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NXP |
TRANS NPN 65V 0.1A SOT416
- Transistor Type: NPN
- Current - Collector (Ic) (Max): 100mA
- Voltage - Collector Emitter Breakdown (Max): 65V
- Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
- Current - Collector Cutoff (Max): 15nA (ICBO)
- DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 5V
- Power - Max: 150mW
- Frequency - Transition: 100MHz
- Operating Temperature: 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: SC-75, SOT-416
- Supplier Device Package: SC-75
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Package: SC-75, SOT-416 |
Stock7,856 |
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NXP |
TRANS NPN 65V 0.1A SOT416
- Transistor Type: NPN
- Current - Collector (Ic) (Max): 100mA
- Voltage - Collector Emitter Breakdown (Max): 65V
- Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
- Current - Collector Cutoff (Max): 15nA (ICBO)
- DC Current Gain (hFE) (Min) @ Ic, Vce: 110 @ 2mA, 5V
- Power - Max: 150mW
- Frequency - Transition: 100MHz
- Operating Temperature: 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: SC-75, SOT-416
- Supplier Device Package: SC-75
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Package: SC-75, SOT-416 |
Stock6,352 |
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NXP |
IC PQF7981AHN 32HVQFN
- Type: -
- Applications: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock3,680 |
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NXP |
IC TOPFET HIGH SIDE SW D2PAK
- Switch Type: General Purpose
- Number of Outputs: 1
- Ratio - Input:Output: 1:1
- Output Configuration: High Side
- Output Type: N-Channel
- Interface: On/Off
- Voltage - Load: 5 V ~ 40 V
- Voltage - Supply (Vcc/Vdd): Not Required
- Current - Output (Max): 6A
- Rds On (Typ): 45 mOhm
- Input Type: Non-Inverting
- Features: Status Flag
- Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage, UVLO
- Operating Temperature: 150°C (TJ)
- Package / Case: TO-263-5, D2Pak (4 Leads + Tab), TO-263BB
- Supplier Device Package: SOT-426
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Package: TO-263-5, D2Pak (4 Leads + Tab), TO-263BB |
Stock5,904 |
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NXP |
IC GATE NAND 4CH 2-INP 14-DIP
- Logic Type: NAND Gate
- Number of Circuits: 4
- Number of Inputs: 2
- Features: Schmitt Trigger
- Voltage - Supply: 4.5 V ~ 5.5 V
- Current - Quiescent (Max): -
- Current - Output High, Low: 1mA, 20mA
- Logic Level - Low: 0.8V
- Logic Level - High: 2V
- Max Propagation Delay @ V, Max CL: 8.5ns @ 5V, 50pF
- Operating Temperature: 0°C ~ 70°C
- Mounting Type: Through Hole
- Supplier Device Package: 14-DIP
- Package / Case: 14-DIP (0.300", 7.62mm)
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Package: 14-DIP (0.300", 7.62mm) |
Stock6,304 |
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NXP |
IC PCI-EXPRESS X1 PHY 81-LFBGA
- Applications: PCI Express MAX to PCI Express PHY
- Interface: IEEE 1149.1
- Voltage - Supply: 1.2V
- Package / Case: 81-LFBGA
- Supplier Device Package: 81-LFBGA (9x9)
- Mounting Type: Surface Mount
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Package: 81-LFBGA |
Stock4,976 |
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NXP |
IC MPU MPC83XX 533MHZ 672TBGA
- Core Processor: PowerPC e300
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 533MHz
- Co-Processors/DSP: Security; SEC
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: -
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 672-LBGA
- Supplier Device Package: 672-TBGA (35x35)
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Package: 672-LBGA |
Stock4,160 |
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NXP |
IC MPU MPC8XX 50MHZ 357BGA
- Core Processor: MPC8xx
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 50MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (1), 10/100 Mbps (1)
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 95°C (TA)
- Security Features: -
- Package / Case: 357-BBGA
- Supplier Device Package: 357-PBGA (25x25)
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Package: 357-BBGA |
Stock2,768 |
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NXP |
IC MCU 32BIT 128KB FLASH 64LQFP
- Core Processor: Coldfire V2
- Core Size: 32-Bit
- Speed: 50MHz
- Connectivity: I2C, SPI, UART/USART, USB OTG
- Peripherals: DMA, LVD, POR, PWM, WDT
- Number of I/O: 56
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
- Data Converters: A/D 8x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
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Package: 64-LQFP |
Stock2,064 |
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NXP |
IC MCU 8BIT 1.5KB FLASH 8SOIC
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 2MHz
- Connectivity: -
- Peripherals: LVD, POR, PWM
- Number of I/O: 5
- Program Memory Size: 1.5KB (1.5K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128 x 8
- Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 8-SOIC (0.209", 5.30mm Width)
- Supplier Device Package: 8-SOIC
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Package: 8-SOIC (0.209", 5.30mm Width) |
Stock2,256 |
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NXP |
IC MCU 16BIT 128KB FLASH 52LQFP
- Core Processor: HCS12
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: CAN, EBI/EMI, SCI, SPI
- Peripherals: POR, PWM, WDT
- Number of I/O: 35
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 52-LQFP
- Supplier Device Package: 52-LQFP (10x10)
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Package: 52-LQFP |
Stock2,592 |
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NXP |
IC MCU 16BIT 512KB FLASH 144LQFP
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 80MHz
- Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
- Peripherals: LCD, Motor control PWM, POR, PWM, WDT
- Number of I/O: 117
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
- Data Converters: A/D 16x8/10b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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Package: 144-LQFP |
Stock4,784 |
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NXP |
IC MCU 16BIT 192KB FLASH 100LQFP
- Core Processor: 12V1
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: CAN, IrDA, LIN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 86
- Program Memory Size: 192KB (192K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 11K x 8
- Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
- Data Converters: A/D 16x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
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Package: 100-LQFP |
Stock7,568 |
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NXP |
IC MCU 16BIT 96KB FLASH 64LQFP
- Core Processor: 12V1
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: CAN, IrDA, LIN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 54
- Program Memory Size: 96KB (96K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 3K x 8
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
- Data Converters: A/D 12x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
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Package: 64-LQFP |
Stock7,568 |
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NXP |
IC MCU 32BIT 16KB FLASH 48LQFP
- Core Processor: ARM? Cortex?-M3
- Core Size: 32-Bit
- Speed: 72MHz
- Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
- Peripherals: Brown-out Detect/Reset, POR, WDT
- Number of I/O: 42
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP |
Stock2,992 |
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NXP |
IC MCU 32BIT 8KB FLASH 33HVQFN
- Core Processor: ARM? Cortex?-M0
- Core Size: 32-Bit
- Speed: 50MHz
- Connectivity: I2C, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, POR, WDT
- Number of I/O: 28
- Program Memory Size: 8KB (8K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 32-VQFN Exposed Pad
- Supplier Device Package: 32-HVQFN (7x7)
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Package: 32-VQFN Exposed Pad |
Stock7,408 |
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NXP |
IC MCU 32BIT 16KB FLASH 32QFN
- Core Processor: ARM? Cortex?-M0+
- Core Size: 32-Bit
- Speed: 48MHz
- Connectivity: I2C, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
- Number of I/O: 28
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 14x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 32-VFQFN Exposed Pad
- Supplier Device Package: 32-QFN (5x5)
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Package: 32-VFQFN Exposed Pad |
Stock3,808 |
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NXP |
IC MCU 32BIT 128KB FLASH 48QFN
- Core Processor: ARM? Cortex?-M0+
- Core Size: 32-Bit
- Speed: 48MHz
- Connectivity: I2C, LIN, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O: 40
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 16K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D - 16bit, D/A - 12bit
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 48-VFQFN Exposed Pad
- Supplier Device Package: 48-QFN (7x7)
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Package: 48-VFQFN Exposed Pad |
Stock5,952 |
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NXP |
IC MCU 32BIT 16KB FLASH 32LQFP
- Core Processor: ARM? Cortex?-M0+
- Core Size: 32-Bit
- Speed: 48MHz
- Connectivity: I2C, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
- Number of I/O: 28
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 14x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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Package: 32-LQFP |
Stock7,520 |
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NXP |
IC RTC CLK/CALENDAR I2C DIE
- Type: Clock/Calendar
- Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
- Memory Size: -
- Time Format: HH:MM:SS (24 hr)
- Date Format: YY-MM-DD-dd
- Interface: I2C, 2-Wire Serial
- Voltage - Supply: 1 V ~ 5.5 V
- Voltage - Supply, Battery: -
- Current - Timekeeping (Max): 0.6µA ~ 0.75µA @ 2V ~ 5V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: Die
- Supplier Device Package: Die
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Package: Die |
Stock4,896 |
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NXP |
SENSOR PRESSURE 8SOP AXIAL PORT
- Pressure Type: Compound
- Operating Pressure: ±0.29 PSI (±2 kPa)
- Output Type: Analog Voltage
- Output: 0.5 V ~ 4.5 V
- Accuracy: ±5%
- Voltage - Supply: 4.75 V ~ 5.25 V
- Port Size: Male - 0.13" (3.17mm) Tube
- Port Style: Barbless
- Features: Temperature Compensated
- Termination Style: PCB
- Maximum Pressure: ±10.88 PSI (±75 kPa)
- Operating Temperature: 10°C ~ 60°C
- Package / Case: 8-SMD, Gull Wing, Top Port
- Supplier Device Package: -
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Package: 8-SMD, Gull Wing, Top Port |
Stock13,530 |
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NXP |
ACCEL 100G DSI/SPI 16SOIC
- Type: Digital
- Axis: Z
- Acceleration Range: ±100g
- Sensitivity (LSB/g): 4
- Sensitivity (mV/g): -
- Bandwidth: -
- Output Type: DSI, SPI
- Voltage - Supply: 6.3 V ~ 30 V
- Features: -
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 16-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 16-SOIC
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Package: 16-SOIC (0.295", 7.50mm Width) |
Stock2,556 |
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NXP |
ACCELEROMETER 112.5G ANAL 16SOIC
- Type: Analog
- Axis: X
- Acceleration Range: ±112.5g
- Sensitivity (LSB/g): -
- Sensitivity (mV/g): 20
- Bandwidth: 400Hz
- Output Type: Analog Voltage
- Voltage - Supply: 4.75 V ~ 5.25 V
- Features: -
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 16-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 16-SOIC
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Package: 16-SOIC (0.295", 7.50mm Width) |
Stock8,082 |
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NXP |
BOARD EVAL NFC PN512
- Type: Near Field Communication
- Frequency: 13.56MHz
- For Use With/Related Products: PN512
- Supplied Contents: Board
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Package: - |
Stock8,568 |
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NXP |
RF TXRX MODULE 802.15.4 U.FL ANT
- RF Family/Standard: 802.15.4
- Protocol: Zigbee?
- Modulation: -
- Frequency: 2.4GHz
- Data Rate: -
- Power - Output: 19dBm
- Sensitivity: -100dBm
- Serial Interfaces: I2C, SPI, UART
- Antenna Type: Not Included, U.FL
- Memory Size: 192kB ROM, 96kB RAM
- Voltage - Supply: 2.2 V ~ 3.6 V
- Current - Receiving: 45mA
- Current - Transmitting: 125mA
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C
- Package / Case: Module
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Package: Module |
Stock4,860 |
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NXP |
I.MX RT1062 MPU 196MAPBGA
- Core Processor: ARM® Cortex®-M7
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 528MHz
- Co-Processors/DSP: -
- RAM Controllers: SDRAM
- Graphics Acceleration: Yes
- Display & Interface Controllers: LCD
- Ethernet: 10/100Mbps (1)
- SATA: -
- USB: USB 2.0 OTG + PHY (2)
- Voltage - I/O: 1.8V, 2.8V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TJ)
- Security Features: BEE, DCP, HAB, SJC, SNVS, TRNG
- Package / Case: 196-LFBGA
- Supplier Device Package: 196-MAPBGA (12x12)
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Package: 196-LFBGA |
Stock7,072 |
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NXP |
IC
- Architecture: -
- Core Processor: -
- Flash Size: -
- RAM Size: -
- Peripherals: -
- Connectivity: -
- Speed: -
- Primary Attributes: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
IC MCU 32BIT 4MB FLASH 176LQFP
- Core Processor: e200z2, e200z4
- Core Size: 32-Bit Dual-Core
- Speed: 80MHz, 160MHz
- Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
- Peripherals: DMA, LVD, POR, WDT
- Number of I/O: 129
- Program Memory Size: 4MB (4M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512K x 8
- Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
- Data Converters: A/D 48x10b, 16x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 176-LQFP Exposed Pad
- Supplier Device Package: 176-LQFP (24x24)
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Package: - |
Request a Quote |
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