Page 454 - NXP Products | Heisener Electronics

ON5223,118
NXP

MOSFET RF SOT426 D2PAK

Package: TO-263-5, D2Pak (4 Leads + Tab), TO-263BB

Stock6,640
MRF5S9101NR1
NXP

FET RF 68V 960MHZ TO-270-4

Package: TO-270AB

Stock6,544
PDTC143EEF,115
NXP

TRANS PREBIAS NPN 250MW SC89

Package: SC-89, SOT-490

Stock7,408
PZM3.0NB,115
NXP

DIODE ZENER 3V 300MW SMT3

Package: TO-236-3, SC-59, SOT-23-3

Stock7,856
LD6815TD/28P,125
NXP

IC REG LINEAR 2.8V 150MA 5TSOP

Package: SC-74A, SOT-753

Stock2,784
MC44BC374EJB
NXP

IC MODULATOR ANT BOOSTER 24TSSOP

Package: 24-TSSOP (0.173", 4.40mm Width)

Stock6,512
PCA9502BS,157
NXP

IC I/O EXPANDER I2C/SPI 24HVQFN

Package: 24-VFQFN Exposed Pad

Stock4,992
P2040NXE1MMB
NXP

IC MPU Q OR IQ 1.2GHZ 780FCBGA

Package: -

Stock5,168
MPC8323ECVRADDC
NXP

IC MPU MPC83XX 266MHZ 516BGA

Package: 516-BBGA

Stock3,392
P1013NXN2HFB
NXP

IC MPU Q OR IQ 1.055GHZ 689TBGA

Package: 689-BBGA Exposed Pad

Stock7,376
MCIMX6U5DVM10ACR
NXP

IC MPU I.MX6DL 1.0GHZ 624MAPBGA

Package: 624-LFBGA

Stock3,296
MPC850DSLZQ50BU
NXP

IC MPU MPC8XX 50MHZ 256BGA

Package: 256-BBGA

Stock4,800
MC9S08DV16MLF
NXP

IC MCU 8BIT 16KB FLASH 48LQFP

Package: 48-LQFP

Stock4,656
P89V51RC2FA,512
NXP

IC MCU 8BIT 32KB FLASH 44PLCC

Package: 44-LCC (J-Lead)

Stock6,880
MCF52256CVN66
NXP

IC MCU 32BIT 256KB FLASH 144BGA

Package: 144-LBGA

Stock29,436
S9S12G192F0VLL
NXP

IC MCU 16BIT 192KB FLASH 100LQFP

Package: 100-LQFP

Stock7,424
TEA6360T/V2,518
NXP

IC STEREO EQUALIZER CIRC 32SO

Package: 32-SOIC (0.295", 7.50mm Width)

Stock6,256
MMA6341LR2
NXP

ACCELEROMETER 3-9G ANALOG 14LGA

Package: 14-VFLGA

Stock5,544
HTMS1001FUG/AM,005
NXP

IC TRANSPONDER HITAG

Package: Die

Stock6,624
NT3H2111W0FHKH
NXP

IC RFID NFC 13.56MHZ 8XQFN

Package: 8-XFQFN Exposed Pad

Stock29,328

Part Number	Manufacturer	Description	Package	Stock
ON5223,118	NXP	MOSFET RF SOT426 D2PAK Transistor Type: - Frequency: - Gain: - Voltage - Test: - Current Rating: - Noise Figure: - Current - Test: - Power - Output: - Voltage - Rated: - Package / Case: TO-263-5, D2Pak (4 Leads + Tab), TO-263BB Supplier Device Package: SOT-426	Package: TO-263-5, D2Pak (4 Leads + Tab), TO-263BB	Stock6,640
MRF5S9101NR1	NXP	FET RF 68V 960MHZ TO-270-4 Transistor Type: LDMOS Frequency: 960MHz Gain: 17.5dB Voltage - Test: 26V Current Rating: - Noise Figure: - Current - Test: 700mA Power - Output: 100W Voltage - Rated: 68V Package / Case: TO-270AB Supplier Device Package: TO-270 WB-4	Package: TO-270AB	Stock6,544
PDTC143EEF,115	NXP	TRANS PREBIAS NPN 250MW SC89 Transistor Type: NPN - Pre-Biased Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 50V Resistor - Base (R1) (Ohms): 4.7k Resistor - Emitter Base (R2) (Ohms): 4.7k DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 10mA, 5V Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA Frequency - Transition: - Power - Max: 250mW Mounting Type: Surface Mount Package / Case: SC-89, SOT-490 Supplier Device Package: SC-89	Package: SC-89, SOT-490	Stock7,408
PZM3.0NB,115	NXP	DIODE ZENER 3V 300MW SMT3 Voltage - Zener (Nom) (Vz): 3V Tolerance: ±5% Power - Max: 300mW Impedance (Max) (Zzt): 95 Ohms Current - Reverse Leakage @ Vr: 10µA @ 1V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	Package: TO-236-3, SC-59, SOT-23-3	Stock7,856
LD6815TD/28P,125	NXP	IC REG LINEAR 2.8V 150MA 5TSOP Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 2.8V Voltage - Output (Max): - Voltage Dropout (Max): 0.25V @ 150mA (Typ) Current - Output: 150mA Current - Quiescent (Iq): - Current - Supply (Max): 35µA ~ 150µA PSRR: 75dB (1kHz) Control Features: Enable Protection Features: Over Current, Transient Voltage Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: SC-74A, SOT-753 Supplier Device Package: 5-TSOP	Package: SC-74A, SOT-753	Stock2,784
MC44BC374EJB	NXP	IC MODULATOR ANT BOOSTER 24TSSOP Type: Modulator Applications: Set-Top Boxes Mounting Type: Surface Mount Package / Case: 24-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 24-TSSOP	Package: 24-TSSOP (0.173", 4.40mm Width)	Stock6,512
PCA9502BS,157	NXP	IC I/O EXPANDER I2C/SPI 24HVQFN Number of I/O: 8 Interface: I2C, SPI Interrupt Output: No Features: - Output Type: Push-Pull Current - Output Source/Sink: - Clock Frequency: 400kHz Voltage - Supply: 2.3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-HVQFN (4x4)	Package: 24-VFQFN Exposed Pad	Stock4,992
P2040NXE1MMB	NXP	IC MPU Q OR IQ 1.2GHZ 780FCBGA Core Processor: PowerPC e500mc Number of Cores/Bus Width: 4 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: Security; SEC 4.2 RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (5) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox Package / Case: - Supplier Device Package: 780-FCPBGA (23x23)	Package: -	Stock5,168
MPC8323ECVRADDC	NXP	IC MPU MPC83XX 266MHZ 516BGA Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: USB 2.0 (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	Package: 516-BBGA	Stock3,392
P1013NXN2HFB	NXP	IC MPU Q OR IQ 1.055GHZ 689TBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.055GHz Co-Processors/DSP: - RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: -40°C ~ 125°C (TA) Security Features: - Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	Package: 689-BBGA Exposed Pad	Stock7,376
MCIMX6U5DVM10ACR	NXP	IC MPU I.MX6DL 1.0GHZ 624MAPBGA Core Processor: ARM? Cortex?-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 624-LFBGA Supplier Device Package: 624-MAPBGA (21x21)	Package: 624-LFBGA	Stock3,296
MPC850DSLZQ50BU	NXP	IC MPU MPC8XX 50MHZ 256BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23x23)	Package: 256-BBGA	Stock4,800
MC9S08DV16MLF	NXP	IC MCU 8BIT 16KB FLASH 48LQFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: CAN, I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	Package: 48-LQFP	Stock4,656
P89V51RC2FA,512	NXP	IC MCU 8BIT 32KB FLASH 44PLCC Core Processor: 8051 Core Size: 8-Bit Speed: 40MHz Connectivity: SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Number of I/O: 32 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59)	Package: 44-LCC (J-Lead)	Stock6,880
MCF52256CVN66	NXP	IC MCU 32BIT 256KB FLASH 144BGA Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 66MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 96 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 144-LBGA Supplier Device Package: 144-MAPBGA (13x13)	Package: 144-LBGA	Stock29,436
S9S12G192F0VLL	NXP	IC MCU 16BIT 192KB FLASH 100LQFP Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, IrDA, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 86 Program Memory Size: 192KB (192K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 11K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	Package: 100-LQFP	Stock7,424
TEA6360T/V2,518	NXP	IC STEREO EQUALIZER CIRC 32SO Function: Audio Tone Processor Applications: Automotive Audio, Consumer Audio Number of Channels: 2 Interface: I2C Voltage - Supply: 7 V ~ 13.2 V Operating Temperature: -40°C ~ 85°C (TA) Specifications: 5-Band Package / Case: 32-SOIC (0.295", 7.50mm Width) Supplier Device Package: 32-SO	Package: 32-SOIC (0.295", 7.50mm Width)	Stock6,256
MMA6341LR2	NXP	ACCELEROMETER 3-9G ANALOG 14LGA Type: Analog Axis: X, Y Acceleration Range: ±3g, 9g Sensitivity (LSB/g): - Sensitivity (mV/g): 440 (±3g) ~ 117.8 (±9g) Bandwidth: 400Hz Output Type: Analog Voltage Voltage - Supply: 2.2 V ~ 3.6 V Features: Selectable Scale, Sleep Mode Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 14-VFLGA Supplier Device Package: 14-LGA (3x5)	Package: 14-VFLGA	Stock5,544
HTMS1001FUG/AM,005	NXP	IC TRANSPONDER HITAG Type: RFID Transponder Frequency: 100kHz ~ 150kHz Standards: ISO 11784, ISO 11785 Interface: - Voltage - Supply: 4 V ~ 6 V Operating Temperature: -40°C ~ 85°C Package / Case: Die Supplier Device Package: Wafer	Package: Die	Stock6,624
NT3H2111W0FHKH	NXP	IC RFID NFC 13.56MHZ 8XQFN Type: RFID Transponder Frequency: 13.56MHz Standards: ISO 14443 Interface: I2C Voltage - Supply: 3.3V Operating Temperature: -40°C ~ 105°C Package / Case: 8-XFQFN Exposed Pad Supplier Device Package: 8-XQFN (1.6x1.6)	Package: 8-XFQFN Exposed Pad	Stock29,328
OM5569/NT312D,699	NXP	DEMO BOARD NTAG I2C Type: Near Field Communication Frequency: 13.56MHz For Use With/Related Products: NT3H1101 Supplied Contents: Board	Package: -	Stock7,470
T2081NXN8T1B	NXP	QORIQ 64B POWERARCH8X 1.8GHZ T Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	Package: -	Stock5,760
FS32K144HAT0MLHR	NXP	S32K144 32-BIT MCU ARM Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Speed: 80MHz Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: - Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	Package: 64-LQFP	Stock5,824
FS32K144HFT0VLHT	NXP	S32K144 32-BIT MCU ARM CORTEX-M Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Speed: 80MHz Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: - Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	Package: 64-LQFP	Stock4,928
MC33PF8200ESES	NXP	IC POWER MANAGEMENT I.MX8QM Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.7V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Package: 56-VFQFN Exposed Pad	Stock5,792
MC9S12XHZ256CAL	NXP	IC MCU 16BIT 256KB FLASH 112LQFP Core Processor: HCS12X Core Size: 16-Bit Speed: 80MHz Connectivity: CANbus, EBI/EMI, I²C, LINbus, SCI, SPI Peripherals: LCD, Motor control PWM, POR, PWM, WDT Number of I/O: 85 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Data Converters: A/D 16x8/10b Oscillator Type: External Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	Package: 112-LQFP	Stock4,944
FD32K146HFT0MLLT	NXP	S32K144 32-BIT MCU, ARM CORTEX-M Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
LPC55S28JBD100Y	NXP	IC MCU 32BIT 512KB FLSH 100HLQFP Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 150MHz Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 64 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-HLQFP (14x14)	Package: -	Request a Quote