Page 419 - NXP Products | Heisener Electronics

PHP176NQ04T,127
NXP

MOSFET N-CH 40V 75A TO220AB

Package: TO-220-3

Stock2,400
PBLS4002V,115
NXP

TRANS NPN PREBIAS/PNP SOT666

Package: SOT-563, SOT-666

Stock3,792
BYD17D,115
NXP

DIODE AVALANCHE 200V 1.5A MELF

Package: SOD-87

Stock4,880
PCA9306GM,125
NXP

IC LEVEL TRANSLATOR 8-XQFN

Package: 8-XFQFN Exposed Pad

Stock100,200
74HCT688DB,118
NXP

IC COMPARATOR MAGNITUDE 20SSOP

Package: 20-SSOP (0.209", 5.30mm Width)

Stock7,488
TDA9887T/V4,112
NXP

IC IF-PLL I2C-BUS DEMOD 24-SOIC

Package: 24-SOIC (0.295", 7.50mm Width)

Stock5,376
TDA18250HN/C1,518
NXP

IC DGTL CABLE SIL TUNER 48HVQFN

Package: 48-VFQFN Exposed Pad

Stock6,368
SC16C554DBIA68,518
NXP

IC UART QUAD 68PLCC

Package: 68-LCC (J-Lead)

Stock2,192
KMC8360ECVVAJDGA
NXP

IC MPU MPC83XX 533MHZ 740TBGA

Package: 740-LBGA

Stock5,568
KMPC8250AVVPIBC
NXP

IC MPU MPC82XX 300MHZ 408TBGA

Package: 480-LBGA

Stock2,544
MCIMX6D6AVT10ACR
NXP

IC MPU I.MX6D 1.0GHZ 624FCBGA

Package: 624-FBGA, FCBGA

Stock5,424
MC68HC908GR4CFA
NXP

IC MCU 8BIT 4KB FLASH 32LQFP

Package: 32-LQFP

Stock5,936
MC908AZ60AMFU
NXP

IC MCU 8BIT 60KB FLASH 64QFP

Package: 64-QFP

Stock6,704
MC9S08QG8CDTE
NXP

IC MCU 8BIT 8KB FLASH 16TSSOP

Package: 16-TSSOP (0.173", 4.40mm Width)

Stock248,688
MPX4400AP
NXP

SENSOR ABS PRESS 56.6 PSI MAX

Package: -

Stock6,246
MMA5106NPKGCWR2
NXP

ACCELEROMETER DSI2.5 16QFN

Package: -

Stock7,110
PCF7991AT/1081,112
NXP

IC AVIC ADV BASESTATION 14SOIC

Package: -

Stock8,784
MF0MOU2101DA4,118
NXP

IC MIFARE ULTRALIGHT FCP PLLMC

Package: MOA4, Smart Card Module

Stock8,154
HTMS8101FTB/AF,115
NXP

RFID HTAG ADVANCED 3XSON

Package: -

Stock8,352
JN5148/001,531
NXP

IC RF TXRX+MCU 802.15.4 56-VFQFN

Package: 56-VFQFN

Stock2,430

Part Number	Manufacturer	Description	Package	Stock
PHP176NQ04T,127	NXP	MOSFET N-CH 40V 75A TO220AB FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 40V Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Drive Voltage (Max Rds On, Min Rds On): 10V Vgs(th) (Max) @ Id: 4V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 68.9nC @ 10V Input Capacitance (Ciss) (Max) @ Vds: 3620pF @ 25V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 250W (Tc) Rds On (Max) @ Id, Vgs: 4.3 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Through Hole Supplier Device Package: TO-220AB Package / Case: TO-220-3	Package: TO-220-3	Stock2,400
PBLS4002V,115	NXP	TRANS NPN PREBIAS/PNP SOT666 Transistor Type: 1 NPN Pre-Biased, 1 PNP Current - Collector (Ic) (Max): 100mA, 500mA Voltage - Collector Emitter Breakdown (Max): 50V, 40V Resistor - Base (R1) (Ohms): 4.7k Resistor - Emitter Base (R2) (Ohms): 4.7k DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 10mA, 5V / 150 @ 100mA, 2V Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 350mV @ 50mA, 500mA Current - Collector Cutoff (Max): 1µA Frequency - Transition: 300MHz Power - Max: 300mW Mounting Type: Surface Mount Package / Case: SOT-563, SOT-666 Supplier Device Package: SOT-666	Package: SOT-563, SOT-666	Stock3,792
BYD17D,115	NXP	DIODE AVALANCHE 200V 1.5A MELF Diode Type: Avalanche Voltage - DC Reverse (Vr) (Max): 200V Current - Average Rectified (Io): 1.5A Voltage - Forward (Vf) (Max) @ If: 1.05V @ 1A Speed: Standard Recovery >500ns, > 200mA (Io) Reverse Recovery Time (trr): 3µs Current - Reverse Leakage @ Vr: 1µA @ 200V Capacitance @ Vr, F: 21pF @ 0V, 1MHz Mounting Type: Surface Mount Package / Case: SOD-87 Supplier Device Package: MELF Operating Temperature - Junction: -65°C ~ 175°C	Package: SOD-87	Stock4,880
PCA9306GM,125	NXP	IC LEVEL TRANSLATOR 8-XQFN Translator Type: Voltage Level Channel Type: Bidirectional Number of Circuits: 1 Channels per Circuit: 2 Voltage - VCCA: 1V ~ 3.6V Voltage - VCCB: 1.8V ~ 5.5V Input Signal: - Output Signal: - Output Type: Open Drain Data Rate: - Operating Temperature: -40°C ~ 85°C (TA) Features: Auto-Direction Sensing Mounting Type: Surface Mount Package / Case: 8-XFQFN Exposed Pad Supplier Device Package: 8-XQFN (1.6x1.6)	Package: 8-XFQFN Exposed Pad	Stock100,200
74HCT688DB,118	NXP	IC COMPARATOR MAGNITUDE 20SSOP Type: Identity Comparator Number of Bits: 8 Output: Active Low Output Function: A=B Voltage - Supply: 4.5 V ~ 5.5 V Current - Output High, Low: 4mA, 4mA Max Propagation Delay @ V, Max CL: 34ns @ 4.5V, 50pF Current - Quiescent (Iq): 8µA Operating Temperature: -40°C ~ 125°C Package / Case: 20-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount	Package: 20-SSOP (0.209", 5.30mm Width)	Stock7,488
TDA9887T/V4,112	NXP	IC IF-PLL I2C-BUS DEMOD 24-SOIC Type: Demodulator Applications: TV Mounting Type: Surface Mount Package / Case: 24-SOIC (0.295", 7.50mm Width) Supplier Device Package: 24-SO	Package: 24-SOIC (0.295", 7.50mm Width)	Stock5,376
TDA18250HN/C1,518	NXP	IC DGTL CABLE SIL TUNER 48HVQFN Type: Tuner Applications: Set-Top Boxes Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (7x7)	Package: 48-VFQFN Exposed Pad	Stock6,368
SC16C554DBIA68,518	NXP	IC UART QUAD 68PLCC Features: - Number of Channels: 4, QUART FIFO's: 16 Byte Protocol: - Data Rate (Max): 5Mbps Voltage - Supply: 2.5V, 3.3V, 5V With Auto Flow Control: Yes With IrDA Encoder/Decoder: - With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC (24.23x24.23)	Package: 68-LCC (J-Lead)	Stock2,192
KMC8360ECVVAJDGA	NXP	IC MPU MPC83XX 533MHZ 740TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 533MHz Co-Processors/DSP: Communications; QUICC Engine, Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 740-LBGA Supplier Device Package: 740-TBGA (37.5x37.5)	Package: 740-LBGA	Stock5,568
KMPC8250AVVPIBC	NXP	IC MPU MPC82XX 300MHZ 408TBGA Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 300MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 480-LBGA Supplier Device Package: 408-TBGA (37.5x37.5)	Package: 480-LBGA	Stock2,544
MCIMX6D6AVT10ACR	NXP	IC MPU I.MX6D 1.0GHZ 624FCBGA Core Processor: ARM? Cortex?-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (1) SATA: SATA 3Gbps (1) USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21x21)	Package: 624-FBGA, FCBGA	Stock5,424
MC68HC908GR4CFA	NXP	IC MCU 8BIT 4KB FLASH 32LQFP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Number of I/O: 21 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 384 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 6x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	Package: 32-LQFP	Stock5,936
MC908AZ60AMFU	NXP	IC MCU 8BIT 60KB FLASH 64QFP Core Processor: HC08 Core Size: 8-Bit Speed: 8.4MHz Connectivity: CAN, SCI, SPI Peripherals: LVD, POR, PWM Number of I/O: 52 Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 15x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-QFP Supplier Device Package: 64-QFP (14x14)	Package: 64-QFP	Stock6,704
MC9S08QG8CDTE	NXP	IC MCU 8BIT 8KB FLASH 16TSSOP Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 12 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	Package: 16-TSSOP (0.173", 4.40mm Width)	Stock248,688
MPX4400AP	NXP	SENSOR ABS PRESS 56.6 PSI MAX Pressure Type: Absolute Operating Pressure: 2.9 PSI ~ 58.02 PSI (20 kPa ~ 400 kPa) Output Type: Analog Voltage Output: - Accuracy: ±1.5% Voltage - Supply: 4.85 V ~ 5.35 V Port Size: - Port Style: - Features: - Termination Style: - Maximum Pressure: 58.02 PSI (400 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: - Supplier Device Package: -	Package: -	Stock6,246
MMA5106NPKGCWR2	NXP	ACCELEROMETER DSI2.5 16QFN Type: - Axis: - Acceleration Range: - Sensitivity (LSB/g): - Sensitivity (mV/g): - Bandwidth: - Output Type: - Voltage - Supply: - Features: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock7,110
PCF7991AT/1081,112	NXP	IC AVIC ADV BASESTATION 14SOIC Type: - Frequency: - Standards: - Interface: - Voltage - Supply: - Operating Temperature: - Package / Case: - Supplier Device Package: -	Package: -	Stock8,784
MF0MOU2101DA4,118	NXP	IC MIFARE ULTRALIGHT FCP PLLMC Type: RFID Transponder Frequency: 13.56MHz Standards: ISO 14443, MIFARE, NFC Interface: - Voltage - Supply: - Operating Temperature: -25°C ~ 70°C Package / Case: MOA4, Smart Card Module Supplier Device Package: PLLMC	Package: MOA4, Smart Card Module	Stock8,154
HTMS8101FTB/AF,115	NXP	RFID HTAG ADVANCED 3XSON Style: Encapsulated Technology: Passive Frequency: 100kHz ~ 150kHz Memory Type: Read/Write Writable Memory: 1.76kb (User) Standards: ISO 11784, ISO 11785 Operating Temperature: - Size / Dimension: 3.00mm x 2.00mm x 0.85mm	Package: -	Stock8,352
JN5148/001,531	NXP	IC RF TXRX+MCU 802.15.4 56-VFQFN Type: TxRx + MCU RF Family/Standard: 802.15.4 Protocol: Zigbee? Modulation: O-QPSK Frequency: 2.4GHz Data Rate (Max): 667kbps Power - Output: 2.75dBm Sensitivity: -96.5dBm Memory Size: 128kB ROM, 128kB RAM Serial Interfaces: I2C, JTAG, SPI, UART GPIO: 21 Voltage - Supply: 2 V ~ 3.6 V Current - Receiving: 17.5mA Current - Transmitting: 15mA Operating Temperature: -40°C ~ 85°C Package / Case: 56-VFQFN	Package: 56-VFQFN	Stock2,430
LS1043ASE7QQB	NXP	QORIQ 4XCPU 64-BIT ARM ARCH 1. Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCBGA (21x21)	Package: 621-FBGA, FCBGA	Stock6,720
SPC5646CCF0VMJ1	NXP	NXP 32-BIT MCU DUAL POWER ARCH Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Speed: 80MHz/120MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 199 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 33x10b, 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-MAPBGA	Package: 256-LBGA	Stock4,640
SPC5646BCF0VLU8	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z4d Core Size: 32-Bit Speed: 120MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 147 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 192K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 27x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 176-LQFP Supplier Device Package: 176-LQFP (24x24)	Package: 176-LQFP	Stock5,664
S9S12VR16F0CLCR	NXP	MAGNIV 16-BIT MCU S12 CORE 16K Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 16 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 128 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 2x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	Package: 32-LQFP	Stock7,120
MC34PF8100F3EP	NXP	POWER MANAGEMENT IC I.MX8 PRE-PR Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Package: -	Request a Quote
S9S12G64J0MLH	NXP	S12 CORE,64K FLASH Core Processor: S12 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	Package: -	Request a Quote
S912D60CE1VPVER	NXP	IC MCU 16BIT SGF 112LQFP Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
MIMXRT1166XVM5A	NXP	IC MCU 32BIT EXT MEM 289LFBGA Core Processor: ARM® Cortex®-M4/M7 Core Size: 32-Bit Dual-Core Speed: 240MHz, 500MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Number of I/O: - Program Memory Size: - Program Memory Type: External Program Memory EEPROM Size: - RAM Size: 1M x 8 Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Data Converters: A/D 2x12b; D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 289-LFBGA Supplier Device Package: 289-LFBGA (14x14)	Package: -	Stock771