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NXP |
MOSFET N-CH 60V 75A TO-220F
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 60V
- Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
- Drive Voltage (Max Rds On, Min Rds On): 10V
- Vgs(th) (Max) @ Id: 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs: 103nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds: 5494pF @ 25V
- Vgs (Max): ±20V
- FET Feature: -
- Power Dissipation (Max): 55W (Tc)
- Rds On (Max) @ Id, Vgs: 4 mOhm @ 25A, 10V
- Operating Temperature: -55°C ~ 175°C (TJ)
- Mounting Type: Through Hole
- Supplier Device Package: TO-220F
- Package / Case: TO-220-3 Full Pack, Isolated Tab
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Package: TO-220-3 Full Pack, Isolated Tab |
Stock3,344 |
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NXP |
MOSFET N-CH 25V 66A TO220AB
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 25V
- Current - Continuous Drain (Id) @ 25°C: 66A (Tc)
- Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
- Vgs(th) (Max) @ Id: 2V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs: 12nC @ 5V
- Input Capacitance (Ciss) (Max) @ Vds: 860pF @ 25V
- Vgs (Max): ±20V
- FET Feature: -
- Power Dissipation (Max): 93W (Tc)
- Rds On (Max) @ Id, Vgs: 10.5 mOhm @ 25A, 10V
- Operating Temperature: -55°C ~ 175°C (TJ)
- Mounting Type: Through Hole
- Supplier Device Package: TO-220AB
- Package / Case: TO-220-3
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Package: TO-220-3 |
Stock2,544 |
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NXP |
TRANS NPN 25MA 15V 3GHZ SOT23
- Transistor Type: NPN
- Voltage - Collector Emitter Breakdown (Max): 15V
- Frequency - Transition: 2.8GHz
- Noise Figure (dB Typ @ f): 2.5dB @ 800MHz
- Gain: -
- Power - Max: 300mW
- DC Current Gain (hFE) (Min) @ Ic, Vce: 25 @ 2mA, 1V
- Current - Collector (Ic) (Max): 25mA
- Operating Temperature: 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Supplier Device Package: TO-236AB (SOT23)
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Package: TO-236-3, SC-59, SOT-23-3 |
Stock4,320 |
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NXP |
TRANS NPN 6V 10MA 14GHZ SOT343R
- Transistor Type: NPN
- Voltage - Collector Emitter Breakdown (Max): 6V
- Frequency - Transition: 14GHz
- Noise Figure (dB Typ @ f): 1dB @ 2GHz
- Gain: 18dB
- Power - Max: 60mW
- DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 3V
- Current - Collector (Ic) (Max): 10mA
- Operating Temperature: 175°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: SC-82A, SOT-343
- Supplier Device Package: CMPAK-4
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Package: SC-82A, SOT-343 |
Stock3,568 |
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NXP |
DIODE GEN PURP 75V 250MA ALF2
- Diode Type: Standard
- Voltage - DC Reverse (Vr) (Max): 75V
- Current - Average Rectified (Io): 250mA (DC)
- Voltage - Forward (Vf) (Max) @ If: 1V @ 100mA
- Speed: Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr): 4ns
- Current - Reverse Leakage @ Vr: 5µA @ 75V
- Capacitance @ Vr, F: 2pF @ 0V, 1MHz
- Mounting Type: Through Hole
- Package / Case: DO-204AH, DO-35, Axial
- Supplier Device Package: ALF2
- Operating Temperature - Junction: 200°C (Max)
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Package: DO-204AH, DO-35, Axial |
Stock3,424 |
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NXP |
IC MOTOR DRIVER PAR 16QFN
- Motor Type - Stepper: Bipolar
- Motor Type - AC, DC: Brushed DC
- Function: Driver - Fully Integrated, Control and Power Stage
- Output Configuration: Half Bridge (4)
- Interface: Parallel
- Technology: Power MOSFET
- Step Resolution: -
- Applications: Camera
- Current - Output: 400mA
- Voltage - Supply: 2.7 V ~ 5.5 V
- Voltage - Load: 2.7 V ~ 5.5 V
- Operating Temperature: -20°C ~ 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 16-VFQFN Exposed Pad
- Supplier Device Package: 16-QFN (3x3)
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Package: 16-VFQFN Exposed Pad |
Stock1,046,928 |
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NXP |
IC AMP GAIN PWR 550MHZ SOT115J
- Applications: CATV
- Output Type: -
- Number of Circuits: 1
- -3db Bandwidth: -
- Slew Rate: -
- Current - Supply: 395mA
- Current - Output / Channel: -
- Voltage - Supply, Single/Dual (±): -
- Mounting Type: -
- Package / Case: SOT-115J
- Supplier Device Package: SOT115J
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Package: SOT-115J |
Stock2,864 |
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NXP |
IC UART DUAL 40-DIP
- Features: Configurable GPIO, Internal Oscillator, Timer/Counter
- Number of Channels: 2, DUART
- FIFO's: -
- Protocol: -
- Data Rate (Max): 1Mbps
- Voltage - Supply: 5V
- With Auto Flow Control: Yes
- With IrDA Encoder/Decoder: -
- With False Start Bit Detection: Yes
- With Modem Control: -
- Mounting Type: Through Hole
- Package / Case: 40-DIP (0.600", 15.24mm)
- Supplier Device Package: 40-DIP
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Package: 40-DIP (0.600", 15.24mm) |
Stock7,056 |
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NXP |
IC DSI SLAVE FOR R-SENSE 16-SOIC
- Type: Sensor Interface
- Input Type: Logic
- Output Type: Logic
- Interface: Parallel
- Current - Supply: 250mA
- Operating Temperature: -40°C ~ 150°C
- Mounting Type: Surface Mount
- Package / Case: 16-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 16-SOIC
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Package: 16-SOIC (0.154", 3.90mm Width) |
Stock29,940 |
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NXP |
IC TRANSCEIVER CAN S-W 14-SOIC
- Type: Transceiver
- Protocol: CAN
- Number of Drivers/Receivers: 1/1
- Duplex: Half
- Receiver Hysteresis: 500mV
- Data Rate: 83.33Kbps
- Voltage - Supply: 12V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 14-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 14-SOIC
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Package: 14-SOIC (0.154", 3.90mm Width) |
Stock202,896 |
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NXP |
IC CODEC ADPCM 28-SOIC W
- Type: PCM, Filter
- Data Interface: PCM Audio Interface
- Resolution (Bits): 13 b
- Number of ADCs / DACs: 1 / 1
- Sigma Delta: No
- S/N Ratio, ADCs / DACs (db) Typ: -
- Dynamic Range, ADCs / DACs (db) Typ: -
- Voltage - Supply, Analog: -
- Voltage - Supply, Digital: 4.5 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 28-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 28-SOIC
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Package: 28-SOIC (0.295", 7.50mm Width) |
Stock115,932 |
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NXP |
IC MPU MPC85XX 1.2GHZ 783FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.2GHz
- Co-Processors/DSP: Signal Processing; SPE
- RAM Controllers: DDR, DDR2, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (4)
- SATA: -
- USB: -
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 783-BBGA, FCBGA |
Stock3,536 |
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NXP |
IC MPU MPC85XX 1.0GHZ 783FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.0GHz
- Co-Processors/DSP: Signal Processing; SPE, Security; SEC
- RAM Controllers: DDR, DDR2, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: -
- USB: -
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 783-BBGA, FCBGA |
Stock7,952 |
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NXP |
IC MPU MPC74XX 1.6GHZ 360FCCBGA
- Core Processor: PowerPC G4
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.6GHz
- Co-Processors/DSP: Multimedia; SIMD
- RAM Controllers: -
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 1.5V, 1.8V, 2.5V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 360-CBGA, FCCBGA
- Supplier Device Package: 360-FCCBGA (25x25)
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Package: 360-CBGA, FCCBGA |
Stock7,696 |
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NXP |
IC MPU Q OR IQ 1.5GHZ 1295FCBGA
- Core Processor: PowerPC e500mc
- Number of Cores/Bus Width: 4 Core, 32-Bit
- Speed: 1.5GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 1 Gbps (8), 10 Gbps (2)
- SATA: -
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 1295-BBGA, FCBGA
- Supplier Device Package: 1295-FCPBGA (37.5x37.5)
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Package: 1295-BBGA, FCBGA |
Stock2,720 |
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NXP |
IC MCU 8BIT 64KB FLASH 40DIP
- Core Processor: 8051
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O: 32
- Program Memory Size: 64KB (64K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 40-DIP (0.600", 15.24mm)
- Supplier Device Package: 40-DIP
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Package: 40-DIP (0.600", 15.24mm) |
Stock4,944 |
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NXP |
IC MCU 8BIT 1KB FLASH 10HVSON
- Core Processor: 8051
- Core Size: 8-Bit
- Speed: 18MHz
- Connectivity: -
- Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
- Number of I/O: 8
- Program Memory Size: 1KB (1K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128 x 8
- Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
- Data Converters: A/D 4x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 10-VFDFN Exposed Pad
- Supplier Device Package: 10-HVSON (3x3)
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Package: 10-VFDFN Exposed Pad |
Stock6,736 |
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NXP |
IC MCU 8BIT 1.5KB FLASH 8DIP
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: -
- Peripherals: LVD, POR, PWM
- Number of I/O: 5
- Program Memory Size: 1.5KB (1.5K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 8-DIP (0.300", 7.62mm)
- Supplier Device Package: 8-PDIP
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Package: 8-DIP (0.300", 7.62mm) |
Stock38,148 |
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NXP |
IC MCU 32BIT 512KB FLASH 180BGA
- Core Processor: ARM? Cortex?-M3
- Core Size: 32-Bit
- Speed: 120MHz
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
- Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
- Number of I/O: 141
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 96K x 8
- Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
- Data Converters: A/D 8x12b, D/A 1x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 180-TFBGA
- Supplier Device Package: 180-TFBGA (12x12)
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Package: 180-TFBGA |
Stock18,504 |
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NXP |
IC VIDEO PROCESSOR ADV 484TFBGA
- Applications: Embedded Multimedia Communication, Security and Entertainment
- Core Processor: ARM9?
- Program Memory Type: -
- Controller Series: -
- RAM Size: -
- Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG
- Number of I/O: -
- Voltage - Supply: -
- Operating Temperature: -
- Mounting Type: Surface Mount
- Package / Case: 484-TFBGA
- Supplier Device Package: 484-TFBGA (15x15)
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Package: 484-TFBGA |
Stock3,920 |
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NXP |
SENSOR PRESSURE ABS AXIAL 8SSOP
- Pressure Type: Vented Gauge
- Operating Pressure: 2.9 PSI ~ 58.02 PSI (20 kPa ~ 400 kPa)
- Output Type: Analog Voltage
- Output: 0.2 V ~ 4.8 V
- Accuracy: ±1.5%
- Voltage - Supply: 4.64 V ~ 5.36 V
- Port Size: Male - 0.13" (3.3mm), Tube
- Port Style: Barbless
- Features: Temperature Compensated
- Termination Style: -
- Maximum Pressure: 232.06 PSI (1600 kPa)
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SSOP
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock4,032 |
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NXP |
IC PWR AMP RF 3500MHZ TO-272-16
- Frequency: 3.4GHz ~ 3.6GHz
- P1dB: 44.8dBm (30W)
- Gain: 25dB
- Noise Figure: -
- RF Type: WiMax
- Voltage - Supply: 32V
- Current - Supply: 230mA
- Test Frequency: 3.6GHz
- Package / Case: TO-272-16 Variant, Flat Leads
- Supplier Device Package: TO-272 WB-16
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Package: TO-272-16 Variant, Flat Leads |
Stock11,580 |
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NXP |
MAGNIV 16-BIT MCU S12Z CORE 12
- Core Processor: S12Z
- Core Size: 16-Bit
- Speed: 50MHz
- Connectivity: LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 31
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 512 x 8
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
- Data Converters: A/D 9x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 150°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP Exposed Pad
- Supplier Device Package: 64-LQFP-EP (10x10)
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Package: 64-LQFP Exposed Pad |
Stock5,904 |
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NXP |
S08AW 8-BIT MCU S08 CORE 32KB
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: I²C, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 38
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 48-VFQFN Exposed Pad
- Supplier Device Package: 48-QFN-EP (7x7)
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Package: 48-VFQFN Exposed Pad |
Stock6,432 |
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NXP |
MAGNIV 16-BIT MCU S12Z CORE 96
- Core Processor: S12Z
- Core Size: 16-Bit
- Speed: 32MHz
- Connectivity: CANbus, I²C, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 42
- Program Memory Size: 96KB (96K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
- Data Converters: A/D 16x10b, D/A 1x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP Exposed Pad
- Supplier Device Package: 64-LQFP (10x10)
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Package: 64-LQFP Exposed Pad |
Stock7,536 |
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NXP |
IC MCU 32BIT 640KB FLASH 64HTQFP
- Core Processor: ARM® Cortex®-M33
- Core Size: 32-Bit Single-Core
- Speed: 150MHz
- Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
- Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
- Number of I/O: 36
- Program Memory Size: 640KB (640K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 320K x 8
- Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
- Data Converters: A/D 10x16b SAR
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 64-TQFP Exposed Pad
- Supplier Device Package: 64-HTQFP (10x10)
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Package: - |
Request a Quote |
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NXP |
HIGH VOLTAGE PMIC QFN56
- Applications: Power Supplies
- Current - Supply: 15mA
- Voltage - Supply: 60V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount, Wettable Flank
- Package / Case: 56-VFQFN Exposed Pad
- Supplier Device Package: 56-HVQFN (8x8)
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Package: - |
Stock3,900 |
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NXP |
AUTO SBC
- Applications: -
- Current - Supply: 30µA
- Voltage - Supply: 3.2V ~ 40V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-LQFP-EP (7x7)
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Package: - |
Request a Quote |
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