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NXP |
FET RF 65V 2.69GHZ
- Transistor Type: LDMOS
- Frequency: 2.69GHz
- Gain: 16.3dB
- Voltage - Test: 28V
- Current Rating: -
- Noise Figure: -
- Current - Test: 450mA
- Power - Output: 15.5W
- Voltage - Rated: 65V
- Package / Case: NI-400-240
- Supplier Device Package: NI-400-240
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Package: NI-400-240 |
Stock5,968 |
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NXP |
TRANS PNP 12V 50MA SOT323
- Transistor Type: PNP
- Voltage - Collector Emitter Breakdown (Max): 12V
- Frequency - Transition: 4GHz
- Noise Figure (dB Typ @ f): 2.4dB ~ 3dB @ 500MHz ~ 1GHz
- Gain: -
- Power - Max: 300mW
- DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 30mA, 5V
- Current - Collector (Ic) (Max): 50mA
- Operating Temperature: 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: SC-70, SOT-323
- Supplier Device Package: SOT-323-3
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Package: SC-70, SOT-323 |
Stock6,784 |
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NXP |
IC PWR MGMT I.MX6 56QFN
- Applications: Converter, i.MX6
- Voltage - Input: 2.8 V ~ 4.5 V
- Number of Outputs: 11
- Voltage - Output: Multiple
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 56-VFQFN Exposed Pad
- Supplier Device Package: 56-QFN (8x8)
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Package: 56-VFQFN Exposed Pad |
Stock4,352 |
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NXP |
IC DVR IGNITION/INJECTOR 32SOIC
- Applications: Automotive
- Current - Supply: 10mA
- Voltage - Supply: 4.7 V ~ 36 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Supplier Device Package: 32-SOIC EP
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Package: 32-SSOP (0.295", 7.50mm Width) Exposed Pad |
Stock4,080 |
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NXP |
IC LIGHT POSITION CTRLR 16-SOIC
- Applications: Automotive
- Current - Supply: 6mA
- Voltage - Supply: 8 V ~ 18 V
- Operating Temperature: -40°C ~ 105°C
- Mounting Type: Surface Mount
- Package / Case: 16-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 16-SO
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Package: 16-SOIC (0.154", 3.90mm Width) |
Stock2,672 |
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NXP |
IC COMPARATOR LOW VOLTAGE 5TSSOP
- Type: General Purpose
- Number of Elements: 1
- Output Type: Rail-to-Rail
- Voltage - Supply, Single/Dual (±): 1.3 V ~ 5.5 V
- Voltage - Input Offset (Max): 30mV @ 5.5V
- Current - Input Bias (Max): 1pA
- Current - Output (Typ): -
- Current - Quiescent (Max): 6µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 0.8µs
- Hysteresis: 20mV
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 5-TSSOP, SC-70-5, SOT-353
- Mounting Type: Surface Mount
- Supplier Device Package: 5-TSSOP
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Package: 5-TSSOP, SC-70-5, SOT-353 |
Stock44,508 |
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NXP |
IC AMP AUDIO .04W STER D 32HVQFN
- Type: Class D
- Output Type: Headphones, 2-Channel (Stereo)
- Max Output Power x Channels @ Load: 40mW x 2 @ 16 Ohm
- Voltage - Supply: 0.9 V ~ 1.7 V
- Features: Depop, Differential Inputs, Microphone, Mute, Short-Circuit Protection
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 70°C (TA)
- Supplier Device Package: 32-HVQFN (5x5)
- Package / Case: 32-VFQFN Exposed Pad
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Package: 32-VFQFN Exposed Pad |
Stock5,904 |
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NXP |
IC BUFFER I2C/SMBUS HOTSWAP 8SO
- Type: Buffer, Accelerator
- Applications: I2C - Hotswap
- Input: 2-Wire Bus
- Output: 2-Wire Bus
- Data Rate (Max): 400kHz
- Number of Channels: 1
- Delay Time: -
- Signal Conditioning: -
- Capacitance - Input: 1.9pF
- Voltage - Supply: 2.7 V ~ 5.5 V
- Current - Supply: 3.5mA
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: -
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SO
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock3,040 |
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NXP |
IC I/O EXPANDER I2C 8B 20SSOP
- Number of I/O: 8
- Interface: I2C
- Interrupt Output: Yes
- Features: POR
- Output Type: Push-Pull
- Current - Output Source/Sink: 100µA, 25mA
- Clock Frequency: 1MHz
- Voltage - Supply: 2.3 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 20-LSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 20-SSOP
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Package: 20-LSSOP (0.173", 4.40mm Width) |
Stock2,832 |
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NXP |
IC MULTIPLEXER HEX 1X2 56HWQFN
- Applications: DisplayPort, PCIe
- Multiplexer/Demultiplexer Circuit: 2:1
- Switch Circuit: -
- Number of Channels: 6
- On-State Resistance (Max): -
- Voltage - Supply, Single (V+): 3 V ~ 3.6 V
- Voltage - Supply, Dual (V±): -
- -3db Bandwidth: 2.5GHz
- Features: Bi-Directional
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 56-WFQFN Exposed Pad
- Supplier Device Package: 56-HWQFN
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Package: 56-WFQFN Exposed Pad |
Stock4,400 |
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NXP |
IC MPU MPC85XX 1.333GHZ 1023BGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 1.333GHz
- Co-Processors/DSP: Signal Processing; SPE, Security; SEC
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (4)
- SATA: -
- USB: -
- Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 1023-BFBGA, FCBGA
- Supplier Device Package: 1023-FCPBGA (33x33)
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Package: 1023-BFBGA, FCBGA |
Stock6,592 |
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NXP |
IC MPU MPC82XX 200MHZ 408TBGA
- Core Processor: PowerPC G2
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 200MHz
- Co-Processors/DSP: Communications; RISC CPM
- RAM Controllers: DRAM, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100 Mbps (3)
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 480-LBGA
- Supplier Device Package: 408-TBGA (37.5x37.5)
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Package: 480-LBGA |
Stock11,028 |
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NXP |
IC MPU MPC8XX 81MHZ 256BGA
- Core Processor: PowerPC
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 81MHz
- Co-Processors/DSP: Communications; RISC CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: LCD, Video
- Ethernet: 10 Mbps (1)
- SATA: -
- USB: USB 1.x (1)
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 95°C (TA)
- Security Features: -
- Package / Case: 256-BBGA
- Supplier Device Package: 256-PBGA (23x23)
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Package: 256-BBGA |
Stock6,544 |
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NXP |
IC MPU MPC8XX 80MHZ 357BGA
- Core Processor: MPC8xx
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 80MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (2), 10/100 Mbps (1)
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 95°C (TA)
- Security Features: -
- Package / Case: 357-BBGA
- Supplier Device Package: 357-PBGA (25x25)
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Package: 357-BBGA |
Stock6,208 |
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NXP |
IC MPU MPC83XX 400MHZ 740TBGA
- Core Processor: PowerPC e300
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 400MHz
- Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (1)
- SATA: -
- USB: USB 1.x (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 740-LBGA
- Supplier Device Package: 740-TBGA (37.5x37.5)
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Package: 740-LBGA |
Stock6,744 |
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NXP |
IC MPU I.MX6S 800MHZ 624MAPBGA
- Core Processor: ARM? Cortex?-A9
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: Multimedia; NEON? SIMD
- RAM Controllers: LPDDR2, LVDDR3, DDR3
- Graphics Acceleration: Yes
- Display & Interface Controllers: Keypad, LCD
- Ethernet: 10/100/1000 Mbps (1)
- SATA: -
- USB: USB 2.0 + PHY (4)
- Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature: -40°C ~ 125°C (TJ)
- Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Package / Case: 624-LFBGA
- Supplier Device Package: 624-MAPBGA (21x21)
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Package: 624-LFBGA |
Stock7,376 |
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NXP |
IC MPU MPC8XX 66MHZ 256BGA
- Core Processor: MPC8xx
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 66MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100 Mbps (2)
- SATA: -
- USB: USB 2.0 (1)
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 95°C (TA)
- Security Features: -
- Package / Case: 256-BBGA
- Supplier Device Package: 256-PBGA (23x23)
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Package: 256-BBGA |
Stock21,792 |
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NXP |
IC PWR AMP RF 26V 30W TO272-16GW
- Frequency: 1.93GHz ~ 1.99GHz
- P1dB: -
- Gain: 23dB
- Noise Figure: -
- RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA
- Voltage - Supply: 26V
- Current - Supply: 160mA
- Test Frequency: -
- Package / Case: TO-272-16 Variant, Gull Wing
- Supplier Device Package: TO-272 WB-16 GULL
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Package: TO-272-16 Variant, Gull Wing |
Stock6,894 |
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NXP |
NXP 32-BIT MCU POWER ARCH CORE
- Core Processor: e200z0h
- Core Size: 32-Bit
- Speed: 64MHz
- Connectivity: CANbus, I²C, LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 77
- Program Memory Size: 768KB (768K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 7x10b, 5x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
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Package: 100-LQFP |
Stock6,736 |
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NXP |
8-BIT MCU S08 CORE 60KB FLASH
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: CANbus, I²C, LINbus, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 53
- Program Memory Size: 60KB (60K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 24x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
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Package: 64-LQFP |
Stock6,496 |
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NXP |
8-BIT MCU S08 CORE 32KB FLASH
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: I²C, LINbus, SCI, SPI
- Peripherals: LCD, LVD, POR, PWM, WDT
- Number of I/O: 69
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 1.9K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 16x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 80-LQFP
- Supplier Device Package: 80-LQFP (14x14)
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Package: 80-LQFP |
Stock4,272 |
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NXP |
MAGNIV 16-BIT MCU S12 CORE 32K
- Core Processor: 12V1
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: IrDA, LINbus, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 16
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 128 x 8
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
- Data Converters: A/D 2x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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Package: 32-LQFP |
Stock2,736 |
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NXP |
IC MCU 32BIT FLASH 100LQFP
- Core Processor: ARM® Cortex®-M4F
- Core Size: 32-Bit
- Speed: 112MHz
- Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
- Peripherals: POR, PWM, WDT
- Number of I/O: -
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
- Data Converters: A/D 16x12b; D/A 1x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
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Package: 100-LQFP |
Stock21,780 |
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NXP |
IC AUTO ETHERNET SWITCH BGA
- Protocol: Ethernet
- Function: Switch
- Interface: GPIO, JTAG, MII, RGMII, RMII, SGMII, SPI
- Standards: 10/100 Base-T/TX PHY
- Voltage - Supply: -
- Current - Supply: -
- Operating Temperature: -
- Package / Case: 256-LFBGA
- Supplier Device Package: 256-LFBGA (14x14)
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Package: - |
Request a Quote |
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NXP |
IC MPU I.MX8ML 1.6GHZ 548LFBGA
- Core Processor: ARM® Cortex®-A53
- Number of Cores/Bus Width: 2 Core, 64-Bit
- Speed: 1.6GHz
- Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
- RAM Controllers: DDR4, LPDDR4
- Graphics Acceleration: Yes
- Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
- Ethernet: GbE (2)
- SATA: -
- USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
- Voltage - I/O: -
- Operating Temperature: -40°C ~ 105°C (TJ)
- Security Features: ARM TZ, CAAM, RDC
- Package / Case: 548-LFBGA
- Supplier Device Package: 548-LFBGA (15x15)
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Package: - |
Request a Quote |
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NXP |
POWER MANAGEMENT IC, PRE-PROG, 3
- Applications: -
- Current - Supply: 40µA
- Voltage - Supply: 2.7V ~ 5.5V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount, Wettable Flank
- Package / Case: 32-PowerWFQFN
- Supplier Device Package: 32-HWQFN (5x5)
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Package: - |
Request a Quote |
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NXP |
NANO SOLOLITE I.MX 8M LFBGA486
- Core Processor: -
- Number of Cores/Bus Width: -
- Speed: -
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: -
- Operating Temperature: -
- Security Features: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
RF MOSFET LDMOS 28V OM1230-42
- Transistor Type: LDMOS
- Frequency: 2.11GHz ~ 2.2GHz
- Gain: 16.8dB
- Voltage - Test: 28 V
- Current Rating: 10µA
- Noise Figure: -
- Current - Test: 500 mA
- Power - Output: 373W
- Voltage - Rated: 65 V
- Package / Case: OM-1230-4L2L
- Supplier Device Package: OM-1230-4L2L
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Package: - |
Request a Quote |
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