Page 398 - NXP Products | Heisener Electronics

PMBFJ174,215
NXP

JFET P-CH 30V 0.3W SOT23

Package: TO-236-3, SC-59, SOT-23-3

Stock4,368
PMBF4393,215
NXP

JFET N-CH 40V 250MW SOT23

Package: TO-236-3, SC-59, SOT-23-3

Stock98,394
PHB176NQ04T,118
NXP

MOSFET N-CH 40V 75A D2PAK

Package: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

Stock3,200
BSS83,215
NXP

MOSFET N-CH 10V 50MA SOT-143B

Package: TO-253-4, TO-253AA

Stock6,496
PDTB123YK,115
NXP

TRANS PREBIAS PNP 250MW SMT3

Package: TO-236-3, SC-59, SOT-23-3

Stock5,376
BZX84-C6V8/LF1R
NXP

DIODE ZENER TO-236AB SOT23

Package: TO-236-3, SC-59, SOT-23-3

Stock5,776
UJA1076ATW/3V3,112
NXP

IC SBC CAN/LIN 3.3V HS 32HTSSOP

Package: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

Stock7,968
PCA9515ADP,118
NXP

IC REDRIVER I2C 1CH 8TSSOP

Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

Stock110,106
PCA9554N,112
NXP

IC I/O EXPANDER I2C 8B 16DIP

Package: 16-DIP (0.300", 7.62mm)

Stock5,360
PCA9555DB,118
NXP

IC I/O EXPANDER I2C 16B 24SSOP

Package: 24-SSOP (0.209", 5.30mm Width)

Stock4,784
P1013NSN2EFB
NXP

IC MPU Q OR IQ 1.055GHZ 689TBGA

Package: 689-BBGA Exposed Pad

Stock4,720
MPC885VR66
NXP

IC MPU MPC8XX 66MHZ 357BGA

Package: 357-BBGA

Stock3,488
P1020NSE2DFB
NXP

IC MPU Q OR IQ 800MHZ 689TEBGA

Package: 689-BBGA Exposed Pad

Stock6,960
P89LPC915HDH,129
NXP

IC MCU 8BIT 2KB FLASH 14TSSOP

Package: 14-TSSOP (0.173", 4.40mm Width)

Stock5,808
SPC5517EBMLQ66
NXP

IC MCU 32BIT 1.5MB FLASH 144LQFP

Package: 144-LQFP

Stock6,880
LPC1837FET256,551
NXP

IC MCU 32BIT 1MB FLASH 256LBGA

Package: 256-LBGA

Stock7,200
MSC8101M1375F
NXP

DSP 16BIT 275MHZ CPM 332FCBGA

Package: 332-BFBGA, FCPBGA

Stock5,920
MCZ33903DP3EK
NXP

SYSTEM BASIS CHIP 2X 3.3 V/400M

Package: -

Stock6,320
MC33772BTC0AE
NXP

BCC6

Package: 48-LQFP Exposed Pad

Stock6,132
SPC5744PK1AMLQ8R
NXP

2.5MB NVM 2 X E200Z4 CORES 180

Package: 144-LQFP

Stock7,632

Part Number	Manufacturer	Description	Package	Stock
PMBFJ174,215	NXP	JFET P-CH 30V 0.3W SOT23 FET Type: P-Channel Voltage - Breakdown (V(BR)GSS): 30V Drain to Source Voltage (Vdss): 30V Current - Drain (Idss) @ Vds (Vgs=0): 20mA @ 15V Current Drain (Id) - Max: - Voltage - Cutoff (VGS off) @ Id: 5V @ 10nA Input Capacitance (Ciss) (Max) @ Vds: 8pF @ 10V (VGS) Resistance - RDS(On): 85 Ohm Power - Max: 300mW Operating Temperature: 150°C (TJ) Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SOT-23 (TO-236AB)	Package: TO-236-3, SC-59, SOT-23-3	Stock4,368
PMBF4393,215	NXP	JFET N-CH 40V 250MW SOT23 FET Type: N-Channel Voltage - Breakdown (V(BR)GSS): 40V Drain to Source Voltage (Vdss): 40V Current - Drain (Idss) @ Vds (Vgs=0): 5mA @ 20V Current Drain (Id) - Max: - Voltage - Cutoff (VGS off) @ Id: 500mV @ 1nA Input Capacitance (Ciss) (Max) @ Vds: 14pF @ 20V Resistance - RDS(On): 100 Ohm Power - Max: 250mW Operating Temperature: 150°C (TJ) Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SOT-23 (TO-236AB)	Package: TO-236-3, SC-59, SOT-23-3	Stock98,394
PHB176NQ04T,118	NXP	MOSFET N-CH 40V 75A D2PAK FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 40V Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Drive Voltage (Max Rds On, Min Rds On): 10V Vgs(th) (Max) @ Id: 4V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 68.9nC @ 10V Input Capacitance (Ciss) (Max) @ Vds: 3620pF @ 25V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 250W (Tc) Rds On (Max) @ Id, Vgs: 4.3 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Surface Mount Supplier Device Package: D2PAK Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB	Package: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB	Stock3,200
BSS83,215	NXP	MOSFET N-CH 10V 50MA SOT-143B Transistor Type: N-Channel Frequency: - Gain: - Voltage - Test: - Current Rating: 50mA Noise Figure: - Current - Test: - Power - Output: - Voltage - Rated: 10V Package / Case: TO-253-4, TO-253AA Supplier Device Package: SOT-143B	Package: TO-253-4, TO-253AA	Stock6,496
PDTB123YK,115	NXP	TRANS PREBIAS PNP 250MW SMT3 Transistor Type: PNP - Pre-Biased Current - Collector (Ic) (Max): 500mA Voltage - Collector Emitter Breakdown (Max): 50V Resistor - Base (R1) (Ohms): 2.2k Resistor - Emitter Base (R2) (Ohms): 10k DC Current Gain (hFE) (Min) @ Ic, Vce: 70 @ 50mA, 5V Vce Saturation (Max) @ Ib, Ic: 300mV @ 2.5mA, 50mA Current - Collector Cutoff (Max): 500nA Frequency - Transition: - Power - Max: 250mW Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	Package: TO-236-3, SC-59, SOT-23-3	Stock5,376
BZX84-C6V8/LF1R	NXP	DIODE ZENER TO-236AB SOT23 Voltage - Zener (Nom) (Vz): 6.8V Tolerance: ±5% Power - Max: 250mW Impedance (Max) (Zzt): 15 Ohms Current - Reverse Leakage @ Vr: 2µA @ 4V Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	Package: TO-236-3, SC-59, SOT-23-3	Stock5,776
UJA1076ATW/3V3,112	NXP	IC SBC CAN/LIN 3.3V HS 32HTSSOP Applications: Automotive Interface: SPI Serial Voltage - Supply: 4.5 V ~ 28 V Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Supplier Device Package: 32-HTSSOP Mounting Type: Surface Mount	Package: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad	Stock7,968
PCA9515ADP,118	NXP	IC REDRIVER I2C 1CH 8TSSOP Type: Buffer, ReDriver Applications: I2C Input: 2-Wire Bus Output: 2-Wire Bus Data Rate (Max): 400kHz Number of Channels: 1 Delay Time: - Signal Conditioning: - Capacitance - Input: 6pF Voltage - Supply: 2.3 V ~ 3.6 V Current - Supply: 800µA Operating Temperature: -40°C ~ 85°C Mounting Type: - Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Supplier Device Package: 8-TSSOP	Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)	Stock110,106
PCA9554N,112	NXP	IC I/O EXPANDER I2C 8B 16DIP Number of I/O: 8 Interface: I2C, SMBus Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	Package: 16-DIP (0.300", 7.62mm)	Stock5,360
PCA9555DB,118	NXP	IC I/O EXPANDER I2C 16B 24SSOP Number of I/O: 16 Interface: I2C, SMBus Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-SSOP (0.209", 5.30mm Width) Supplier Device Package: 24-SSOP	Package: 24-SSOP (0.209", 5.30mm Width)	Stock4,784
P1013NSN2EFB	NXP	IC MPU Q OR IQ 1.055GHZ 689TBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.055GHz Co-Processors/DSP: - RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	Package: 689-BBGA Exposed Pad	Stock4,720
MPC885VR66	NXP	IC MPU MPC8XX 66MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (3), 10/100 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: Cryptography Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	Package: 357-BBGA	Stock3,488
P1020NSE2DFB	NXP	IC MPU Q OR IQ 800MHZ 689TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	Package: 689-BBGA Exposed Pad	Stock6,960
P89LPC915HDH,129	NXP	IC MCU 8BIT 2KB FLASH 14TSSOP Core Processor: 8051 Core Size: 8-Bit Speed: 18MHz Connectivity: I2C, UART/USART Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT Number of I/O: 12 Program Memory Size: 2KB (2K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: A/D 4x8b; D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 14-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 14-TSSOP	Package: 14-TSSOP (0.173", 4.40mm Width)	Stock5,808
SPC5517EBMLQ66	NXP	IC MCU 32BIT 1.5MB FLASH 144LQFP Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Speed: 66MHz Connectivity: CAN, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 111 Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 80K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V Data Converters: A/D 40x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	Package: 144-LQFP	Stock6,880
LPC1837FET256,551	NXP	IC MCU 32BIT 1MB FLASH 256LBGA Core Processor: ARM? Cortex?-M3 Core Size: 32-Bit Speed: 150MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, Microwire, SD, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 80 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 136K x 8 Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V Data Converters: A/D 16x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-LBGA (17x17)	Package: 256-LBGA	Stock7,200
MSC8101M1375F	NXP	DSP 16BIT 275MHZ CPM 332FCBGA Type: SC140 Core Interface: Communications Processor Module (CPM) Clock Rate: 275MHz Non-Volatile Memory: External On-Chip RAM: 512kB Voltage - I/O: 3.30V Voltage - Core: 1.60V Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 332-BFBGA, FCPBGA Supplier Device Package: 332-FCBGA (17x17)	Package: 332-BFBGA, FCPBGA	Stock5,920
MCZ33903DP3EK	NXP	SYSTEM BASIS CHIP 2X 3.3 V/400M Applications: System Basis Chip Interface: CAN, LIN Voltage - Supply: 5.5 V ~ 28 V Package / Case: - Supplier Device Package: - Mounting Type: -	Package: -	Stock6,320
MC33772BTC0AE	NXP	BCC6 Function: Battery Cell Controller Battery Chemistry: Lithium-Ion Number of Cells: 3 ~ 6 Fault Protection: Over/Under Voltage Interface: SPI Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP (7x7)	Package: 48-LQFP Exposed Pad	Stock6,132
SPC5744PK1AMLQ8R	NXP	2.5MB NVM 2 X E200Z4 CORES 180 Core Processor: e200z4 Core Size: 32-Bit Dual-Core Speed: 180MHz Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Number of I/O: 79 Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 384K x 8 Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V Data Converters: A/D 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	Package: 144-LQFP	Stock7,632
SPC5605BK0CLL4	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 77 Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 7x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	Package: 100-LQFP	Stock6,384
MC35FS6508CAE	NXP	SYSTEM BASIS CHIP, DCDC 0.8A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	Package: -	Request a Quote
MCIMX280DVM4CR	NXP	IC MPU I.MX28 454MHZ 289MAPBGA Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 454MHz Co-Processors/DSP: Data; DCP RAM Controllers: DDR2, LVDDR, LVDDR2 Graphics Acceleration: No Display & Interface Controllers: Keypad, Touchscreen Ethernet: 10/100Mbps (1) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.8V, 3.3V Operating Temperature: -20°C ~ 70°C (TA) Security Features: Boot Security, Cryptography, Hardware ID Package / Case: 289-LFBGA Supplier Device Package: 289-MAPBGA (14x14)	Package: -	Request a Quote
BT234-600D-127	NXP	TRIAC 600V 4A TO220AB Triac Type: Standard Voltage - Off State: 600 V Current - On State (It (RMS)) (Max): 4 A Voltage - Gate Trigger (Vgt) (Max): 1 V Current - Non Rep. Surge 50, 60Hz (Itsm): 35A @ 50Hz Current - Gate Trigger (Igt) (Max): 10 mA Current - Hold (Ih) (Max): 6 mA Configuration: Single Operating Temperature: 125°C (TJ) Mounting Type: Through Hole Package / Case: TO-220-3 Supplier Device Package: TO-220AB	Package: -	Request a Quote
FS32K146HRT0MMHT	NXP	IC MCU 32BIT 1MB FLASH 100MAPBGA Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Speed: 80MHz Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 89 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b SAR; D/A1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 100-LFBGA Supplier Device Package: 100-MAPBGA (11x11)	Package: -	Request a Quote
BC847C-AU-215	NXP	SMALL SIGNAL BIPOLAR TRANSISTOR Transistor Type: NPN Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 45 V Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA Current - Collector Cutoff (Max): 15nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V Power - Max: 250 mW Frequency - Transition: 100MHz Operating Temperature: 150°C (TJ) Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SOT23-3 (TO-236)	Package: -	Request a Quote
FS32K146HRT0VLLT	NXP	IC MCU 32BIT 1MB FLASH 100LQFP Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Speed: 80MHz Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 89 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b SAR; D/A1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	Package: -	Request a Quote
SAF775DHV-N208Q-FK	NXP	CAR RADIO TUNER & AUDIO DSP Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote