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PSMN5R0-100XS,127
NXP

MOSFET N-CH 100V 67.5A TO-220F

Package: TO-220-3 Full Pack, Isolated Tab

Stock5,856
MRF9080LR5
NXP

FET RF 65V 960MHZ NI-780

Package: NI-780

Stock8,748
BF904WR,115
NXP

MOSFET N-CH 7V 30MA SOT343

Package: SC-82A, SOT-343

Stock5,344
SSL2129AT/1J
NXP

IC LED DRIVER OFFLINE DIM 8SO

Package: 8-SOIC (0.154", 3.90mm Width)

Stock150,000
74LV123D/AUJ
NXP

IC MULTIVIBRATOR RETRIG 16SOIC

Package: 16-SOIC (0.154", 3.90mm Width)

Stock5,824
TDF8546ATH/N1ZJ
NXP

IC AMP AUDIO BTL 36HSOP

Package: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad

Stock4,944
PCA9674D,512
NXP

IC I/O EXPANDER I2C 8B 16SOIC

Package: 16-SOIC (0.295", 7.50mm Width)

Stock5,392
MPC850ZQ80BU
NXP

IC MPU MPC8XX 80MHZ 256BGA

Package: 256-BBGA

Stock3,392
KMPC8255ACZUMHBB
NXP

IC MPU MPC82XX 266MHZ 408TBGA

Package: 480-LBGA

Stock7,520
T4240NSN7PQB
NXP

IC SOC 64BIT 24X 1.5GHZ 1932BGA

Package: 1932-BBGA, FCBGA

Stock2,416
MPC8306SCVMABDCA
NXP

IC MPU MPC83XX 133MHZ 369BGA

Package: 369-LFBGA

Stock39,120
MC912DT128CCPVE
NXP

IC MCU 16BIT 128KB FLASH 112LQFP

Package: 112-LQFP

Stock6,928
MCHC908JK1CPE
NXP

IC MCU 8BIT 1.5KB FLASH 20DIP

Package: 20-DIP (0.300", 7.62mm)

Stock5,888
MC68332GVEH20
NXP

IC MCU 32BIT ROMLESS 132QFP

Package: 132-BQFP Bumpered

Stock6,944
XC56309VL100AR2
NXP

IC DSP 24BIT 100MHZ 196-MAPBGA

Package: 196-LBGA

Stock7,856
IP4363CX10/LF,135
NXP

TVS DIODE 10CSP

Package: 10-UFBGA, WLCSP

Stock4,896
MF1PLUS6031DA4/03,
NXP

IC MIFARE PLUS SMART CARD PLLMC

Package: MOA4, Smart Card Module

Stock4,518
MC33594FTA
NXP

IC RF RECEIVER 315,434MHZ 24LQFP

Package: 24-LQFP

Stock241,548
LS1023AXE7MQA
NXP

QORIQ 2XCPU 64-BIT ARM ARCH 1.

Package: -

Stock2,688
MCIMX6X4EVM10AC
NXP

I.MX 6SX ROM PERF ENHAN

Package: 529-LFBGA

Stock3,040

Part Number	Manufacturer	Description	Package	Stock
PSMN5R0-100XS,127	NXP	MOSFET N-CH 100V 67.5A TO-220F FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 100V Current - Continuous Drain (Id) @ 25°C: 67.5A (Tc) Drive Voltage (Max Rds On, Min Rds On): 10V Vgs(th) (Max) @ Id: 4V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 153nC @ 10V Input Capacitance (Ciss) (Max) @ Vds: 9900pF @ 50V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 63.8W (Tc) Rds On (Max) @ Id, Vgs: 5 mOhm @ 15A, 10V Operating Temperature: - Mounting Type: Through Hole Supplier Device Package: TO-220F Package / Case: TO-220-3 Full Pack, Isolated Tab	Package: TO-220-3 Full Pack, Isolated Tab	Stock5,856
MRF9080LR5	NXP	FET RF 65V 960MHZ NI-780 Transistor Type: LDMOS Frequency: 960MHz Gain: 18.5dB Voltage - Test: 26V Current Rating: - Noise Figure: - Current - Test: 600mA Power - Output: 70W Voltage - Rated: 65V Package / Case: NI-780 Supplier Device Package: NI-780	Package: NI-780	Stock8,748
BF904WR,115	NXP	MOSFET N-CH 7V 30MA SOT343 Transistor Type: N-Channel Dual Gate Frequency: 200MHz Gain: - Voltage - Test: 5V Current Rating: 30mA Noise Figure: 1dB Current - Test: 10mA Power - Output: - Voltage - Rated: 7V Package / Case: SC-82A, SOT-343 Supplier Device Package: CMPAK-4	Package: SC-82A, SOT-343	Stock5,344
SSL2129AT/1J	NXP	IC LED DRIVER OFFLINE DIM 8SO Type: AC DC Offline Switcher Topology: Flyback, Step-Down (Buck), Step-Up (Boost) Internal Switch(s): No Number of Outputs: 1 Voltage - Supply (Min): 8V Voltage - Supply (Max): 16V Voltage - Output: - Current - Output / Channel: - Frequency: 100kHz Dimming: Triac Applications: Lighting Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	Package: 8-SOIC (0.154", 3.90mm Width)	Stock150,000
74LV123D/AUJ	NXP	IC MULTIVIBRATOR RETRIG 16SOIC Logic Type: Monostable Independent Circuits: 2 Schmitt Trigger Input: Yes Propagation Delay: 18ns Current - Output High, Low: 12mA, 12mA Voltage - Supply: 1 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	Package: 16-SOIC (0.154", 3.90mm Width)	Stock5,824
TDF8546ATH/N1ZJ	NXP	IC AMP AUDIO BTL 36HSOP Type: Class AB Output Type: 4-Channel (Quad) Max Output Power x Channels @ Load: 25W x 4 @ 4 Ohm Voltage - Supply: 6 V ~ 18 V Features: Depop, Short-Circuit and Thermal Protection Mounting Type: Surface Mount Operating Temperature: - Supplier Device Package: 36-HSOP Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad	Package: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad	Stock4,944
PCA9674D,512	NXP	IC I/O EXPANDER I2C 8B 16SOIC Number of I/O: 8 Interface: I2C Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 100µA, 25mA Clock Frequency: 1MHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SO	Package: 16-SOIC (0.295", 7.50mm Width)	Stock5,392
MPC850ZQ80BU	NXP	IC MPU MPC8XX 80MHZ 256BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 80MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23x23)	Package: 256-BBGA	Stock3,392
KMPC8255ACZUMHBB	NXP	IC MPU MPC82XX 266MHZ 408TBGA Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 480-LBGA Supplier Device Package: 408-TBGA (37.5x37.5)	Package: 480-LBGA	Stock7,520
T4240NSN7PQB	NXP	IC SOC 64BIT 24X 1.5GHZ 1932BGA Core Processor: PowerPC e6500 Number of Cores/Bus Width: 12 Core, 64-Bit Speed: 1.8GHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1 Gbps (16), 10 Gbps (4) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FCPBGA (45x45)	Package: 1932-BBGA, FCBGA	Stock2,416
MPC8306SCVMABDCA	NXP	IC MPU MPC83XX 133MHZ 369BGA Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 133MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: USB 2.0 (1) Voltage - I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 369-LFBGA Supplier Device Package: 369-PBGA (19x19)	Package: 369-LFBGA	Stock39,120
MC912DT128CCPVE	NXP	IC MCU 16BIT 128KB FLASH 112LQFP Core Processor: CPU12 Core Size: 16-Bit Speed: 8MHz Connectivity: CAN, I2C, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 67 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 16x8/10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	Package: 112-LQFP	Stock6,928
MCHC908JK1CPE	NXP	IC MCU 8BIT 1.5KB FLASH 20DIP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: - Peripherals: LED, LVD, POR, PWM Number of I/O: 14 Program Memory Size: 1.5KB (1.5K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.3 V Data Converters: A/D 12x8b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 20-DIP (0.300", 7.62mm) Supplier Device Package: 20-DIP	Package: 20-DIP (0.300", 7.62mm)	Stock5,888
MC68332GVEH20	NXP	IC MCU 32BIT ROMLESS 132QFP Core Processor: CPU32 Core Size: 32-Bit Speed: 20MHz Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 15 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 132-BQFP Bumpered Supplier Device Package: 132-PQFP (24.13x24.13)	Package: 132-BQFP Bumpered	Stock6,944
XC56309VL100AR2	NXP	IC DSP 24BIT 100MHZ 196-MAPBGA Type: Fixed Point Interface: Host Interface, SSI, SCI Clock Rate: 100MHz Non-Volatile Memory: ROM (576 B) On-Chip RAM: 24kB Voltage - I/O: 3.30V Voltage - Core: 3.30V Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 196-LBGA Supplier Device Package: 196-MAPBGA (15x15)	Package: 196-LBGA	Stock7,856
IP4363CX10/LF,135	NXP	TVS DIODE 10CSP Type: - Unidirectional Channels: - Bidirectional Channels: - Voltage - Reverse Standoff (Typ): - Voltage - Breakdown (Min): - Voltage - Clamping (Max) @ Ipp: - Current - Peak Pulse (10/1000µs): - Power - Peak Pulse: - Power Line Protection: - Applications: - Capacitance @ Frequency: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 10-UFBGA, WLCSP Supplier Device Package: 10-CSP (1.96x0.76)	Package: 10-UFBGA, WLCSP	Stock4,896
MF1PLUS6031DA4/03,	NXP	IC MIFARE PLUS SMART CARD PLLMC Type: RFID Transponder Frequency: 13.56MHz Standards: ISO 14443, MIFARE Interface: UART Voltage - Supply: - Operating Temperature: -25°C ~ 70°C Package / Case: MOA4, Smart Card Module Supplier Device Package: PLLMC	Package: MOA4, Smart Card Module	Stock4,518
MC33594FTA	NXP	IC RF RECEIVER 315,434MHZ 24LQFP Frequency: 315MHz, 434MHz Sensitivity: -105dBm Data Rate (Max): 11 kBaud Modulation or Protocol: FSK, OOK Applications: General Data Transfer Current - Receiving: 5.7mA Data Interface: PCB, Surface Mount Memory Size: - Antenna Connector: PCB, Surface Mount Features: - Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 105°C Package / Case: 24-LQFP Supplier Device Package: 24-LQFP (4x4)	Package: 24-LQFP	Stock241,548
LS1023AXE7MQA	NXP	QORIQ 2XCPU 64-BIT ARM ARCH 1. Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	Package: -	Stock2,688
MCIMX6X4EVM10AC	NXP	I.MX 6SX ROM PERF ENHAN Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 200MHz, 1GHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD, LVDS Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Package / Case: 529-LFBGA Supplier Device Package: 529-MAPBGA (19x19)	Package: 529-LFBGA	Stock3,040
S912XEQ384BVAG	NXP	16-BIT MCU S12X CORE 384KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 119 Program Memory Size: 384KB (384K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 24K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 24x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	Package: 144-LQFP	Stock7,872
S9S12XS128J1VAAR	NXP	16-BIT MCU S12X CORE 128KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 40MHz Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 59 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 8x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	Package: 80-QFP	Stock4,416
S9S08EL32F1MTLR	NXP	8-BIT MCU S08 CORE 32KB FLASH Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 22 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 28-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 28-TSSOP	Package: 28-TSSOP (0.173", 4.40mm Width)	Stock4,224
S912ZVLA96AVFMR	NXP	IC MCU 16BIT Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
FS32K148HFT0MLQR	NXP	IC MCU 32BIT 2MB FLASH 144LQFP Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Speed: 80MHz Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: I2S, POR, PWM, WDT Number of I/O: 128 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 32x12b SAR; D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	Package: -	Request a Quote
S711E20E0VFUE3	NXP	8-BIT MCU, 20K EPROM, 768 RAM Memory Type: - Memory Format: - Technology: - Memory Size: - Memory Interface: - Clock Frequency: - Write Cycle Time - Word, Page: - Access Time: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
MC35FS6516NAER2	NXP	SYSTEM BASIS CHIP, DCDC 1.5A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	Package: -	Request a Quote
S9S12GN32J0VFT	NXP	IC MCU 16BIT 32KB FLASH 48TFQFN Core Processor: S12 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 48-TFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7)	Package: -	Request a Quote