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PHU78NQ03LT,127
NXP

MOSFET N-CH 25V 75A SOT533

Package: TO-251-3 Short Leads, IPak, TO-251AA

Stock2,432
MRF8S21100HSR3
NXP

FET RF 65V 2.17GHZ NI780S

Package: NI-780S

Stock6,960
MMRF2010GNR1
NXP

TRANS RF LDMOS 250W 50V

Package: TO-270-14 Variant, Gull Wing

Stock7,440
MC33931VW
NXP

IC MOTOR DRIVER PAR 44HSOP

Package: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad

Stock17,724
N74F273AD,623
NXP

IC D-TYPE POS TRG SNGL 20SOIC

Package: 20-SOIC (0.295", 7.50mm Width)

Stock4,720
SC16C650AIB48,128
NXP

IC UART 48LQFP

Package: 48-LQFP

Stock5,968
UJA1078TW/3V3/WD,1
NXP

IC SBC CAN/DUAL LIN 3.3 32HTSSOP

Package: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

Stock3,248
PCA9547BS,118
NXP

IC MUX 8CH I2C BUS 24-HVQFN

Package: 24-VFQFN Exposed Pad

Stock222,480
PCA9511D,118
NXP

IC BUFFER I2C/SMBUS HOTSWAP 8SO

Package: 8-SOIC (0.154", 3.90mm Width)

Stock6,944
PCAL6416APW,118
NXP

IC I/O EXPANDER 16BIT 24TSSOP

Package: 24-TSSOP (0.173", 4.40mm Width)

Stock5,040
T2081NSN7MQB
NXP

IC SOC 64BIT 8X1.2GHZ 780FCBGA

Package: 780-FBGA, FCBGA

Stock5,328
MPC8536EAVTAULA
NXP

IC MPU MPC85XX 1.333GHZ 783BGA

Package: 783-BBGA, FCBGA

Stock5,056
MPC8323ZQAFDC
NXP

IC MPU MPC83XX 333MHZ 516BGA

Package: 516-BBGA

Stock13,968
MPC8540CVT667JC
NXP

IC MPU MPC85XX 667MHZ 783FCBGA

Package: 784-BBGA, FCBGA

Stock4,864
MPC8255AVVMHBB
NXP

IC MPU MPC82XX 266MHZ 408TBGA

Package: 480-LBGA

Stock5,952
MCIMX6G2AVM07AB
NXP

IC MPU I.MC6UL 696MHZ 289BGA

Package: -

Stock3,312
MCHRC705KJ1CDWE
NXP

IC MCU 8BIT 1.2KB OTP 16SOIC

Package: 16-SOIC (0.295", 7.50mm Width)

Stock2,704
TFF1007HN/N1,115
NXP

IC FREQ GENERATOR LN 24HVQFN

Package: 24-VFQFN Exposed Pad

Stock7,136
MPXH6300A6U
NXP

SENSOR ABS PRESS 42PSI MAX

Package: 8-SOIC (0.295", 7.50mm Width)

Stock6,372
MW4IC2230GNBR1
NXP

IC POWER AMP 10W 28V TO-272-16

Package: TO-272-16 Variant, Gull Wing

Stock8,136

Part Number	Manufacturer	Description	Package	Stock
PHU78NQ03LT,127	NXP	MOSFET N-CH 25V 75A SOT533 FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 25V Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Drive Voltage (Max Rds On, Min Rds On): 5V, 10V Vgs(th) (Max) @ Id: 2V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 11nC @ 4.5V Input Capacitance (Ciss) (Max) @ Vds: 970pF @ 12V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 107W (Tc) Rds On (Max) @ Id, Vgs: 9 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Through Hole Supplier Device Package: I-Pak Package / Case: TO-251-3 Short Leads, IPak, TO-251AA	Package: TO-251-3 Short Leads, IPak, TO-251AA	Stock2,432
MRF8S21100HSR3	NXP	FET RF 65V 2.17GHZ NI780S Transistor Type: LDMOS Frequency: 2.17GHz Gain: 18.3dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 700mA Power - Output: 24W Voltage - Rated: 65V Package / Case: NI-780S Supplier Device Package: NI-780S	Package: NI-780S	Stock6,960
MMRF2010GNR1	NXP	TRANS RF LDMOS 250W 50V Transistor Type: LDMOS Frequency: 1.09GHz Gain: 32.1dB Voltage - Test: 50V Current Rating: - Noise Figure: - Current - Test: 80mA Power - Output: 250W Voltage - Rated: 100V Package / Case: TO-270-14 Variant, Gull Wing Supplier Device Package: TO-270 WB-14 GULL	Package: TO-270-14 Variant, Gull Wing	Stock7,440
MC33931VW	NXP	IC MOTOR DRIVER PAR 44HSOP Motor Type - Stepper: - Motor Type - AC, DC: Brushed DC Function: Driver - Fully Integrated, Control and Power Stage Output Configuration: Half Bridge (2) Interface: Parallel Technology: CMOS Step Resolution: - Applications: Automotive Current - Output: 5A Voltage - Supply: 5 V ~ 28 V Voltage - Load: 5 V ~ 28 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad Supplier Device Package: 44-HSOP	Package: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad	Stock17,724
N74F273AD,623	NXP	IC D-TYPE POS TRG SNGL 20SOIC Function: Master Reset Type: D-Type Output Type: Non-Inverted Number of Elements: 1 Number of Bits per Element: 8 Clock Frequency: 170MHz Max Propagation Delay @ V, Max CL: 9.5ns @ 5V, 50pF Trigger Type: Positive Edge Current - Output High, Low: 1mA, 20mA Voltage - Supply: 4.5 V ~ 5.5 V Current - Quiescent (Iq): 38mA Input Capacitance: - Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 20-SOIC (0.295", 7.50mm Width)	Package: 20-SOIC (0.295", 7.50mm Width)	Stock4,720
SC16C650AIB48,128	NXP	IC UART 48LQFP Features: - Number of Channels: 1, UART FIFO's: 32 Byte Protocol: - Data Rate (Max): 3Mbps Voltage - Supply: 2.5V, 3.3V, 5V With Auto Flow Control: Yes With IrDA Encoder/Decoder: Yes With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	Package: 48-LQFP	Stock5,968
UJA1078TW/3V3/WD,1	NXP	IC SBC CAN/DUAL LIN 3.3 32HTSSOP Applications: Automotive Interface: CAN, LIN Voltage - Supply: 4.5 V ~ 28 V Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Supplier Device Package: 32-HTSSOP Mounting Type: Surface Mount	Package: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad	Stock3,248
PCA9547BS,118	NXP	IC MUX 8CH I2C BUS 24-HVQFN Applications: Translating Multiplexer Interface: I2C, SMBus Voltage - Supply: 2.3 V ~ 3.6 V, 4.5 V ~ 5.5 V Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-HVQFN (4x4) Mounting Type: Surface Mount	Package: 24-VFQFN Exposed Pad	Stock222,480
PCA9511D,118	NXP	IC BUFFER I2C/SMBUS HOTSWAP 8SO Type: Buffer, Accelerator Applications: I2C - Hotswap Input: 2-Wire Bus Output: 2-Wire Bus Data Rate (Max): 400kHz Number of Channels: 1 Delay Time: - Signal Conditioning: - Capacitance - Input: 5pF Voltage - Supply: 2.7 V ~ 5.5 V Current - Supply: 6mA Operating Temperature: -40°C ~ 85°C Mounting Type: - Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	Package: 8-SOIC (0.154", 3.90mm Width)	Stock6,944
PCAL6416APW,118	NXP	IC I/O EXPANDER 16BIT 24TSSOP Number of I/O: 16 Interface: I2C, SMBus Interrupt Output: Yes Features: POR Output Type: Open Drain, Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 1.65 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 24-TSSOP	Package: 24-TSSOP (0.173", 4.40mm Width)	Stock5,040
T2081NSN7MQB	NXP	IC SOC 64BIT 8X1.2GHZ 780FCBGA Core Processor: PowerPC e6500 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 1.8GHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1 Gbps (8), 2.5 Gbps (4), 10 Gbps (4) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 780-FBGA, FCBGA Supplier Device Package: 780-FCPBGA (23x23)	Package: 780-FBGA, FCBGA	Stock5,328
MPC8536EAVTAULA	NXP	IC MPU MPC85XX 1.333GHZ 783BGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.333GHz Co-Processors/DSP: Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 (3) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 90°C (TA) Security Features: Cryptography Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	Package: 783-BBGA, FCBGA	Stock5,056
MPC8323ZQAFDC	NXP	IC MPU MPC83XX 333MHZ 516BGA Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: USB 2.0 (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	Package: 516-BBGA	Stock13,968
MPC8540CVT667JC	NXP	IC MPU MPC85XX 667MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: - RAM Controllers: DDR, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (1), 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 784-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	Package: 784-BBGA, FCBGA	Stock4,864
MPC8255AVVMHBB	NXP	IC MPU MPC82XX 266MHZ 408TBGA Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 480-LBGA Supplier Device Package: 408-TBGA (37.5x37.5)	Package: 480-LBGA	Stock5,952
MCIMX6G2AVM07AB	NXP	IC MPU I.MC6UL 696MHZ 289BGA Core Processor: ARM? Cortex?-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 696MHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS Ethernet: 10/100 Mbps (2) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Package / Case: - Supplier Device Package: -	Package: -	Stock3,312
MCHRC705KJ1CDWE	NXP	IC MCU 8BIT 1.2KB OTP 16SOIC Core Processor: HC05 Core Size: 8-Bit Speed: 4MHz Connectivity: - Peripherals: POR, WDT Number of I/O: 10 Program Memory Size: 1.2KB (1.2K x 8) Program Memory Type: OTP EEPROM Size: - RAM Size: 64 x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	Package: 16-SOIC (0.295", 7.50mm Width)	Stock2,704
TFF1007HN/N1,115	NXP	IC FREQ GENERATOR LN 24HVQFN PLL: Yes Main Purpose: Ku band VSAT applications Input: Clock Output: Clock Number of Circuits: 1 Ratio - Input:Output: 1:4 Differential - Input:Output: Yes/No Frequency - Max: 15GHz Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-HVQFN (4x4)	Package: 24-VFQFN Exposed Pad	Stock7,136
MPXH6300A6U	NXP	SENSOR ABS PRESS 42PSI MAX Pressure Type: Absolute Operating Pressure: 2.9 PSI ~ 44.09 PSI (20 kPa ~ 304 kPa) Output Type: Analog Voltage Output: 0.3 V ~ 4.9 V Accuracy: ±1.5% Voltage - Supply: 4.74 V ~ 5.46 V Port Size: - Port Style: No Port Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 174.05 PSI (1200 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 8-SOIC (0.295", 7.50mm Width) Supplier Device Package: 8-SSOP	Package: 8-SOIC (0.295", 7.50mm Width)	Stock6,372
MW4IC2230GNBR1	NXP	IC POWER AMP 10W 28V TO-272-16 Frequency: 1.6GHz ~ 2.4GHz P1dB: - Gain: 31dB Noise Figure: - RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA Voltage - Supply: 26V Current - Supply: 60mA Test Frequency: - Package / Case: TO-272-16 Variant, Gull Wing Supplier Device Package: TO-272 WB-16 GULL	Package: TO-272-16 Variant, Gull Wing	Stock8,136
MMZ09312BT1	NXP	IC AMP HBT INGAP CLASS AB 12QFN Frequency: 400MHz ~ 1GHz P1dB: 29.6dBm Gain: 31.7dB Noise Figure: 4dB RF Type: CDMA, GSM Voltage - Supply: 3 V ~ 5 V Current - Supply: 74mA Test Frequency: 900MHz Package / Case: 12-VFQFN Exposed Pad Supplier Device Package: 12-QFN (3x3)	Package: 12-VFQFN Exposed Pad	Stock12,864
MCIMX7D3DVK10SD	NXP	I.MX 7DUAL: REV 1.3 Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD, MIPI Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage - I/O: 1.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Package / Case: 488-TFBGA Supplier Device Package: 488-FBGA (12x12)	Package: 488-TFBGA	Stock7,704
S9S12G64AVLF	NXP	16BIT 128K FLASH Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	Package: 48-LQFP	Stock6,256
SAF7755EL-N208ZY	NXP	CAR DSP Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
S9S12ZVL16AVLC	NXP	S12Z CPU, 16K FLASH Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 19 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 128 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Data Converters: A/D 6x10b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	Package: -	Request a Quote
MPF5200AMBA2ESR2	NXP	POWER MANAGEMENT IC, PRE-PROG, 3 Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: Surface Mount, Wettable Flank Package / Case: 32-PowerWFQFN Supplier Device Package: 32-HWQFN (5x5)	Package: -	Request a Quote
MCF54452VP266R	NXP	IC MCU 32BIT ROMLESS 360BGA Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Speed: 266MHz Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 132 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V Data Converters: - Oscillator Type: External, Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 360-BBGA Supplier Device Package: 360-BGA (23x23)	Package: -	Request a Quote
S9S12GN32J0MLF	NXP	IC MCU 16BIT 32KB FLASH 48LQFP Core Processor: S12 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	Package: -	Request a Quote