34,560
MC10XS6225EK	NXP	IC SWITCH HIGH SIDE 32SOIC Switch Type: General Purpose Number of Outputs: 2 Ratio - Input:Output: - Output Configuration: High Side Output Type: - Interface: SPI Voltage - Load: 7 V ~ 18 V Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Current - Output (Max): 3.8A, 9A Rds On (Typ): 10 mOhm, 25 mOhm Input Type: - Features: Status Flag Fault Protection: Open Load Detect, Over Temperature Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP	Package: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad	Stock7,904
74HC4511N,652	NXP	IC LATCH/DECODER/DRIVER 16-DIP Display Type: LED, LCD Configuration: 7 Segment Interface: BCD Digits or Characters: - Current - Supply: - Voltage - Supply: 2 V ~ 6 V Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	Package: 16-DIP (0.300", 7.62mm)	Stock3,312
PCF85116-3P/01,112	NXP	IC EEPROM 16KBIT 400KHZ 8DIP Memory Type: Non-Volatile Memory Format: EEPROM Technology: EEPROM Memory Size: 16Kb (2K x 8) Memory Interface: I2C Clock Frequency: 400kHz Write Cycle Time - Word, Page: - Access Time: - Voltage - Supply: 2.7 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-DIP	Package: 8-DIP (0.300", 7.62mm)	Stock3,264
74HCT160D,653	NXP	IC SYNC BCD DECADE COUNT 16SOIC Logic Type: Counter, Decade Direction: Up Number of Elements: 1 Number of Bits per Element: 4 Reset: Asynchronous Timing: Synchronous Count Rate: 66MHz Trigger Type: Positive Edge Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	Package: 16-SOIC (0.154", 3.90mm Width)	Stock7,712
74HCT4059D,112	NXP	IC PROG DIVIDE-BY-N COUNT 24SOIC Logic Type: Divide-by-N Direction: Down Number of Elements: 1 Number of Bits per Element: 16 Reset: Asynchronous Timing: Synchronous Count Rate: 36MHz Trigger Type: Positive Edge Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 24-SOIC (0.295", 7.50mm Width) Supplier Device Package: 24-SO	Package: 24-SOIC (0.295", 7.50mm Width)	Stock4,320
MCZ33780EG	NXP	IC MASTER DUAL DBUS DIFF 16-SOIC Applications: - Interface: SPI Voltage - Supply: - Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC Mounting Type: Surface Mount	Package: 16-SOIC (0.295", 7.50mm Width)	Stock67,296
PCA6416APW,118	NXP	IC I/O EXPANDER I2C/SMB 24TSSOP Number of I/O: 16 Interface: I2C, SMBus Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 1.65 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 24-TSSOP	Package: 24-TSSOP (0.173", 4.40mm Width)	Stock19,320
T4160NSE7QTB	NXP	IC SOC 64BIT 16X 1.67GHZ 1932BGA Core Processor: PowerPC e6500 Number of Cores/Bus Width: 8 Core, 64-Bit Speed: 1.8GHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1 Gbps (13), 10 Gbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FCPBGA (45x45)	Package: 1932-BBGA, FCBGA	Stock3,488
MPC8555EVTAPF	NXP	IC MPU MPC85XX 833MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 833MHz Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DDR, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	Package: 783-BBGA, FCBGA	Stock7,072
MPC8360VVALFHA	NXP	IC MPU MPC83XX 667MHZ 740TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 740-LBGA Supplier Device Package: 740-TBGA (37.5x37.5)	Package: 740-LBGA	Stock10,380
MPC8271VRTIEA	NXP	IC MPU MPC82XX 400MHZ 516BGA Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	Package: 516-BBGA	Stock3,616
MPC8309VMADDCA	NXP	IC MPU MPC83XX 266MHZ 489BGA Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: USB 2.0 (1) Voltage - I/O: 1.8V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 489-LFBGA Supplier Device Package: 489-PBGA (19x19)	Package: 489-LFBGA	Stock6,656
LPC2921FBD100,551	NXP	IC MCU 32BIT 128KB FLASH 100LQFP Core Processor: ARM9? Core Size: 16/32-Bit Speed: 125MHz Connectivity: CAN, I2C, LIN, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Number of I/O: 60 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 16K x 8 RAM Size: 24K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 16x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	Package: 100-LQFP	Stock5,536
MC9S12C64MFA	NXP	IC MCU 16BIT 64KB FLASH 48LQFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 31 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	Package: 48-LQFP	Stock6,736
MC9S08AC8MFDE	NXP	IC MCU 8BIT 8KB FLASH 48QFN Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 38 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 768 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7)	Package: 48-VFQFN Exposed Pad	Stock5,840
LPC11U35FHI33/501,	NXP	IC MCU 32BIT 64KB FLASH 33HVQFN Core Processor: ARM? Cortex?-M0 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 26 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	Package: 32-VFQFN Exposed Pad	Stock20,484
M5475BFE	NXP	MODULE FIRE ENGINE Module/Board Type: MPU Core Core Processor: ColdFire V4e, MCF5475 Co-Processor: - Speed: 266MHz Flash Size: 16MB RAM Size: 64MB Connector Type: - Size / Dimension: 3.7" x 4.5" (93.4mm x 114.3mm) Operating Temperature: 0°C ~ 70°C	Package: -	Stock2,848
TDA8270AHN/C1,557	NXP	IC TUNER DGTL CBL MODEM 40HVQFN Frequency: - Sensitivity: - Data Rate (Max): - Modulation or Protocol: - Applications: General Purpose Current - Receiving: - Data Interface: PCB, Surface Mount Memory Size: - Antenna Connector: PCB, Surface Mount Features: - Voltage - Supply: 3.3V Operating Temperature: -40°C ~ 85°C Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6x6)	Package: 40-VFQFN Exposed Pad	Stock5,526
TEF6621T/V1T,512	NXP	IC CAR RADIO SGL CHIP 32SOIC Frequency: - Sensitivity: - Data Rate (Max): - Modulation or Protocol: AM, FM Applications: AM/FM Radio Receiver Current - Receiving: - Data Interface: PCB, Surface Mount Memory Size: - Antenna Connector: PCB, Surface Mount Features: - Voltage - Supply: 8.5V Operating Temperature: -20°C ~ 85°C Package / Case: 32-SOIC (0.295", 7.50mm Width) Supplier Device Package: 32-SO	Package: 32-SOIC (0.295", 7.50mm Width)	Stock7,650
SAF4000EL-101S23CK	NXP	SOFTWARE DEFINED RADIO Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
FC32K142HRT0VLHT	NXP	S32K142 32-BIT MCU, ARM CORTEX-M Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
PCA9600DP-S911Z	NXP	IC REDRIVER I2C 1CH 8TSSOP Type: Buffer, ReDriver Applications: I2C Input: 2-Wire Bus Output: 2-Wire Bus Data Rate (Max): 1MHz Number of Channels: 2 Delay Time: 100ns Signal Conditioning: - Capacitance - Input: 10 pF Voltage - Supply: 2.5V ~ 15V Current - Supply: 5.5mA Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Supplier Device Package: 8-TSSOP	Package: -	Request a Quote
MRF24301HSR5	NXP	RF MOSFET LDMOS NI780 Transistor Type: LDMOS Frequency: 2.4GHz ~ 2.5GHz Gain: 13.5dB Voltage - Test: - Current Rating: - Noise Figure: - Current - Test: - Power - Output: 300W Voltage - Rated: - Package / Case: NI-780S Supplier Device Package: NI-780S	Package: -	Request a Quote
S9S12GA64J0MLFR	NXP	IC MCU 16BIT 64KB FLASH 48LQFP Core Processor: S12 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	Package: -	Request a Quote