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NXP |
TOPFET LOGIC LVL 50V TO220AB
- Switch Type: General Purpose
- Number of Outputs: 1
- Ratio - Input:Output: 1:1
- Output Configuration: Low Side
- Output Type: N-Channel
- Interface: On/Off
- Voltage - Load: 50V (Max)
- Voltage - Supply (Vcc/Vdd): Not Required
- Current - Output (Max): 8A
- Rds On (Typ): 68 mOhm
- Input Type: Non-Inverting
- Features: -
- Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage
- Operating Temperature: -
- Package / Case: TO-220-3
- Supplier Device Package: TO-220AB
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Package: TO-220-3 |
Stock4,272 |
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NXP |
IC SWITCH HIGH SIDE 32SOIC
- Switch Type: General Purpose
- Number of Outputs: 4
- Ratio - Input:Output: 1:1
- Output Configuration: High Side
- Output Type: N-Channel
- Interface: SPI
- Voltage - Load: 7 V ~ 18 V
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Current - Output (Max): 5.5A
- Rds On (Typ): 17 mOhm
- Input Type: -
- Features: Slew Rate Controlled
- Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
- Operating Temperature: -40°C ~ 125°C (TA)
- Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
- Supplier Device Package: 32-SOIC EP
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Package: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad |
Stock6,816 |
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NXP |
IC FET PRE-DRIVER 3PH 54SOIC
- Motor Type - Stepper: -
- Motor Type - AC, DC: Brushless DC (BLDC)
- Function: Controller - Commutation, Direction Management
- Output Configuration: Pre-Driver - Half Bridge (3)
- Interface: SPI
- Technology: NMOS
- Step Resolution: -
- Applications: Automotive
- Current - Output: -
- Voltage - Supply: 6 V ~ 58 V
- Voltage - Load: -
- Operating Temperature: -40°C ~ 135°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
- Supplier Device Package: 54-SOIC W EP
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Package: 54-SSOP (0.295", 7.50mm Width) Exposed Pad |
Stock7,440 |
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NXP |
IC 2BIT 1:4 FET MUX/DEMUX 16SOIC
- Type: Multiplexer/Demultiplexer
- Circuit: 2 x 4:1
- Independent Circuits: 1
- Current - Output High, Low: -
- Voltage Supply Source: Single Supply
- Voltage - Supply: 4.5 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 16-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 16-SO
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Package: 16-SOIC (0.154", 3.90mm Width) |
Stock7,728 |
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NXP |
IC I2C EEPROM DIP SWITCH 16SOIC
- Type: Multiplexer
- Circuit: 1 x 4:4
- Independent Circuits: 1
- Current - Output High, Low: 2mA, 2mA
- Voltage Supply Source: Single Supply
- Voltage - Supply: 3 V ~ 3.6 V
- Operating Temperature: 0°C ~ 70°C
- Mounting Type: Surface Mount
- Package / Case: 16-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 16-SO
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Package: 16-SOIC (0.154", 3.90mm Width) |
Stock43,104 |
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NXP |
IC BUFF DVR TRI-ST 16BIT 48TSSOP
- Logic Type: Buffer, Non-Inverting
- Number of Elements: 4
- Number of Bits per Element: 4
- Input Type: -
- Output Type: Push-Pull
- Current - Output High, Low: 12mA, 12mA
- Voltage - Supply: 1.2 V ~ 3.6 V
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-TFSOP (0.240", 6.10mm Width)
- Supplier Device Package: 48-TSSOP
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Package: 48-TFSOP (0.240", 6.10mm Width) |
Stock6,384 |
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NXP |
IC AUDIO AMP CLASS D 29WLCSP
- Type: Class D
- Output Type: 1-Channel (Mono)
- Max Output Power x Channels @ Load: 2.65W x 1 @ 4 Ohm
- Voltage - Supply: 2.5 V ~ 5.5 V
- Features: Depop, Short-Circuit and Thermal Protection
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Supplier Device Package: 29-WLCSP (3.19x2.07)
- Package / Case: 29-UFBGA, WLCSP
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Package: 29-UFBGA, WLCSP |
Stock4,416 |
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NXP |
IC UART DUAL W/FIFO 32-HVQFN
- Features: -
- Number of Channels: 2, DUART
- FIFO's: 128 Byte
- Protocol: RS485
- Data Rate (Max): 5Mbps
- Voltage - Supply: 1.8V
- With Auto Flow Control: Yes
- With IrDA Encoder/Decoder: Yes
- With False Start Bit Detection: Yes
- With Modem Control: Yes
- Mounting Type: Surface Mount
- Package / Case: 32-VFQFN Exposed Pad
- Supplier Device Package: 32-HVQFN (5x5)
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Package: 32-VFQFN Exposed Pad |
Stock3,536 |
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NXP |
IC C2K 1.2GHZ 8CH VOIP 625BGA
- Function: -
- Interface: -
- Number of Circuits: -
- Voltage - Supply: -
- Current - Supply: -
- Power (Watts): -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock2,832 |
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NXP |
IC SERIAL LINK DVR AUTO 14-SOIC
- Applications: Diagnostic
- Interface: Serial
- Voltage - Supply: 4.5 V ~ 5.5 V
- Package / Case: 14-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 14-SOIC
- Mounting Type: Surface Mount
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Package: 14-SOIC (0.154", 3.90mm Width) |
Stock60,612 |
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NXP |
IC MPU Q OR IQ 800MHZ 780FCBGA
- Core Processor: PowerPC e500mc
- Number of Cores/Bus Width: 4 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: Security; SEC 4.2
- RAM Controllers: DDR3, DDR3L
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (5)
- SATA: SATA 3Gbps (2)
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
- Package / Case: -
- Supplier Device Package: 780-FCPBGA (23x23)
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Package: - |
Stock7,368 |
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NXP |
IC MPU MPC8XX 80MHZ 357BGA
- Core Processor: MPC8xx
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 80MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (4), 10/100 Mbps (1)
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 95°C (TA)
- Security Features: -
- Package / Case: 357-BBGA
- Supplier Device Package: 357-PBGA (25x25)
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Package: 357-BBGA |
Stock3,792 |
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NXP |
IC MPU MPC83XX 400MHZ 740TBGA
- Core Processor: PowerPC e300
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 400MHz
- Co-Processors/DSP: Communications; QUICC Engine
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (1)
- SATA: -
- USB: USB 1.x (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 740-LBGA
- Supplier Device Package: 740-TBGA (37.5x37.5)
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Package: 740-LBGA |
Stock5,552 |
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NXP |
IC MCU 8BIT 8KB OTP 44QFP
- Core Processor: 8051
- Core Size: 8-Bit
- Speed: 16MHz
- Connectivity: EBI/EMI, UART/USART
- Peripherals: POR
- Number of I/O: 32
- Program Memory Size: 8KB (8K x 8)
- Program Memory Type: OTP
- EEPROM Size: -
- RAM Size: 256 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 44-QFP
- Supplier Device Package: 44-PQFP (10x10)
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Package: 44-QFP |
Stock3,296 |
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NXP |
IC MCU 32BIT ROMLESS 196MAPBGA
- Core Processor: Coldfire V2
- Core Size: 32-Bit
- Speed: 166.67MHz
- Connectivity: CAN, EBI/EMI, I2C, SPI, SSI, UART/USART, USB OTG
- Peripherals: DMA, LCD, PWM, WDT
- Number of I/O: 55
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 128K x 8
- Voltage - Supply (Vcc/Vdd): 1.4 V ~ 1.6 V
- Data Converters: -
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 196-LBGA
- Supplier Device Package: 196-MAPBGA (15x15)
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Package: 196-LBGA |
Stock4,768 |
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NXP |
IC MCU 32BIT 256KB FLASH 64LQFP
- Core Processor: Coldfire V2
- Core Size: 32-Bit
- Speed: 66MHz
- Connectivity: I2C, SPI, UART/USART
- Peripherals: DMA, LVD, POR, PWM, WDT
- Number of I/O: 55
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
- Data Converters: A/D 8x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
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Package: 64-LQFP |
Stock10,620 |
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NXP |
IC MCU 32BIT 512KB FLASH 100LQFP
- Core Processor: ARM? Cortex?-M3
- Core Size: 32-Bit
- Speed: 100MHz
- Connectivity: CAN, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
- Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
- Number of I/O: 70
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
- Data Converters: A/D 8x12b, D/A 1x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
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Package: 100-LQFP |
Stock109,182 |
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NXP |
SENS PRESSURE 14.5 PSI MAX MPAK
- Pressure Type: Absolute
- Operating Pressure: 14.5 PSI (100 kPa)
- Output Type: Wheatstone Bridge
- Output: 0 mV ~ 40 mV (10V)
- Accuracy: -
- Voltage - Supply: 10 V ~ 16 V
- Port Size: Male - 0.12" (2.97mm) Tube
- Port Style: Barbless
- Features: Temperature Compensated
- Termination Style: PCB
- Maximum Pressure: 58.02 PSI (400 kPa)
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 5-SMD Module
- Supplier Device Package: 5-MPAK
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Package: 5-SMD Module |
Stock7,506 |
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NXP |
ACCELEROMETER PSI5 16QFN
- Type: -
- Axis: -
- Acceleration Range: -
- Sensitivity (LSB/g): -
- Sensitivity (mV/g): -
- Bandwidth: -
- Output Type: -
- Voltage - Supply: -
- Features: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock7,596 |
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NXP |
SYSTEM BASIS CHIP DCDC 0.8A VCO
- Applications: System Basis Chip
- Current - Supply: -
- Voltage - Supply: -1.0 V ~ 40 V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP Exposed Pad |
Stock4,432 |
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NXP |
PF1510
- Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
- Current - Supply: -
- Voltage - Supply: 3.8 V ~ 7 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 40-VFQFN Exposed Pad
- Supplier Device Package: 40-QFN (5x5)
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Package: 40-VFQFN Exposed Pad |
Stock3,136 |
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NXP |
I.MX6SX ROM PERF ENHAN
- Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 200MHz, 800MHz
- Co-Processors/DSP: Multimedia; NEON™ MPE
- RAM Controllers: LPDDR2, LVDDR3, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: Keypad, LCD
- Ethernet: 10/100/1000 Mbps (2)
- SATA: -
- USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
- Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
- Package / Case: 400-LFBGA
- Supplier Device Package: 400-MAPBGA (17x17)
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Package: 400-LFBGA |
Stock3,904 |
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NXP |
NXP 32-BIT MCU POWER ARCH 1.5M
- Core Processor: e200z4d
- Core Size: 32-Bit
- Speed: 120MHz
- Connectivity: CANbus, I²C, LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 147
- Program Memory Size: 1.5MB (1.5M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 128K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 27x10b, 5x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 176-LQFP
- Supplier Device Package: 176-LQFP (24x24)
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Package: 176-LQFP |
Stock7,552 |
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NXP |
S32K144 32-BIT MCU ARM
- Core Processor: ARM® Cortex®-M4F
- Core Size: 32-Bit
- Speed: 64MHz
- Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
- Peripherals: POR, PWM, WDT
- Number of I/O: -
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 16x12b, D/A 1x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
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Package: 64-LQFP |
Stock2,656 |
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NXP |
MAGNIV 16-BIT MCU S12Z CORE 64
- Core Processor: S12Z
- Core Size: 16-Bit
- Speed: 32MHz
- Connectivity: CANbus, I²C, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 28
- Program Memory Size: 64KB (64K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 1K x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
- Data Converters: A/D 10x10b, D/A 1x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP |
Stock4,432 |
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NXP |
IC MPU QORLQ LX2 2GHZ 1517FCPBGA
- Core Processor: ARM® Cortex®-A72
- Number of Cores/Bus Width: 12 Core, 64-Bit
- Speed: 2GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR4
- Graphics Acceleration: Yes
- Display & Interface Controllers: -
- Ethernet: 100Gbps (2)
- SATA: SATA 3.0 (4)
- USB: USB 3.0 (2) + PHY (2)
- Voltage - I/O: 1.2V, 1.8V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TJ)
- Security Features: Secure Boot, TrustZone®
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FCPBGA (40x40)
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Package: - |
Request a Quote |
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NXP |
IC TRANSCEIVER HALF 1/1 8SO
- Type: Transceiver
- Protocol: CANbus
- Number of Drivers/Receivers: 1/1
- Duplex: Half
- Receiver Hysteresis: 50 mV
- Data Rate: 5Mbps
- Voltage - Supply: 4.5V ~ 5.5V
- Operating Temperature: -40°C ~ 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SO
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Package: - |
Stock8,802 |
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NXP |
IC MCU 32BIT 2MB FLASH 176LQFP
- Core Processor: e200z4
- Core Size: 32-Bit Single-Core
- Speed: 160MHz
- Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
- Peripherals: DMA, LVD, POR, WDT
- Number of I/O: 129
- Program Memory Size: 2MB (2M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 256K x 8
- Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
- Data Converters: A/D 36x10b, 16x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 176-LQFP Exposed Pad
- Supplier Device Package: 176-LQFP (24x24)
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Package: - |
Request a Quote |
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