Page 572 - NXP Products | Heisener Electronics

BUK7226-75A/C1,118
NXP

MOSFET N-CH 75V 45A DPAK

Package: TO-252-3, DPak (2 Leads + Tab), SC-63

Stock5,056
MRF8S19260HSR6
NXP

FET RF 2CH 65V 1.99GHZ NI1230S-8

Package: SOT-1110B

Stock14,520
SSL3401HN/1Y
NXP

IC LED DRIVER OFFLINE 32HVQFN

Package: 32-VFQFN Exposed Pad

Stock2,720
PCA9633PW,118
NXP

IC LED DRVR PS DIM 25MA 16TSSOP

Package: 16-TSSOP (0.173", 4.40mm Width)

Stock3,632
74LVT32PW,118
NXP

IC GATE OR 4CH 2-INP 14-TSSOP

Package: 14-TSSOP (0.173", 4.40mm Width)

Stock3,648
MPC8535EBVTAKG
NXP

IC MPU MPC85XX 600MHZ 783FCBGA

Package: 783-BBGA, FCBGA

Stock5,824
MPC8544CVJAQGA
NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

Package: 783-BBGA, FCBGA

Stock7,680
MC7410VU400LE
NXP

IC MPU MPC74XX 400MHZ 360FCCBGA

Package: 360-BCBGA, FCCBGA

Stock5,824
MPC8270CZUQLDA
NXP

IC MPU MPC82XX 333MHZ 408TBGA

Package: 480-LBGA

Stock20,664
LH79524N0F100A1,55
NXP

IC MCU 32BIT ROMLESS 208LFBGA

Package: 208-LFBGA

Stock3,136
LH79520N0Q000B1,55
NXP

IC MCU 32BIT ROMLESS 176LQFP

Package: 176-LQFP

Stock7,760
MC9S12KG128CPVE
NXP

IC MCU 16BIT 128KB FLASH 112LQFP

Package: 112-LQFP

Stock3,040
SCF5249LAG120
NXP

IC MCU 32BIT ROMLESS 144LQFP

Package: 144-LQFP

Stock4,688
SPC5605BK0CLL6R
NXP

IC MCU 32BIT 768KB FLASH 100LQFP

Package: 100-LQFP

Stock6,848
MKE15Z128VLL7
NXP

KINETIS KE15Z: 72MHZ CORTEX-M0

Package: -

Stock2,576
MKL15Z128VFM4
NXP

IC MCU 32BIT 128KB FLASH 32QFN

Package: 32-VFQFN Exposed Pad

Stock2,100
LPC1111FHN33/102,5
NXP

IC MCU 32BIT 8KB FLASH 33HVQFN

Package: 32-VQFN Exposed Pad

Stock18,672
MSC8154TAG1000B
NXP

IC DSP 4X 1GHZ SC3850 783FCBGA

Package: 783-BBGA, FCBGA

Stock7,872
XC56309VF100AR2
NXP

IC DSP 24BIT 100MHZ 196-MABGA

Package: 196-LBGA

Stock7,552
JN5168MOD/02Z
NXP

MODULE WIRELESS MCU

Package: -

Stock2,898

Part Number	Manufacturer	Description	Package	Stock
BUK7226-75A/C1,118	NXP	MOSFET N-CH 75V 45A DPAK FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 75V Current - Continuous Drain (Id) @ 25°C: 45A (Tc) Drive Voltage (Max Rds On, Min Rds On): 10V Vgs(th) (Max) @ Id: 4V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 48nC @ 10V Input Capacitance (Ciss) (Max) @ Vds: 2385pF @ 25V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 158W (Tc) Rds On (Max) @ Id, Vgs: 26 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Surface Mount Supplier Device Package: DPAK Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63	Package: TO-252-3, DPak (2 Leads + Tab), SC-63	Stock5,056
MRF8S19260HSR6	NXP	FET RF 2CH 65V 1.99GHZ NI1230S-8 Transistor Type: LDMOS (Dual) Frequency: 1.99GHz Gain: 18.2dB Voltage - Test: 30V Current Rating: - Noise Figure: - Current - Test: 1.6A Power - Output: 74W Voltage - Rated: 65V Package / Case: SOT-1110B Supplier Device Package: NI1230S-8	Package: SOT-1110B	Stock14,520
SSL3401HN/1Y	NXP	IC LED DRIVER OFFLINE 32HVQFN Type: AC DC Offline Switcher Topology: - Internal Switch(s): - Number of Outputs: - Voltage - Supply (Min): 2.6V Voltage - Supply (Max): 3.6V Voltage - Output: - Current - Output / Channel: - Frequency: 12.5kHz Dimming: - Applications: Lighting Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	Package: 32-VFQFN Exposed Pad	Stock2,720
PCA9633PW,118	NXP	IC LED DRVR PS DIM 25MA 16TSSOP Type: Power Switch Topology: - Internal Switch(s): Yes Number of Outputs: 4 Voltage - Supply (Min): 2.3V Voltage - Supply (Max): 5.5V Voltage - Output: 5.5V Current - Output / Channel: 25mA Frequency: - Dimming: PWM Applications: Backlight Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	Package: 16-TSSOP (0.173", 4.40mm Width)	Stock3,632
74LVT32PW,118	NXP	IC GATE OR 4CH 2-INP 14-TSSOP Logic Type: OR Gate Number of Circuits: 4 Number of Inputs: 2 Features: - Voltage - Supply: 2.7 V ~ 3.6 V Current - Quiescent (Max): - Current - Output High, Low: 20mA, 32mA Logic Level - Low: 0.8V Logic Level - High: 2V Max Propagation Delay @ V, Max CL: 3.2ns @ 3.3V, 50pF Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Supplier Device Package: 14-TSSOP Package / Case: 14-TSSOP (0.173", 4.40mm Width)	Package: 14-TSSOP (0.173", 4.40mm Width)	Stock3,648
MPC8535EBVTAKG	NXP	IC MPU MPC85XX 600MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz Co-Processors/DSP: Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (1) USB: USB 2.0 (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	Package: 783-BBGA, FCBGA	Stock5,824
MPC8544CVJAQGA	NXP	IC MPU MPC85XX 1.0GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	Package: 783-BBGA, FCBGA	Stock7,680
MC7410VU400LE	NXP	IC MPU MPC74XX 400MHZ 360FCCBGA Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25x25)	Package: 360-BCBGA, FCCBGA	Stock5,824
MPC8270CZUQLDA	NXP	IC MPU MPC82XX 333MHZ 408TBGA Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 480-LBGA Supplier Device Package: 408-TBGA (37.5x37.5)	Package: 480-LBGA	Stock20,664
LH79524N0F100A1,55	NXP	IC MCU 32BIT ROMLESS 208LFBGA Core Processor: ARM7? Core Size: 32-Bit Speed: 76.2MHz Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Number of I/O: 108 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.7 V ~ 3.6 V Data Converters: A/D 10x10b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 208-LFBGA Supplier Device Package: 208-LFBGA (14x14)	Package: 208-LFBGA	Stock3,136
LH79520N0Q000B1,55	NXP	IC MCU 32BIT ROMLESS 176LQFP Core Processor: ARM7? Core Size: 32-Bit Speed: 77.4MHz Connectivity: EBI/EMI, IrDA, Microwire, SPI, SSI, SSP, UART/USART Peripherals: DMA, LCD, POR, PWM, WDT Number of I/O: 64 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.62 V ~ 3.6 V Data Converters: - Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 176-LQFP Supplier Device Package: 176-LQFP (20x20)	Package: 176-LQFP	Stock7,760
MC9S12KG128CPVE	NXP	IC MCU 16BIT 128KB FLASH 112LQFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, EBI/EMI, I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 91 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	Package: 112-LQFP	Stock3,040
SCF5249LAG120	NXP	IC MCU 32BIT ROMLESS 144LQFP Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 120MHz Connectivity: I2C, IDE, Memory Card, SPI, UART/USART Peripherals: DMA, I2S, POR, Serial Audio, WDT Number of I/O: 34 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 96K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 4x12b Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	Package: 144-LQFP	Stock4,688
SPC5605BK0CLL6R	NXP	IC MCU 32BIT 768KB FLASH 100LQFP Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CAN, I2C, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 77 Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 16 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 7x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	Package: 100-LQFP	Stock6,848
MKE15Z128VLL7	NXP	KINETIS KE15Z: 72MHZ CORTEX-M0 Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 72MHz Connectivity: CAN, I2C, SPI, UART/USART Peripherals: DMA, LVD, PWM, WDT Number of I/O: 89 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock2,576
MKL15Z128VFM4	NXP	IC MCU 32BIT 128KB FLASH 32QFN Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: I2C, LIN, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Number of I/O: 28 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 9x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-QFN (5x5)	Package: 32-VFQFN Exposed Pad	Stock2,100
LPC1111FHN33/102,5	NXP	IC MCU 32BIT 8KB FLASH 33HVQFN Core Processor: ARM? Cortex?-M0 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 28 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 32-VQFN Exposed Pad Supplier Device Package: 33-HVQFN (7x7)	Package: 32-VQFN Exposed Pad	Stock18,672
MSC8154TAG1000B	NXP	IC DSP 4X 1GHZ SC3850 783FCBGA Type: SC3850 Quad Core Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART Clock Rate: 1GHz Non-Volatile Memory: ROM (96 kB) On-Chip RAM: 576kB Voltage - I/O: 2.50V Voltage - Core: 1.00V Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	Package: 783-BBGA, FCBGA	Stock7,872
XC56309VF100AR2	NXP	IC DSP 24BIT 100MHZ 196-MABGA Type: Fixed Point Interface: Host Interface, SSI, SCI Clock Rate: 100MHz Non-Volatile Memory: ROM (576 B) On-Chip RAM: 24kB Voltage - I/O: 3.30V Voltage - Core: 3.30V Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 196-LBGA Supplier Device Package: 196-MAPBGA (15x15)	Package: 196-LBGA	Stock7,552
JN5168MOD/02Z	NXP	MODULE WIRELESS MCU RF Family/Standard: - Protocol: - Modulation: - Frequency: - Data Rate: - Power - Output: - Sensitivity: - Serial Interfaces: - Antenna Type: - Memory Size: - Voltage - Supply: - Current - Receiving: - Current - Transmitting: - Mounting Type: - Operating Temperature: - Package / Case: -	Package: -	Stock2,898
SPC5741PK1AKLQ8R	NXP	1MB NVM 2 X E200Z4 CORES 180MH Core Processor: e200z4 Core Size: 32-Bit Dual-Core Speed: 180MHz Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Number of I/O: - Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V Data Converters: A/D 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 135°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	Package: 144-LQFP	Stock4,848
MFS2621AMDA0ADR2	NXP	AUTO SBC Applications: - Current - Supply: 30µA Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	Package: -	Request a Quote
LS1027ASN7PQA	NXP	LAYERSCAPE 64-BIT ARM CORTEX-A72 Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 1.5GHz Co-Processors/DSP: - RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: - Ethernet: 1Gbps (1), 2.5Gbps (5) SATA: SATA 6Gbps (1) USB: USB 3.0 (2) Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TA) Security Features: Secure Boot, TrustZone® Package / Case: 448-BFBGA Supplier Device Package: 448-FBGA (17x17)	Package: -	Request a Quote
MC34PF8101A0EPR2	NXP	POWER MANAGEMENT IC I.MX8 NON-PR Applications: High Performance i.MX 8 Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Package: -	Request a Quote
FH32K146HFT0MLQT	NXP	S32K146, M4F, FLASH 1M, RAM 128K Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
FS32K118BRT0VLHR	NXP	IC MCU 32BIT 256KB FLASH 64LQFP Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Speed: 48MHz Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Number of I/O: 58 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 25K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b SAR; D/A1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	Package: -	Request a Quote
MFS8613BMDA0ES	NXP	IC FS86 SYSTEM BASIS CHIP ASIL Applications: Camera Current - Supply: - Voltage - Supply: 4.5V ~ 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (7x7)	Package: -	Stock489
MIMX9302CVVXDAB	NXP	IC Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote