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NXP |
MOSFET N-CH 108V 100A I2PAK
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 108V
- Current - Continuous Drain (Id) @ 25°C: 100A (Tj)
- Drive Voltage (Max Rds On, Min Rds On): 10V
- Vgs(th) (Max) @ Id: 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs: 111nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds: 5512pF @ 50V
- Vgs (Max): ±20V
- FET Feature: -
- Power Dissipation (Max): 263W (Tc)
- Rds On (Max) @ Id, Vgs: 8.5 mOhm @ 25A, 10V
- Operating Temperature: -55°C ~ 175°C (TJ)
- Mounting Type: Through Hole
- Supplier Device Package: I2PAK
- Package / Case: TO-262-3 Long Leads, I2Pak, TO-262AA
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Package: TO-262-3 Long Leads, I2Pak, TO-262AA |
Stock3,520 |
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NXP |
IC GATE AND 4CH 2-INP 14-TSSOP
- Logic Type: AND Gate
- Number of Circuits: 4
- Number of Inputs: 2
- Features: -
- Voltage - Supply: 1 V ~ 5.5 V
- Current - Quiescent (Max): 20µA
- Current - Output High, Low: 12mA, 12mA
- Logic Level - Low: 0.3 V ~ 0.8 V
- Logic Level - High: 0.9 V ~ 2 V
- Max Propagation Delay @ V, Max CL: 11ns @ 5V, 50pF
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Supplier Device Package: 14-TSSOP
- Package / Case: 14-TSSOP (0.173", 4.40mm Width)
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Package: 14-TSSOP (0.173", 4.40mm Width) |
Stock3,856 |
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NXP |
IC BUS TXRX 3-ST OCTAL 20TSSOP
- Logic Type: Transceiver, Non-Inverting
- Number of Elements: 1
- Number of Bits per Element: 8
- Input Type: -
- Output Type: Push-Pull
- Current - Output High, Low: 24mA, 24mA
- Voltage - Supply: 1.2 V ~ 3.6 V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 20-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 20-TSSOP
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Package: 20-TSSOP (0.173", 4.40mm Width) |
Stock7,536 |
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NXP |
IC BUFF/DVR TRI-ST DUAL 20SSOP
- Logic Type: Buffer, Non-Inverting
- Number of Elements: 2
- Number of Bits per Element: 4
- Input Type: -
- Output Type: Push-Pull
- Current - Output High, Low: 32mA, 12mA
- Voltage - Supply: 4.5 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 20-SSOP (0.209", 5.30mm Width)
- Supplier Device Package: 20-SSOP
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Package: 20-SSOP (0.209", 5.30mm Width) |
Stock2,064 |
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NXP |
IC BUFFER/DRIVER HEX 14DIP
- Logic Type: Buffer, Non-Inverting
- Number of Elements: 6
- Number of Bits per Element: 1
- Input Type: -
- Output Type: Open Collector
- Current - Output High, Low: -, 64mA
- Voltage - Supply: 4.5 V ~ 5.5 V
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Through Hole
- Package / Case: 14-DIP (0.300", 7.62mm)
- Supplier Device Package: 14-DIP
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Package: 14-DIP (0.300", 7.62mm) |
Stock6,512 |
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NXP |
IC UART QUAD W/FIFO 64-LQFP
- Features: -
- Number of Channels: 4, QUART
- FIFO's: 16 Byte
- Protocol: -
- Data Rate (Max): 5Mbps
- Voltage - Supply: 2.5V, 3.3V, 5V
- With Auto Flow Control: Yes
- With IrDA Encoder/Decoder: Yes
- With False Start Bit Detection: Yes
- With Modem Control: Yes
- Mounting Type: Surface Mount
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
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Package: 64-LQFP |
Stock2,208 |
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NXP |
IC ANLG SWITCH SPDT 6XSON
- Switch Circuit: SPDT
- Multiplexer/Demultiplexer Circuit: 2:1
- Number of Circuits: 1
- On-State Resistance (Max): 750 mOhm
- Channel-to-Channel Matching (ΔRon): 20 mOhm
- Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V
- Voltage - Supply, Dual (V±): -
- Switch Time (Ton, Toff) (Max): 25ns, 10ns
- -3db Bandwidth: 60MHz
- Charge Injection: 15pC
- Channel Capacitance (CS(off), CD(off)): 35pF
- Current - Leakage (IS(off)) (Max): 10nA
- Crosstalk: -
- Operating Temperature: -40°C ~ 125°C (TA)
- Package / Case: 6-XFDFN
- Supplier Device Package: 6-XSON, SOT886 (1.45x1)
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Package: 6-XFDFN |
Stock3,024 |
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NXP |
IC MPU M680X0 50MHZ 206PGA
- Core Processor: 68060
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 50MHz
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 5.0V
- Operating Temperature: 0°C ~ 70°C (TA)
- Security Features: -
- Package / Case: 206-BEPGA
- Supplier Device Package: 206-PGA (47.25x47.25)
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Package: 206-BEPGA |
Stock3,344 |
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NXP |
IC MCU 32BIT ROMLESS 160QFP
- Core Processor: Coldfire V2
- Core Size: 32-Bit
- Speed: 100MHz
- Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
- Peripherals: DMA, WDT
- Number of I/O: 39
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 1.4 V ~ 1.6 V
- Data Converters: -
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 160-BQFP
- Supplier Device Package: 160-QFP (28x28)
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Package: 160-BQFP |
Stock5,808 |
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NXP |
IC MCU 32BIT 256KB FLASH 121BGA
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 100MHz
- Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Peripherals: DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O: 86
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 38x16b, D/A 2x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 121-LFBGA
- Supplier Device Package: 121-MAPBGA (8x8)
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Package: 121-LFBGA |
Stock5,776 |
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NXP |
IC MCU 8BIT 16KB FLASH 20TSSOP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: I2C, LIN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 16
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 12x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 20-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 20-TSSOP
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Package: 20-TSSOP (0.173", 4.40mm Width) |
Stock3,632 |
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NXP |
IC MCU 32BIT 32KB FLASH 33HVQFN
- Core Processor: ARM? Cortex?-M0
- Core Size: 32-Bit
- Speed: 50MHz
- Connectivity: I2C, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, POR, WDT
- Number of I/O: 28
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 32-VFQFN Exposed Pad
- Supplier Device Package: 32-HVQFN (5x5)
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Package: 32-VFQFN Exposed Pad |
Stock5,456 |
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NXP |
IC MCU 32BIT 4MB FLASH 208LQFP
- Core Processor: ARM? Cortex?-A5, -M4, -M0+
- Core Size: 32-Bit Tri-Core
- Speed: 80MHz, 160MHz, 320MHz
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, LIN, SPI
- Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
- Number of I/O: -
- Program Memory Size: 4MB (4M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 2.3M x 8
- Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
- Data Converters: A/D 24x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 208-LQFP Exposed Pad
- Supplier Device Package: 208-LQFP (28x28)
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Package: 208-LQFP Exposed Pad |
Stock8,964 |
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NXP |
IC MCU 32BIT 256KB FLASH 144LQFP
- Core Processor: ARM7?
- Core Size: 16/32-Bit
- Speed: 60MHz
- Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
- Peripherals: POR, PWM, WDT
- Number of I/O: 112
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 16K x 8
- Voltage - Supply (Vcc/Vdd): 1.65 V ~ 1.95 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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Package: 144-LQFP |
Stock6,864 |
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NXP |
IC MCU 16BIT 512KB FLASH 112LQFP
- Core Processor: HCS12
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: CAN, I2C, SCI, SPI
- Peripherals: PWM, WDT
- Number of I/O: 91
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 12K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
- Data Converters: A/D 16x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 112-LQFP
- Supplier Device Package: 112-LQFP (20x20)
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Package: 112-LQFP |
Stock14,580 |
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NXP |
IC 64KS12 LIN2XLS/HS ISENSE
- Applications: Automotive
- Core Processor: S12
- Program Memory Type: FLASH (64 kB)
- Controller Series: HCS12
- RAM Size: 6K x 8
- Interface: LIN, SCI
- Number of I/O: 9
- Voltage - Supply: 2.25 V ~ 5.25 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-LQFP-EP (7x7)
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Package: 48-LQFP Exposed Pad |
Stock3,648 |
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NXP |
ADC 10BIT SPI 65MSPS 40HVQFN
- Number of Bits: 10
- Sampling Rate (Per Second): 65M
- Number of Inputs: 1
- Input Type: Differential, Single Ended
- Data Interface: LVDS - Parallel, Parallel
- Configuration: S/H-ADC
- Ratio - S/H:ADC: 1:1
- Number of A/D Converters: 1
- Architecture: Pipelined
- Reference Type: External, Internal
- Voltage - Supply, Analog: 2.85 V ~ 3.4 V
- Voltage - Supply, Digital: 1.65 V ~ 3.6 V
- Features: -
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 40-VFQFN Exposed Pad
- Supplier Device Package: 40-HVQFN (6x6)
- Mounting Type: -
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Package: 40-VFQFN Exposed Pad |
Stock10,116 |
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NXP |
IC CLK BUF DDR 190MHZ 1CIRC
- PLL: Yes
- Main Purpose: Memory, DDR, SDRAM
- Input: SSTL-2
- Output: SSTL-2
- Number of Circuits: 1
- Ratio - Input:Output: 1:10
- Differential - Input:Output: Yes/Yes
- Frequency - Max: 190MHz
- Voltage - Supply: 2.3 V ~ 2.7 V
- Operating Temperature: 0°C ~ 70°C
- Mounting Type: Surface Mount
- Package / Case: 48-TFSOP (0.173", 4.40mm Width)
- Supplier Device Package: 48-TSSOP
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Package: 48-TFSOP (0.173", 4.40mm Width) |
Stock5,712 |
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NXP |
ACCELEROMETER 25G 16QFN
- Type: Digital
- Axis: X
- Acceleration Range: ±25g
- Sensitivity (LSB/g): 20.48
- Sensitivity (mV/g): -
- Bandwidth: -
- Output Type: SPI
- Voltage - Supply: 3.135 V ~ 5.25 V
- Features: -
- Operating Temperature: -
- Mounting Type: Surface Mount
- Package / Case: 16-QFN Exposed Pad
- Supplier Device Package: 16-QFN-EP (6x6)
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Package: 16-QFN Exposed Pad |
Stock4,608 |
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NXP |
IC SMART CARD 2KB FFC UNCASED
- Type: -
- Frequency: -
- Standards: -
- Interface: -
- Voltage - Supply: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock2,340 |
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NXP |
IC MIXR 150MHZ RSSI EQUIP 20SSOP
- RF Type: Cellular, ASK, FSK
- Frequency: 150MHz
- Number of Mixers: 2
- Gain: 17dB
- Noise Figure: 6.8dB
- Secondary Attributes: RSSI Equipped
- Current - Supply: 3.5mA
- Voltage - Supply: 2.7 V ~ 7 V
- Package / Case: 20-LSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 20-SSOP
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Package: 20-LSSOP (0.173", 4.40mm Width) |
Stock3,960 |
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NXP |
CABLE PREPROCESSOR LP TUNER
- Function: -
- Interface: -
- Number of Circuits: -
- Voltage - Supply: -
- Current - Supply: -
- Power (Watts): -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock3,872 |
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NXP |
QORIQ 64B POWERARCH8X 1.8GHZ T
- Core Processor: -
- Number of Cores/Bus Width: -
- Speed: -
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: -
- Operating Temperature: -
- Security Features: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock4,640 |
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NXP |
16-BIT MCU S12X CORE 768KB FLA
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 50MHz
- Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 119
- Program Memory Size: 768KB (768K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 48K x 8
- Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
- Data Converters: A/D 24x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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Package: 144-LQFP |
Stock6,384 |
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NXP |
MAGNIV 16-BIT MCU S12Z CORE 96
- Core Processor: S12Z
- Core Size: 16-Bit
- Speed: 32MHz
- Connectivity: CANbus, I²C, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 28
- Program Memory Size: 96KB (96K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
- Data Converters: A/D 10x10b, D/A 1x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP |
Stock7,888 |
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NXP |
SYSTEM BASIS CHIP, LINEAR 0.5A V
- Applications: System Basis Chip
- Current - Supply: -
- Voltage - Supply: 1V ~ 5V
- Operating Temperature: -40°C ~ 150°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-HLQFP (7x7)
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Package: - |
Request a Quote |
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NXP |
IC MPU I.MX8ML 1.8GHZ 548LFBGA
- Core Processor: ARM® Cortex®-A53
- Number of Cores/Bus Width: 4 Core, 64-Bit
- Speed: 1.8GHz
- Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
- RAM Controllers: DDR4, LPDDR4
- Graphics Acceleration: Yes
- Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
- Ethernet: GbE (2)
- SATA: -
- USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
- Voltage - I/O: -
- Operating Temperature: -40°C ~ 105°C (TJ)
- Security Features: ARM TZ, CAAM, RDC
- Package / Case: 548-LFBGA
- Supplier Device Package: 548-LFBGA (15x15)
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Package: - |
Request a Quote |
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NXP |
MICROCONTROLLER, 8 BIT, HC08/S08
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: SCI, SPI
- Peripherals: LVD, POR, PWM
- Number of I/O: 13
- Program Memory Size: 4KB (4K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128 x 8
- Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
- Data Converters: A/D 10x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 16-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 16-SOIC
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Package: - |
Request a Quote |
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