Page 596 - NXP Products | Heisener Electronics

BFU630F,115
NXP

TRANSISTOR NPN SOT343F

Package: SOT-343F

Stock3,856
PCF2111CT/1,112
NXP

IC LCD DRIVER 64SEG 40-VSOP

Package: 40-BSOP (0.295", 7.50mm Width)

Stock7,008
GTL2006PW,112
NXP

IC XLATR 13BIT GTL/LVTTL 28TSSOP

Package: 28-TSSOP (0.173", 4.40mm Width)

Stock2,608
74HCT4015D,112
NXP

IC DUAL 4BIT SHIFT REG 16-SOIC

Package: 16-SOIC (0.154", 3.90mm Width)

Stock7,696
74LV14N,112
NXP

IC HEX INV SCHMITT TRIG 14-DIP

Package: 14-DIP (0.300", 7.62mm)

Stock2,768
TDA18252HN/C1,518
NXP

IC DGTL CABLE SIL TUNER 48HVQFN

Package: 48-VFQFN Exposed Pad

Stock7,584
MCZ33903BS5EKR2
NXP

IC SBC CAN HS 5.0V 32SOIC

Package: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

Stock5,616
PCA82C251T/YM,118
NXP

IC CAN TXRX 24V 8SOIC

Package: 8-SOIC (0.154", 3.90mm Width)

Stock240,000
MPC8544ECVTAQGA
NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

Package: 783-BBGA, FCBGA

Stock4,576
KMPC8379VRALG
NXP

IC MPU MPC83XX 667MHZ 689TEBGA

Package: 689-BBGA Exposed Pad

Stock5,872
KMPC8358EVRAGDGA
NXP

IC MPU MPC83XX 400MHZ 668BGA

Package: 668-BBGA Exposed Pad

Stock2,800
KMPC8543EVUANG
NXP

IC MPU MPC85XX 800MHZ 783FCBGA

Package: 783-BBGA, FCBGA

Stock5,760
MPC8323VRAFDC
NXP

IC MPU MPC83XX 333MHZ 516BGA

Package: 516-BBGA

Stock17,520
MPC860DPZQ50D4R2
NXP

IC MPU MPC8XX 50MHZ 357BGA

Package: 357-BBGA

Stock3,920
KMPC860DEVR80D4
NXP

IC MPU MPC8XX 80MHZ 357BGA

Package: 357-BBGA

Stock5,760
MPC859DSLVR66A
NXP

IC MPU MPC8XX 66MHZ 357BGA

Package: 357-BBGA

Stock18,588
MK30DN512ZVLQ10
NXP

IC MCU 32BIT 512KB FLASH 144LQFP

Package: 144-LQFP

Stock98,076
MCF51AC128CCLKE
NXP

IC MCU 32BIT 128KB FLASH 80LQFP

Package: 80-LQFP

Stock13,860
MC9S08QE8CTG
NXP

IC MCU 8BIT 8KB FLASH 16TSSOP

Package: 16-TSSOP (0.173", 4.40mm Width)

Stock19,236
MSC7115VM1000
NXP

DSP 16BIT W/DDR CTRLR 400-MAPBGA

Package: 400-LFBGA

Stock7,632

Part Number	Manufacturer	Description	Package	Stock
BFU630F,115	NXP	TRANSISTOR NPN SOT343F Transistor Type: NPN Voltage - Collector Emitter Breakdown (Max): 5.5V Frequency - Transition: 21GHz Noise Figure (dB Typ @ f): 0.75dB ~ 1.3dB @ 1.5GHz ~ 5.8GHz Gain: 13dB ~ 22.5dB Power - Max: 200mW DC Current Gain (hFE) (Min) @ Ic, Vce: 90 @ 5mA, 2V Current - Collector (Ic) (Max): 30mA Operating Temperature: 150°C (TJ) Mounting Type: Surface Mount Package / Case: SOT-343F Supplier Device Package: 4-DFP	Package: SOT-343F	Stock3,856
PCF2111CT/1,112	NXP	IC LCD DRIVER 64SEG 40-VSOP Display Type: LCD Configuration: 64 Segment Interface: Serial Digits or Characters: - Current - Supply: 20µA Voltage - Supply: 2.25 V ~ 6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 40-BSOP (0.295", 7.50mm Width) Supplier Device Package: 40-VSOP	Package: 40-BSOP (0.295", 7.50mm Width)	Stock7,008
GTL2006PW,112	NXP	IC XLATR 13BIT GTL/LVTTL 28TSSOP Translator Type: Mixed Signal Channel Type: Unidirectional Number of Circuits: 1 Channels per Circuit: 13 Voltage - VCCA: - Voltage - VCCB: - Input Signal: GTL Output Signal: LVTTL Output Type: Open Drain Data Rate: - Operating Temperature: -40°C ~ 85°C (TA) Features: - Mounting Type: Surface Mount Package / Case: 28-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 28-TSSOP	Package: 28-TSSOP (0.173", 4.40mm Width)	Stock2,608
74HCT4015D,112	NXP	IC DUAL 4BIT SHIFT REG 16-SOIC Logic Type: Shift Register Output Type: Push-Pull Number of Elements: 2 Number of Bits per Element: 4 Function: Serial to Parallel Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	Package: 16-SOIC (0.154", 3.90mm Width)	Stock7,696
74LV14N,112	NXP	IC HEX INV SCHMITT TRIG 14-DIP Logic Type: Inverter Number of Circuits: 6 Number of Inputs: 6 Features: Schmitt Trigger Voltage - Supply: 1 V ~ 5.5 V Current - Quiescent (Max): 40µA Current - Output High, Low: 12mA, 12mA Logic Level - Low: 0.3 V ~ 1.1 V Logic Level - High: 1.4 V ~ 3.85 V Max Propagation Delay @ V, Max CL: 15ns @ 3.3V, 50pF Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Supplier Device Package: 14-DIP Package / Case: 14-DIP (0.300", 7.62mm)	Package: 14-DIP (0.300", 7.62mm)	Stock2,768
TDA18252HN/C1,518	NXP	IC DGTL CABLE SIL TUNER 48HVQFN Type: Silicon Tuner Applications: Set-Top Boxes Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (7x7)	Package: 48-VFQFN Exposed Pad	Stock7,584
MCZ33903BS5EKR2	NXP	IC SBC CAN HS 5.0V 32SOIC Applications: System Basis Chip Interface: CAN, LIN Voltage - Supply: 5.5 V ~ 28 V Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP Mounting Type: Surface Mount	Package: 32-SSOP (0.295", 7.50mm Width) Exposed Pad	Stock5,616
PCA82C251T/YM,118	NXP	IC CAN TXRX 24V 8SOIC Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 150mV Data Rate: - Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	Package: 8-SOIC (0.154", 3.90mm Width)	Stock240,000
MPC8544ECVTAQGA	NXP	IC MPU MPC85XX 1.0GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	Package: 783-BBGA, FCBGA	Stock4,576
KMPC8379VRALG	NXP	IC MPU MPC83XX 667MHZ 689TEBGA Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (4) USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 125°C (TA) Security Features: - Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	Package: 689-BBGA Exposed Pad	Stock5,872
KMPC8358EVRAGDGA	NXP	IC MPU MPC83XX 400MHZ 668BGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; QUICC Engine, Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 668-BBGA Exposed Pad Supplier Device Package: 668-PBGA-PGE (29x29)	Package: 668-BBGA Exposed Pad	Stock2,800
KMPC8543EVUANG	NXP	IC MPU MPC85XX 800MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	Package: 783-BBGA, FCBGA	Stock5,760
MPC8323VRAFDC	NXP	IC MPU MPC83XX 333MHZ 516BGA Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: USB 2.0 (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	Package: 516-BBGA	Stock17,520
MPC860DPZQ50D4R2	NXP	IC MPU MPC8XX 50MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (2), 10/100 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	Package: 357-BBGA	Stock3,920
KMPC860DEVR80D4	NXP	IC MPU MPC8XX 80MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 80MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (2) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	Package: 357-BBGA	Stock5,760
MPC859DSLVR66A	NXP	IC MPU MPC8XX 66MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1), 10/100 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	Package: 357-BBGA	Stock18,588
MK30DN512ZVLQ10	NXP	IC MCU 32BIT 512KB FLASH 144LQFP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 100MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Number of I/O: 102 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 46x16b, D/A 2x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	Package: 144-LQFP	Stock98,076
MCF51AC128CCLKE	NXP	IC MCU 32BIT 128KB FLASH 80LQFP Core Processor: Coldfire V1 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, PWM, WDT Number of I/O: 69 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 24x12b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (14x14)	Package: 80-LQFP	Stock13,860
MC9S08QE8CTG	NXP	IC MCU 8BIT 8KB FLASH 16TSSOP Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, PWM, WDT Number of I/O: 12 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	Package: 16-TSSOP (0.173", 4.40mm Width)	Stock19,236
MSC7115VM1000	NXP	DSP 16BIT W/DDR CTRLR 400-MAPBGA Type: SC1400 Core Interface: Host Interface, I2C, UART Clock Rate: 266MHz Non-Volatile Memory: External On-Chip RAM: 400kB Voltage - I/O: 3.30V Voltage - Core: 1.20V Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 400-LFBGA Supplier Device Package: 400-MAPBGA (17x17)	Package: 400-LFBGA	Stock7,632
MPR111EKR2	NXP	IC SENS PROXIMITY ANLG 54-SOIC Type: - Proximity Detection: - Number of Inputs: - LED Driver Channels: - Interface: - Resolution: - Voltage - Supply: - Current - Supply: - Operating Temperature: - Package / Case: 54-SOIC (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOIC	Package: 54-SOIC (0.295", 7.50mm Width) Exposed Pad	Stock4,032
MC35FS4502CAE	NXP	FS4500 Applications: System Basis Chip Current - Supply: - Voltage - Supply: -1.0 V ~ 40 V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP (7x7)	Package: 48-LQFP Exposed Pad	Stock4,576
S9S12G192F0MLF	NXP	16-BIT MCU S12 CORE 192KB FLAS Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 192KB (192K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 11K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	Package: 48-LQFP	Stock5,424
S9S12G96ACLFR	NXP	16BIT 96K FLASH Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH EEPROM Size: 3K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	Package: 48-LQFP	Stock6,192
MIMX8MM4CVTKZAA	NXP	IC MPU I.MX 8M MINI DUAL BGA Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.6GHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-DSI Ethernet: GbE SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Package / Case: 486-LFBGA, FCBGA Supplier Device Package: 486-FCBGA (14x14)	Package: 486-LFBGA, FCBGA	Stock5,312
LPC55S14JBD64K	NXP	IC MCU 32BIT 128KB FLASH 64HTQFP Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 150MHz Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 36 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 80K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 64-TQFP Exposed Pad Supplier Device Package: 64-HTQFP (10x10)	Package: -	Request a Quote
S32K344NHT1MPBST	NXP	S32K344 ARM CORTEX-M7, 160 MHZ, Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Speed: 160MHz Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART Peripherals: DMA, I2S, Serial Audio, WDT Number of I/O: 218 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 172-QFP Supplier Device Package: 172-QFP (16x16)	Package: -	Request a Quote
S9S12GN32J0MFT	NXP	IC MCU 16BIT 32KB FLASH 48TFQFN Core Processor: S12 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-TFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7)	Package: -	Request a Quote