|
|
NXP |
TRANS NPN PREBIAS/PNP SOT666
- Transistor Type: 1 NPN Pre-Biased, 1 PNP
- Current - Collector (Ic) (Max): 100mA, 500mA
- Voltage - Collector Emitter Breakdown (Max): 50V, 40V
- Resistor - Base (R1) (Ohms): 22k
- Resistor - Emitter Base (R2) (Ohms): 22k
- DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V / 150 @ 100mA, 2V
- Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 350mV @ 50mA, 500mA
- Current - Collector Cutoff (Max): 1µA
- Frequency - Transition: 300MHz
- Power - Max: 300mW
- Mounting Type: Surface Mount
- Package / Case: SOT-563, SOT-666
- Supplier Device Package: SOT-666
|
Package: SOT-563, SOT-666 |
Stock7,136 |
|
|
|
NXP |
DIODE ZENER TO-236AB SOT23
- Voltage - Zener (Nom) (Vz): 51V
- Tolerance: ±5%
- Power - Max: 250mW
- Impedance (Max) (Zzt): 180 Ohms
- Current - Reverse Leakage @ Vr: 50nA @ 35.7V
- Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
- Operating Temperature: -65°C ~ 150°C
- Mounting Type: Surface Mount
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Supplier Device Package: TO-236AB (SOT23)
|
Package: TO-236-3, SC-59, SOT-23-3 |
Stock4,032 |
|
|
|
NXP |
IC MOTOR DRIVER PAR 54SOIC
- Motor Type - Stepper: -
- Motor Type - AC, DC: Brushed DC
- Function: Driver - Fully Integrated, Control and Power Stage
- Output Configuration: Half Bridge (2)
- Interface: Parallel
- Technology: Power MOSFET
- Step Resolution: -
- Applications: General Purpose
- Current - Output: 5A
- Voltage - Supply: 5 V ~ 28 V
- Voltage - Load: 5 V ~ 28 V
- Operating Temperature: -40°C ~ 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
- Supplier Device Package: 54-SOICW-EP
|
Package: 54-SSOP (0.295", 7.50mm Width) Exposed Pad |
Stock9,420 |
|
|
|
NXP |
IC TXRX TRANSLATING 4B 14TSSOP
- Translator Type: Voltage Level
- Channel Type: Bidirectional
- Number of Circuits: 1
- Channels per Circuit: 4
- Voltage - VCCA: 1.65V ~ 3.6V
- Voltage - VCCB: 2.3V ~ 5.5V
- Input Signal: -
- Output Signal: -
- Output Type: Open Drain, Push-Pull
- Data Rate: 50Mbps
- Operating Temperature: -40°C ~ 125°C (TA)
- Features: Auto-Direction Sensing
- Mounting Type: Surface Mount
- Package / Case: 14-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 14-TSSOP
|
Package: 14-TSSOP (0.173", 4.40mm Width) |
Stock3,872 |
|
|
|
NXP |
IC CODEC-FI 13BIT 3V 20-SSOP
- Type: PCM, Filter
- Data Interface: PCM Audio Interface
- Resolution (Bits): 13 b
- Number of ADCs / DACs: 1 / 1
- Sigma Delta: No
- S/N Ratio, ADCs / DACs (db) Typ: -
- Dynamic Range, ADCs / DACs (db) Typ: -
- Voltage - Supply, Analog: -
- Voltage - Supply, Digital: 2.7 V ~ 5.25 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 20-SSOP (0.209", 5.30mm Width)
- Supplier Device Package: 20-SSOP
|
Package: 20-SSOP (0.209", 5.30mm Width) |
Stock2,672 |
|
|
|
NXP |
IC MPU MPC85XX 1.333GHZ 783BGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.333GHz
- Co-Processors/DSP: Signal Processing; SPE, Security; SEC
- RAM Controllers: DDR, DDR2, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (4)
- SATA: -
- USB: -
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
|
Package: 783-BBGA, FCBGA |
Stock5,312 |
|
|
|
NXP |
IC MPU MPC85XX 1.2GHZ 783FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.2GHz
- Co-Processors/DSP: Signal Processing; SPE
- RAM Controllers: DDR, DDR2, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (4)
- SATA: -
- USB: -
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
|
Package: 783-BBGA, FCBGA |
Stock5,568 |
|
|
|
NXP |
IC MPU MPC83XX 266MHZ 620BGA
- Core Processor: PowerPC e300
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 266MHz
- Co-Processors/DSP: Security; SEC
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (3)
- SATA: -
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 620-BBGA Exposed Pad
- Supplier Device Package: 620-PBGA (29x29)
|
Package: 620-BBGA Exposed Pad |
Stock3,472 |
|
|
|
NXP |
IC MPU MPC8XX 66MHZ 256BGA
- Core Processor: MPC8xx
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 66MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100 Mbps (2)
- SATA: -
- USB: USB 2.0 (1)
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 95°C (TA)
- Security Features: -
- Package / Case: 256-BBGA
- Supplier Device Package: 256-PBGA (23x23)
|
Package: 256-BBGA |
Stock3,552 |
|
|
|
NXP |
IC MPU MPC74XX 400MHZ 360FCCBGA
- Core Processor: PowerPC G4
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 400MHz
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 360-BCBGA, FCCBGA
- Supplier Device Package: 360-FCCBGA (25x25)
|
Package: 360-BCBGA, FCCBGA |
Stock6,096 |
|
|
|
NXP |
IC MPU MPC83XX 266MHZ 516BGA
- Core Processor: PowerPC e300c2
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 266MHz
- Co-Processors/DSP: Communications; QUICC Engine
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100 Mbps (3)
- SATA: -
- USB: USB 2.0 (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 516-BBGA
- Supplier Device Package: 516-FPBGA (27x27)
|
Package: 516-BBGA |
Stock6,112 |
|
|
|
NXP |
IC MCU 32BIT 128KB FLASH 80LQFP
- Core Processor: Coldfire V1
- Core Size: 32-Bit
- Speed: 50MHz
- Connectivity: I2C, SCI, SPI
- Peripherals: DMA, LVD, PWM, WDT
- Number of I/O: 69
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 16K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 24x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 80-LQFP
- Supplier Device Package: 80-LQFP (14x14)
|
Package: 80-LQFP |
Stock5,712 |
|
|
|
NXP |
IC MCU 8BIT 12KB FLASH 64LQFP
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: IRSCI, SPI
- Peripherals: LCD, LVD, POR, PWM
- Number of I/O: 32
- Program Memory Size: 12KB (12K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512 x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 6x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
|
Package: 64-LQFP |
Stock2,512 |
|
|
|
NXP |
IC MCU 32BIT ROMLESS 144LQFP
- Core Processor: CPU32
- Core Size: 32-Bit
- Speed: 16.78MHz
- Connectivity: EBI/EMI, SCI, SPI, UART/USART
- Peripherals: POR, PWM, WDT
- Number of I/O: 15
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
|
Package: 144-LQFP |
Stock5,952 |
|
|
|
NXP |
IC MCU 32BIT ROMLESS 160QFP
- Core Processor: CPU32
- Core Size: 32-Bit
- Speed: 20MHz
- Connectivity: CAN, EBI/EMI, SCI, SPI
- Peripherals: POR, PWM, WDT
- Number of I/O: 18
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 7.5K x 8
- Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V
- Data Converters: A/D 16x10b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 160-BQFP
- Supplier Device Package: 160-QFP (28x28)
|
Package: 160-BQFP |
Stock5,040 |
|
|
|
NXP |
IC MCU 32BIT 1.5MB FLASH 176LQFP
- Core Processor: e200z1
- Core Size: 32-Bit
- Speed: 66MHz
- Connectivity: CAN, EBI/EMI, I2C, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 137
- Program Memory Size: 1.5MB (1.5M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V
- Data Converters: A/D 40x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 176-LQFP
- Supplier Device Package: 176-LQFP (24x24)
|
Package: 176-LQFP |
Stock6,640 |
|
|
|
NXP |
IC MCU 32BIT 32KB FLASH 64LQFP
- Core Processor: ARM? Cortex?-M0+
- Core Size: 32-Bit
- Speed: 40MHz
- Connectivity: I2C, SPI, UART/USART
- Peripherals: LVD, PWM, WDT
- Number of I/O: 57
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 256 x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 16x12b, D/A 2x6b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
|
Package: 64-LQFP |
Stock6,816 |
|
|
|
NXP |
IC MCU 32BIT ROMLESS 360PBGA
- Core Processor: Coldfire V4
- Core Size: 32-Bit
- Speed: 266MHz
- Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
- Peripherals: DMA, WDT
- Number of I/O: 132
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 1.35 V ~ 3.6 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: -
- Package / Case: 360-BBGA
- Supplier Device Package: 360-PBGA (23x23)
|
Package: 360-BBGA |
Stock189,984 |
|
|
|
NXP |
IC TEMP SENSOR DO34
- Resistance in Ohms @ 25°C: 975
- Resistance Tolerance: -
- Operating Temperature: -55°C ~ 175°C
- Power - Max: -
- Mounting Type: Through Hole
- Package / Case: DO-204AG, DO-34, Axial
- Supplier Device Package: DO-34
|
Package: DO-204AG, DO-34, Axial |
Stock3,510 |
|
|
|
NXP |
ACCELEROMETER 16-SOIC
- Type: Digital
- Axis: -
- Acceleration Range: -
- Sensitivity (LSB/g): 1
- Sensitivity (mV/g): -
- Bandwidth: -
- Output Type: -
- Voltage - Supply: -
- Features: -
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 16-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 16-SOIC
|
Package: 16-SOIC (0.295", 7.50mm Width) |
Stock2,538 |
|
|
|
NXP |
IC TXRX NFC COMPLIANT 32HVQFN
- Type: RFID Reader/Transponder
- Frequency: 13.56MHz
- Standards: FeliCa, ISO 14443, MIFARE, NFC
- Interface: I2C, SPI, UART
- Voltage - Supply: 2.5 V ~ 3.6 V
- Operating Temperature: -40°C ~ 90°C
- Package / Case: 32-VFQFN Exposed Pad
- Supplier Device Package: 32-HVQFN (5x5)
|
Package: 32-VFQFN Exposed Pad |
Stock5,328 |
|
|
|
NXP |
RF TXRX MODULE 802.15.4 U.FL ANT
- RF Family/Standard: 802.15.4
- Protocol: Zigbee?
- Modulation: -
- Frequency: 2.4GHz
- Data Rate: -
- Power - Output: 2.5dBm
- Sensitivity: -96dBm
- Serial Interfaces: I2C, SPI, UART
- Antenna Type: Not Included, U.FL
- Memory Size: 192kB ROM, 96kB RAM
- Voltage - Supply: 2.2 V ~ 3.6 V
- Current - Receiving: 37mA
- Current - Transmitting: 37mA
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C
- Package / Case: Module
|
Package: Module |
Stock2,952 |
|
|
|
NXP |
QORIQ 2X E5500 1500MHZ DDR3L/
- Core Processor: -
- Number of Cores/Bus Width: -
- Speed: -
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: -
- Operating Temperature: -
- Security Features: -
- Package / Case: -
- Supplier Device Package: -
|
Package: - |
Stock2,016 |
|
|
|
NXP |
MAGNIV S12 RELAY DRIVER 2X HS/L
- Core Processor: S12
- Core Size: 16-Bit
- Speed: 20MHz
- Connectivity: LINbus, SCI, SPI
- Peripherals: POR, PWM, WDT
- Number of I/O: 3
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Data Converters: A/D 15x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
|
Package: - |
Stock6,384 |
|
|
|
NXP |
IC MCU 8BIT 8KB FLASH 16TSSOP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 20MHz
- Connectivity: I2C, LINbus, SPI, UART/USART
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 14
- Program Memory Size: 8KB (8K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
- Data Converters: A/D 8x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 16-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 16-TSSOP
|
Package: - |
Request a Quote |
|
|
|
NXP |
SAF4000EL
- Type: -
- Interface: -
- Clock Rate: -
- Non-Volatile Memory: -
- On-Chip RAM: -
- Voltage - I/O: -
- Voltage - Core: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
|
Package: - |
Request a Quote |
|
|
|
NXP |
IC
- Number of Bits: 24
- Number of Channels: 8
- Power (Watts): 150 mW
- Voltage - Supply, Analog: 3V ~ 3.6V
- Voltage - Supply, Digital: 3V ~ 3.6V
- Package / Case: 64-VFQFN Exposed Pad
- Supplier Device Package: 64-HVQFN (9x9)
|
Package: - |
Request a Quote |
|
|
|
NXP |
RF MOSFET GAN 48V NI780
- Transistor Type: GaN
- Frequency: 2.4GHz ~ 2.5GHz
- Gain: 15.2dB
- Voltage - Test: 48 V
- Current Rating: -
- Noise Figure: -
- Current - Test: -
- Power - Output: 300W
- Voltage - Rated: 125 V
- Package / Case: NI-780-4
- Supplier Device Package: NI-780-4
|
Package: - |
Request a Quote |
|