|
|
NXP |
TRANS PNP 45V 0.1A TO-92
- Transistor Type: PNP
- Current - Collector (Ic) (Max): 100mA
- Voltage - Collector Emitter Breakdown (Max): 45V
- Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
- Current - Collector Cutoff (Max): 15nA (ICBO)
- DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
- Power - Max: 500mW
- Frequency - Transition: 100MHz
- Operating Temperature: 150°C (TJ)
- Mounting Type: Through Hole
- Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
- Supplier Device Package: TO-92-3
|
Package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) |
Stock6,896 |
|
|
|
NXP |
TRANS PNP 45V 0.5A TO-92
- Transistor Type: PNP
- Current - Collector (Ic) (Max): 500mA
- Voltage - Collector Emitter Breakdown (Max): 45V
- Vce Saturation (Max) @ Ib, Ic: 700mV @ 50mA, 500mA
- Current - Collector Cutoff (Max): 100nA (ICBO)
- DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 100mA, 1V
- Power - Max: 625mW
- Frequency - Transition: 80MHz
- Operating Temperature: 150°C (TJ)
- Mounting Type: Through Hole
- Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
- Supplier Device Package: TO-92-3
|
Package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) |
Stock3,408 |
|
|
|
NXP |
TRANS NPN 50V 3A TO92
- Transistor Type: NPN
- Current - Collector (Ic) (Max): 3A
- Voltage - Collector Emitter Breakdown (Max): 50V
- Vce Saturation (Max) @ Ib, Ic: 290mV @ 200mA, 2A
- Current - Collector Cutoff (Max): 100nA (ICBO)
- DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 2A, 2V
- Power - Max: 830mW
- Frequency - Transition: 100MHz
- Operating Temperature: 150°C (TJ)
- Mounting Type: Through Hole
- Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
- Supplier Device Package: TO-92-3
|
Package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) |
Stock3,584 |
|
|
|
NXP |
DIODE ZENER 6.2V 400MW SOD2
- Voltage - Zener (Nom) (Vz): 6.2V
- Tolerance: ±2%
- Power - Max: 400mW
- Impedance (Max) (Zzt): 10 Ohms
- Current - Reverse Leakage @ Vr: 3µA @ 4V
- Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
- Operating Temperature: -65°C ~ 150°C
- Mounting Type: Surface Mount
- Package / Case: SOD-110
- Supplier Device Package: SOD110
|
Package: SOD-110 |
Stock2,448 |
|
|
|
NXP |
IC BCD-7 SEG DECODER/DRVR 16SOIC
- Display Type: LED, LCD
- Configuration: 7 Segment
- Interface: BCD
- Digits or Characters: -
- Current - Supply: -
- Voltage - Supply: 3 V ~ 15 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 16-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 16-SO
|
Package: 16-SOIC (0.154", 3.90mm Width) |
Stock2,528 |
|
|
|
NXP |
IC BINARY FULL ADDER 4BIT 16DIP
- Logic Type: Binary Full Adder with Fast Carry
- Supply Voltage: 4.5 V ~ 5.5 V
- Number of Bits: 4
- Operating Temperature: 0°C ~ 70°C
- Mounting Type: Through Hole
- Package / Case: 16-DIP (0.300", 7.62mm)
- Supplier Device Package: 16-DIP
|
Package: 16-DIP (0.300", 7.62mm) |
Stock2,512 |
|
|
|
NXP |
IC AMP AUDIO 5.2W MONO AB 9SIL
- Type: Class AB
- Output Type: 1-Channel (Mono)
- Max Output Power x Channels @ Load: 5.2W x 1 @ 8 Ohm
- Voltage - Supply: 4.5 V ~ 18 V
- Features: Depop, Mute, Short-Circuit and Thermal Protection, Volume Control
- Mounting Type: Through Hole
- Operating Temperature: -40°C ~ 85°C (TA)
- Supplier Device Package: 9-SIL MPF
- Package / Case: 9-SIP Exposed Tab
|
Package: 9-SIP Exposed Tab |
Stock4,416 |
|
|
|
NXP |
IC I/O EXPANDER I2C 8B 16HVQFN
- Number of I/O: 8
- Interface: I2C, SMBus
- Interrupt Output: Yes
- Features: POR
- Output Type: Push-Pull
- Current - Output Source/Sink: 10mA, 25mA
- Clock Frequency: 400kHz
- Voltage - Supply: 2.3 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 16-VQFN Exposed Pad
- Supplier Device Package: 16-HVQFN (4x4)
|
Package: 16-VQFN Exposed Pad |
Stock501,564 |
|
|
|
NXP |
IC MPU MPC85XX 800MHZ 783FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: -
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: SATA 3Gbps (1)
- USB: USB 2.0 (2)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
|
Package: 783-BBGA, FCBGA |
Stock2,752 |
|
|
|
NXP |
IC MPU MPC85XX 1.5GHZ 1023FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 1.5GHz
- Co-Processors/DSP: Signal Processing; SPE, Security; SEC
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (4)
- SATA: -
- USB: -
- Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 1023-BFBGA, FCBGA
- Supplier Device Package: 1023-FCPBGA (33x33)
|
Package: 1023-BFBGA, FCBGA |
Stock3,824 |
|
|
|
NXP |
IC MPU MPC85XX 800MHZ 783FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: Signal Processing; SPE, Security; SEC
- RAM Controllers: DDR, DDR2, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (4)
- SATA: -
- USB: -
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
|
Package: 783-BBGA, FCBGA |
Stock7,872 |
|
|
|
NXP |
IC MPU I.MX31 532MHZ 457MAPBGA
- Core Processor: ARM1136JF-S
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 532MHz
- Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP
- RAM Controllers: DDR
- Graphics Acceleration: Yes
- Display & Interface Controllers: Keyboard, Keypad, LCD
- Ethernet: -
- SATA: -
- USB: USB 2.0 (3)
- Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V
- Operating Temperature: -40°C ~ 85°C (TA)
- Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory
- Package / Case: 457-LFBGA
- Supplier Device Package: -
|
Package: 457-LFBGA |
Stock3,296 |
|
|
|
NXP |
IC MCU 32BIT ROMLESS 144LQFP
- Core Processor: ARM7?
- Core Size: 32-Bit
- Speed: 84MHz
- Connectivity: CAN, EBI/EMI, Microwire, SPI, SSI, SSP, UART/USART
- Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
- Number of I/O: 76
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 1.7 V ~ 3.6 V
- Data Converters: A/D 8x10b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
|
Package: 144-LQFP |
Stock7,248 |
|
|
|
NXP |
IC MCU 16BIT 256KB FLASH 80QFP
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 80MHz
- Connectivity: EBI/EMI, I2C, IrDA, LIN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 59
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 16K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
- Data Converters: A/D 8x10b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 80-QFP
- Supplier Device Package: 80-QFP (14x14)
|
Package: 80-QFP |
Stock6,208 |
|
|
|
NXP |
IC MCU 16BIT 256KB FLASH 112LQFP
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 80MHz
- Connectivity: EBI/EMI, I2C, IrDA, LIN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 91
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 16K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
- Data Converters: A/D 16x10b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 112-LQFP
- Supplier Device Package: 112-LQFP (20x20)
|
Package: 112-LQFP |
Stock3,776 |
|
|
|
NXP |
IC MCU 32BIT 128KB FLASH 64BGA
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 100MHz
- Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
- Peripherals: DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O: 40
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 24K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 22x16b, D/A 1x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 64-LFBGA
- Supplier Device Package: 64-MAPBGA (5x5)
|
Package: 64-LFBGA |
Stock6,912 |
|
|
|
NXP |
IC MCU 8BIT 128KB FLASH 64LQFP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 50MHz
- Connectivity: I2C, LIN, SCI, SPI
- Peripherals: LVD, PWM, WDT
- Number of I/O: 54
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
- Data Converters: A/D 22x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
|
Package: 64-LQFP |
Stock14,484 |
|
|
|
NXP |
IC SERIAL PLL FREQ SYNTH 16-SOIC
- Type: Clock/Frequency Synthesizer, Fanout Buffer (Distribution)
- PLL: Yes
- Input: Clock
- Output: Clock
- Number of Circuits: 1
- Ratio - Input:Output: 1:2
- Differential - Input:Output: No/No
- Frequency - Max: 185MHz
- Divider/Multiplier: Yes/No
- Voltage - Supply: 2.7 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 16-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 16-SOIC
|
Package: 16-SOIC (0.154", 3.90mm Width) |
Stock12,792 |
|
|
|
NXP |
SENSOR GAUGE PRESS 14.5PSI MAX
- Pressure Type: Vented Gauge
- Operating Pressure: 14.5 PSI (100 kPa)
- Output Type: Wheatstone Bridge
- Output: 0 mV ~ 40 mV (10V)
- Accuracy: -0.6% ~ 0.4%
- Voltage - Supply: 10 V ~ 16 V
- Port Size: Male - 0.19" (4.93mm) Tube
- Port Style: Barbed
- Features: Temperature Compensated
- Termination Style: PCB
- Maximum Pressure: 58.02 PSI (400 kPa)
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 4-SIP Module
- Supplier Device Package: -
|
Package: 4-SIP Module |
Stock8,532 |
|
|
|
NXP |
IC RF TXRX ISM<1GHZ 32-VFQFN
- Type: TxRx Only
- RF Family/Standard: General ISM < 1GHz
- Protocol: -
- Modulation: FSK, OOK
- Frequency: 290MHz ~ 340MHz, 424MHz ~ 510MHz, 862MHz ~ 1.02GHz
- Data Rate (Max): 22.6kbps
- Power - Output: 7.25dBm
- Sensitivity: -106.5dBm
- Memory Size: -
- Serial Interfaces: SPI
- GPIO: -
- Voltage - Supply: 2.1 V ~ 3.6 V
- Current - Receiving: 10.3mA ~ 24mA
- Current - Transmitting: 6.1mA ~ 13.5mA
- Operating Temperature: -20°C ~ 85°C
- Package / Case: 32-VFQFN Exposed Pad
|
Package: 32-VFQFN Exposed Pad |
Stock8,640 |
|
|
|
NXP |
NXP 32 BIT MCU 2M FLASH 1.5MB
- Core Processor: e200z4, e200z7 (2)
- Core Size: 32-Bit Tri-Core
- Speed: 180MHz, 240MHz
- Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire
- Peripherals: POR, PWM, WDT
- Number of I/O: -
- Program Memory Size: 2MB (2M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 1.5M x 8
- Voltage - Supply (Vcc/Vdd): 1.19 V ~ 5.5 V
- Data Converters: A/D 16x12b SAR, 4x12 Sigma, D/A 1x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 257-LFBGA
- Supplier Device Package: 257-MAPBGA (14x14)
|
Package: 257-LFBGA |
Stock6,752 |
|
|
|
NXP |
NXP 32-BIT MCU POWER ARCH CORE
- Core Processor: e200z0h
- Core Size: 32-Bit
- Speed: 32MHz
- Connectivity: CANbus, LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 45
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 16K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 16x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
|
Package: 64-LQFP |
Stock4,176 |
|
|
|
NXP |
IC RTC/CALENDAR SPI UNCASED
- Type: -
- Features: -
- Memory Size: -
- Time Format: -
- Date Format: -
- Interface: -
- Voltage - Supply: -
- Voltage - Supply, Battery: -
- Current - Timekeeping (Max): -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
|
Package: - |
Request a Quote |
|
|
|
NXP |
K32 L2A 100LQFP
- Core Processor: ARM® Cortex®-M0+
- Core Size: 32-Bit
- Speed: 72MHz
- Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
- Peripherals: DMA, LCD, PWM, WDT
- Number of I/O: 86
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128K x 8
- Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
|
Package: - |
Request a Quote |
|
|
|
NXP |
RF MOSFET HEMT 50V OM270-2
- Transistor Type: HEMT
- Frequency: 2.7GHz ~ 3.5GHz
- Gain: 17dB
- Voltage - Test: 50 V
- Current Rating: -
- Noise Figure: -
- Current - Test: 70 mA
- Power - Output: 60W
- Voltage - Rated: 125 V
- Package / Case: TO-270AA
- Supplier Device Package: OM-270-2
|
Package: - |
Request a Quote |
|
|
|
NXP |
IC
- Type: -
- Protocol: -
- Number of Drivers/Receivers: -
- Duplex: -
- Receiver Hysteresis: -
- Data Rate: -
- Voltage - Supply: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
|
Package: - |
Request a Quote |
|
|
|
NXP |
IC DSC 128KB/20KB LQPF48
- Type: -
- Interface: I2C, SCI, SPI
- Clock Rate: 100MHz
- Non-Volatile Memory: FLASH (128kB)
- On-Chip RAM: 20kB
- Voltage - I/O: 3.30V
- Voltage - Core: 2.7V, 3.6V
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
|
Package: - |
Stock750 |
|
|
|
NXP |
MULTI-TUNER CAR RADIO & AUDIO ON
- Type: -
- Interface: -
- Clock Rate: -
- Non-Volatile Memory: -
- On-Chip RAM: -
- Voltage - I/O: -
- Voltage - Core: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
|
Package: - |
Request a Quote |
|