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NXP |
DIODE UHF VAR CAP 30V SOD323
- Capacitance @ Vr, F: 2.25pF @ 28V, 1MHz
- Capacitance Ratio: 10
- Capacitance Ratio Condition: C1/C28
- Voltage - Peak Reverse (Max): 30V
- Diode Type: Single
- Q @ Vr, F: -
- Operating Temperature: -55°C ~ 125°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: SC-76, SOD-323
- Supplier Device Package: SOD-323
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Package: SC-76, SOD-323 |
Stock2,592 |
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NXP |
IC GATE NAND 4CH 2-INP 14-SO
- Logic Type: NAND Gate
- Number of Circuits: 4
- Number of Inputs: 2
- Features: -
- Voltage - Supply: 4.5 V ~ 5.5 V
- Current - Quiescent (Max): 20µA
- Current - Output High, Low: 4mA, 5.2mA
- Logic Level - Low: 0.8V
- Logic Level - High: 2V
- Max Propagation Delay @ V, Max CL: 12ns @ 4.5V, 50pF
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Supplier Device Package: 14-SO
- Package / Case: 14-SOIC (0.154", 3.90mm Width)
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Package: 14-SOIC (0.154", 3.90mm Width) |
Stock4,720 |
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NXP |
IC D-TYPE POS TRG SNGL 20SSOP
- Function: Standard
- Type: D-Type
- Output Type: Tri-State, Non-Inverted
- Number of Elements: 1
- Number of Bits per Element: 8
- Clock Frequency: 300MHz
- Max Propagation Delay @ V, Max CL: 4.9ns @ 5V, 50pF
- Trigger Type: Positive Edge
- Current - Output High, Low: 32mA, 64mA
- Voltage - Supply: 4.5 V ~ 5.5 V
- Current - Quiescent (Iq): 250µA
- Input Capacitance: 4pF
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 20-SSOP (0.209", 5.30mm Width)
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Package: 20-SSOP (0.209", 5.30mm Width) |
Stock5,440 |
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NXP |
IC FIFO REGISTER 4X64 3ST 16SOIC
- Memory Size: 256 (64 x 4)
- Function: Asynchronous, Synchronous
- Data Rate: 30MHz
- Access Time: 49ns
- Voltage - Supply: 2 V ~ 6 V
- Current - Supply (Max): 1mA
- Bus Directional: Uni-Directional
- Expansion Type: Depth, Width
- Programmable Flags Support: No
- Retransmit Capability: No
- FWFT Support: No
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 16-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 16-SO
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Package: 16-SOIC (0.295", 7.50mm Width) |
Stock7,648 |
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NXP |
IC I/O EXPANDER I2C 16B 24HVQFN
- Number of I/O: 16
- Interface: I2C, SMBus
- Interrupt Output: Yes
- Features: POR
- Output Type: Push-Pull
- Current - Output Source/Sink: 10mA, 25mA
- Clock Frequency: 400kHz
- Voltage - Supply: 2.3 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 24-WFQFN Exposed Pad
- Supplier Device Package: 24-HWQFN (4x4)
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Package: 24-WFQFN Exposed Pad |
Stock2,032 |
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NXP |
IC I/O EXPANDER I2C 16B 24SOIC
- Number of I/O: 16
- Interface: I2C, SMBus
- Interrupt Output: Yes
- Features: POR
- Output Type: Push-Pull
- Current - Output Source/Sink: 10mA, 25mA
- Clock Frequency: 400kHz
- Voltage - Supply: 2.3 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 24-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 24-SO
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Package: 24-SOIC (0.295", 7.50mm Width) |
Stock18,888 |
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NXP |
IC MPU MPC85XX 800MHZ 783FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: Signal Processing; SPE, Security; SEC
- RAM Controllers: DDR, DDR2, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (4)
- SATA: -
- USB: -
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 783-BBGA, FCBGA |
Stock7,392 |
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NXP |
IC MCU 32BIT 256KB FLASH 80LQFP
- Core Processor: 56800EX
- Core Size: 32-Bit
- Speed: 80MHz
- Connectivity: CAN, I2C, LIN, SCI, SPI
- Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
- Number of I/O: 68
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
- Data Converters: A/D 16x12b, 10x16b, D/A 1x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 80-LQFP
- Supplier Device Package: 80-LQFP (12x12)
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Package: 80-LQFP |
Stock6,144 |
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NXP |
IC MCU 8BIT 16KB OTP 44PLCC
- Core Processor: HC05
- Core Size: 8-Bit
- Speed: 2.1MHz
- Connectivity: SCI, SPI
- Peripherals: POR, WDT
- Number of I/O: 24
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: OTP
- EEPROM Size: -
- RAM Size: 352 x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: -
- Package / Case: 44-LCC (J-Lead)
- Supplier Device Package: 44-PLCC (17.525x17.525)
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Package: 44-LCC (J-Lead) |
Stock7,888 |
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NXP |
IC MCU 8BIT 4KB FLASH 16TSSOP
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: SCI, SPI
- Peripherals: LVD, POR, PWM
- Number of I/O: 13
- Program Memory Size: 4KB (4K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 10x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 16-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 16-TSSOP
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Package: 16-TSSOP (0.173", 4.40mm Width) |
Stock6,924 |
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NXP |
IC MCU 8BIT 4KB OTP 44PLCC
- Core Processor: HC11
- Core Size: 8-Bit
- Speed: 2MHz
- Connectivity: SCI, SPI
- Peripherals: POR, WDT
- Number of I/O: 26
- Program Memory Size: 4KB (4K x 8)
- Program Memory Type: OTP
- EEPROM Size: -
- RAM Size: 192 x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 44-LCC (J-Lead)
- Supplier Device Package: 44-PLCC (17.525x17.525)
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Package: 44-LCC (J-Lead) |
Stock14,928 |
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NXP |
IC MCU 16BIT 128KB FLASH 112LQFP
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 80MHz
- Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 91
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
- Data Converters: A/D 16x10b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 112-LQFP
- Supplier Device Package: 112-LQFP (20x20)
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Package: 112-LQFP |
Stock7,744 |
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NXP |
IC MCU 8BIT 8KB FLASH 32LQFP
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: LIN, SCI, SPI
- Peripherals: POR, PWM
- Number of I/O: 24
- Program Memory Size: 8KB (8K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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Package: 32-LQFP |
Stock6,144 |
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NXP |
IC MCU 16BIT 48KB FLASH 64LQFP
- Core Processor: 12V1
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: IrDA, LIN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 54
- Program Memory Size: 48KB (48K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 1.5K x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
- Data Converters: A/D 12x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
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Package: 64-LQFP |
Stock6,672 |
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NXP |
IC MCU 32BIT 16KB FLASH 16XSON
- Core Processor: ARM? Cortex?-M0+
- Core Size: 32-Bit
- Speed: 30MHz
- Connectivity: I2C, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O: 14
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 16-XFDFN
- Supplier Device Package: 16-XSON (3.2x2.5)
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Package: 16-XFDFN |
Stock4,192 |
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NXP |
IC SW TRPL HISIDE MCU/LIN 54SOIC
- Applications: Automotive Mirror Control
- Core Processor: HC08
- Program Memory Type: FLASH (16 kB)
- Controller Series: 908E
- RAM Size: 512 x 8
- Interface: SCI, SPI
- Number of I/O: 16
- Voltage - Supply: 5.5 V ~ 18 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 54-BSSOP (0.295", 7.50mm Width)
- Supplier Device Package: 54-SOIC
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Package: 54-BSSOP (0.295", 7.50mm Width) |
Stock5,088 |
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NXP |
IC DSP 24BIT 275MHZ 196MAPBGA
- Type: Fixed Point
- Interface: Host Interface, SSI, SCI
- Clock Rate: 275MHz
- Non-Volatile Memory: ROM (576 B)
- On-Chip RAM: 576kB
- Voltage - I/O: 3.30V
- Voltage - Core: 1.60V
- Operating Temperature: -40°C ~ 100°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 196-BGA
- Supplier Device Package: 196-MAPBGA (15x15)
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Package: 196-BGA |
Stock6,320 |
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NXP |
IC CLK BUF CISC 50MHZ 1CIRC
- PLL: Yes
- Main Purpose: CISC/RISC Microprocessor
- Input: TTL
- Output: CMOS, TTL
- Number of Circuits: 1
- Ratio - Input:Output: 1:6
- Differential - Input:Output: No/No
- Frequency - Max: 50MHz
- Voltage - Supply: 4.5 V ~ 5.5 V
- Operating Temperature: 0°C ~ 70°C
- Mounting Type: Surface Mount
- Package / Case: 20-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 20-SOIC
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Package: 20-SOIC (0.295", 7.50mm Width) |
Stock50,508 |
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NXP |
TVS DIODE 24VWM SOD123
- Type: -
- Unidirectional Channels: -
- Bidirectional Channels: -
- Voltage - Reverse Standoff (Typ): 24V
- Voltage - Breakdown (Min): -
- Voltage - Clamping (Max) @ Ipp: -
- Current - Peak Pulse (10/1000µs): -
- Power - Peak Pulse: 400W
- Power Line Protection: -
- Applications: -
- Capacitance @ Frequency: -
- Operating Temperature: -
- Mounting Type: Surface Mount
- Package / Case: SOD-123W
- Supplier Device Package: CFP3
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Package: SOD-123W |
Stock2,520 |
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NXP |
TVS DIODE 5.5VWM 5CSP
- Type: Steering (Rail to Rail)
- Unidirectional Channels: 3
- Bidirectional Channels: -
- Voltage - Reverse Standoff (Typ): 5.5V
- Voltage - Breakdown (Min): 6V
- Voltage - Clamping (Max) @ Ipp: -
- Current - Peak Pulse (10/1000µs): -
- Power - Peak Pulse: -
- Power Line Protection: Yes
- Applications: Ethernet, USB OTG
- Capacitance @ Frequency: 3pF @ 1MHz
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 5-UFBGA, WLCSP
- Supplier Device Package: 5-CSP (1.33x0.96)
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Package: 5-UFBGA, WLCSP |
Stock6,012 |
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NXP |
SENSOR DIFF PRESS 1.45 PSI MAX
- Pressure Type: Differential
- Operating Pressure: 1.45 PSI (10 kPa)
- Output Type: Wheatstone Bridge
- Output: 0 mV ~ 25 mV (10V)
- Accuracy: ±1%
- Voltage - Supply: 10 V ~ 16 V
- Port Size: -
- Port Style: No Port
- Features: Temperature Compensated
- Termination Style: PCB
- Maximum Pressure: 10.88 PSI (75 kPa)
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 4-SIP Module
- Supplier Device Package: -
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Package: 4-SIP Module |
Stock7,020 |
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NXP |
IC TUNER CAR RADIO 80LQFP
- Frequency: -
- Sensitivity: -
- Data Rate (Max): -
- Modulation or Protocol: AM, FM, WB
- Applications: AM/FM Radio Receiver
- Current - Receiving: -
- Data Interface: PCB, Surface Mount
- Memory Size: -
- Antenna Connector: PCB, Surface Mount
- Features: -
- Voltage - Supply: 5V, 8.5V
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 80-LQFP
- Supplier Device Package: 80-LQFP (12x12)
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Package: 80-LQFP |
Stock6,660 |
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NXP |
PF1510
- Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
- Current - Supply: -
- Voltage - Supply: 3.8 V ~ 7 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 40-VFQFN Exposed Pad
- Supplier Device Package: 40-QFN (5x5)
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Package: 40-VFQFN Exposed Pad |
Stock5,472 |
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NXP |
SYSTEM BASIS CHIP 2X 3.3 V/400M
- Applications: System Basis Chip
- Interface: CAN, LIN
- Voltage - Supply: 5.5 V ~ 28 V
- Package / Case: -
- Supplier Device Package: -
- Mounting Type: -
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Package: - |
Stock3,248 |
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NXP |
8-BIT MCU S08 CORE 2KB FLASH
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 16MHz
- Connectivity: -
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 4
- Program Memory Size: 2KB (2K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 4x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SOIC
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock9,324 |
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NXP |
NO DESCRIPTION
- Core Processor: -
- Core Size: -
- Speed: -
- Connectivity: -
- Peripherals: -
- Number of I/O: -
- Program Memory Size: -
- Program Memory Type: -
- EEPROM Size: -
- RAM Size: -
- Voltage - Supply (Vcc/Vdd): -
- Data Converters: -
- Oscillator Type: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
IC MCU 32BIT 4MB FLASH 172QFP
- Core Processor: ARM® Cortex®-M7
- Core Size: 32-Bit Dual-Core
- Speed: 160MHz
- Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
- Peripherals: DMA, I2S, WDT
- Number of I/O: 143
- Program Memory Size: 4MB (4M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 128K x 8
- RAM Size: 512K x 8
- Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
- Data Converters: A/D 24x12b SAR
- Oscillator Type: External, Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 172-QFP
- Supplier Device Package: 172-QFP (16x16)
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Package: - |
Request a Quote |
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NXP |
DIRANA3 SINGLE AM FM HIFI
- Type: -
- Interface: -
- Clock Rate: -
- Non-Volatile Memory: -
- On-Chip RAM: -
- Voltage - I/O: -
- Voltage - Core: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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