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NXP |
FET RF 2CH 65V 2.03GHZ NI780H-4
- Transistor Type: LDMOS (Dual)
- Frequency: 2.03GHz
- Gain: 16dB
- Voltage - Test: 28V
- Current Rating: -
- Noise Figure: -
- Current - Test: 400mA
- Power - Output: 20W
- Voltage - Rated: 65V
- Package / Case: NI-780-4
- Supplier Device Package: NI-780-4
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Package: NI-780-4 |
Stock7,680 |
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NXP |
IC PWR MGMT I.MX6 56QFN
- Applications: Converter, i.MX6
- Voltage - Input: 2.8 V ~ 4.5 V
- Number of Outputs: 11
- Voltage - Output: Multiple
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 56-VFQFN Exposed Pad
- Supplier Device Package: 56-QFN (8x8)
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Package: 56-VFQFN Exposed Pad |
Stock7,904 |
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NXP |
IC ENGINE CTRL SW/DVR 54-SOIC
- Applications: Automotive
- Current - Supply: 10mA
- Voltage - Supply: 5 V ~ 36 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
- Supplier Device Package: 54-SOICW-EP
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Package: 54-SSOP (0.295", 7.50mm Width) Exposed Pad |
Stock3,152 |
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NXP |
IC SW LO SIDE 6-OUTPUT 30HSOP
- Switch Type: General Purpose
- Number of Outputs: 6
- Ratio - Input:Output: 1:1
- Output Configuration: Low Side
- Output Type: N-Channel
- Interface: SPI, Parallel
- Voltage - Load: 8 V ~ 25 V
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Current - Output (Max): -
- Rds On (Typ): 400 mOhm
- Input Type: -
- Features: -
- Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
- Operating Temperature: -40°C ~ 150°C (TJ)
- Package / Case: 30-BSOP (0.433", 11.00mm Width) Exposed Pad
- Supplier Device Package: 30-HSOP
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Package: 30-BSOP (0.433", 11.00mm Width) Exposed Pad |
Stock5,952 |
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NXP |
IC MOTOR DRIVER PAR 20SO
- Motor Type - Stepper: -
- Motor Type - AC, DC: Brushless DC (BLDC)
- Function: Driver - Fully Integrated, Control and Power Stage
- Output Configuration: Half Bridge (3)
- Interface: Parallel
- Technology: Bipolar
- Step Resolution: -
- Applications: General Purpose
- Current - Output: 1A
- Voltage - Supply: 4 V ~ 18 V
- Voltage - Load: 1.7 V ~ 16 V
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 20-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 20-SO
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Package: 20-SOIC (0.295", 7.50mm Width) |
Stock4,816 |
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NXP |
IC 12-24BIT MUX D LATCH 56TSSOP
- Logic Type: D-Type Transparent Latch
- Circuit: 12:24
- Output Type: Tri-State
- Voltage - Supply: 2.3 V ~ 2.7 V
- Independent Circuits: 1
- Delay Time - Propagation: 2.8ns
- Current - Output High, Low: 8mA, 24mA
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 56-TFSOP (0.240", 6.10mm Width)
- Supplier Device Package: 56-TSSOP
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Package: 56-TFSOP (0.240", 6.10mm Width) |
Stock2,864 |
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NXP |
IC AMP GAIN PWR 860MHZ SOT115J
- Applications: CATV
- Output Type: -
- Number of Circuits: 1
- -3db Bandwidth: -
- Slew Rate: -
- Current - Supply: 395mA
- Current - Output / Channel: -
- Voltage - Supply, Single/Dual (±): -
- Mounting Type: -
- Package / Case: SOT-115J
- Supplier Device Package: SOT115J
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Package: SOT-115J |
Stock2,352 |
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NXP |
IC I/O EXPANDER I2C 8B 16TSSOP
- Number of I/O: 8
- Interface: I2C, SMBus
- Interrupt Output: Yes
- Features: POR
- Output Type: Push-Pull
- Current - Output Source/Sink: 10mA, 25mA
- Clock Frequency: 400kHz
- Voltage - Supply: 2.3 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 16-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 16-TSSOP
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Package: 16-TSSOP (0.173", 4.40mm Width) |
Stock36,060 |
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NXP |
IC I/O EXPANDER I2C 8B 16HVQFN
- Number of I/O: 8
- Interface: I2C
- Interrupt Output: Yes
- Features: POR
- Output Type: Push-Pull
- Current - Output Source/Sink: 100µA, 25mA
- Clock Frequency: 1MHz
- Voltage - Supply: 2.3 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 16-VFQFN Exposed Pad
- Supplier Device Package: 16-HVQFN (3x3)
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Package: 16-VFQFN Exposed Pad |
Stock7,792 |
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NXP |
IC MPU I.MX25 400MHZ 400MAPBGA
- Core Processor: ARM926EJ-S
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 400MHz
- Co-Processors/DSP: -
- RAM Controllers: LPDDR, DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: Keypad, LCD, Touchscreen
- Ethernet: 10/100 Mbps (1)
- SATA: -
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
- Operating Temperature: -20°C ~ 70°C (TA)
- Security Features: -
- Package / Case: 400-LFBGA
- Supplier Device Package: 400-MAPBGA (17x17)
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Package: 400-LFBGA |
Stock4,048 |
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NXP |
IC MPU M683XX 25MHZ 357BGA
- Core Processor: CPU32+
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 25MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (1)
- SATA: -
- USB: -
- Voltage - I/O: 5.0V
- Operating Temperature: -40°C ~ 85°C (TA)
- Security Features: -
- Package / Case: 357-BBGA
- Supplier Device Package: 357-PBGA (25x25)
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Package: 357-BBGA |
Stock7,728 |
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NXP |
IC MPU Q OR IQ 800MHZ 689TEBGA
- Core Processor: PowerPC e500v2
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: Communications; QUICC Engine
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (3)
- SATA: -
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: -
- Operating Temperature: 0°C ~ 125°C (TA)
- Security Features: -
- Package / Case: 689-BBGA Exposed Pad
- Supplier Device Package: 689-TEPBGA II (31x31)
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Package: 689-BBGA Exposed Pad |
Stock4,512 |
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NXP |
IC MCU 32BIT ROMLESS 364MAPBGA
- Core Processor: ARM? Cortex?-A5
- Core Size: 32-Bit Single-Core
- Speed: 500MHz
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG
- Peripherals: DMA, LVD, WDT
- Number of I/O: -
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 1.5MB
- Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
- Data Converters: A/D Dual x 12b, D/A Dual x 12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 364-LFBGA
- Supplier Device Package: 364-MAPBGA (17x17)
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Package: 364-LFBGA |
Stock3,840 |
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NXP |
IC MCU 32BIT 256KB FLASH 144BGA
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 100MHz
- Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
- Peripherals: DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O: 104
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 37x16b, D/A 2x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 144-LBGA
- Supplier Device Package: 144-MAPBGA (13x13)
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Package: 144-LBGA |
Stock3,072 |
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NXP |
IC MCU 8BIT 32KB FLASH 44QFP
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: I2C, IRSCI, SCI, SPI
- Peripherals: LED, LVD, POR, PWM
- Number of I/O: 32
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 44-QFP
- Supplier Device Package: 44-QFP (10x10)
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Package: 44-QFP |
Stock5,120 |
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NXP |
IC MCU 8BIT 1.5KB FLASH 16SOIC
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: -
- Peripherals: LVD, POR, PWM
- Number of I/O: 13
- Program Memory Size: 1.5KB (1.5K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 4x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 16-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 16-SOIC
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Package: 16-SOIC (0.295", 7.50mm Width) |
Stock57,360 |
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NXP |
IC MCU 32BIT ROMLESS 388PBGA
- Core Processor: Coldfire V4E
- Core Size: 32-Bit
- Speed: 200MHz
- Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
- Peripherals: DMA, PWM, WDT
- Number of I/O: 99
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 1.43 V ~ 1.58 V
- Data Converters: -
- Oscillator Type: External
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: -
- Package / Case: 388-BBGA
- Supplier Device Package: 388-PBGA (27x27)
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Package: 388-BBGA |
Stock4,416 |
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NXP |
IC MCU 16BIT 32KB FLASH 80QFP
- Core Processor: CPU12
- Core Size: 16-Bit
- Speed: 8MHz
- Connectivity: SCI, SPI
- Peripherals: POR, PWM, WDT
- Number of I/O: 63
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 768 x 8
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Data Converters: A/D 8x10b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 80-QFP
- Supplier Device Package: 80-QFP (14x14)
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Package: 80-QFP |
Stock5,648 |
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NXP |
IC MCU 16BIT 512KB FLASH 144LQFP
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 50MHz
- Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 119
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
- Data Converters: A/D 24x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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Package: 144-LQFP |
Stock7,376 |
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NXP |
IC MCU 32BIT 512KB FLASH 100BGA
- Core Processor: ARM? Cortex?-M4/M0
- Core Size: 32-Bit Dual-Core
- Speed: 204MHz
- Connectivity: CAN, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
- Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
- Number of I/O: 49
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 16K x 8
- RAM Size: 104K x 8
- Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
- Data Converters: A/D 4x10b; D/A 1x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 100-TFBGA
- Supplier Device Package: 100-TFBGA (9x9)
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Package: 100-TFBGA |
Stock4,752 |
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NXP |
IC MCU 32BIT 128KB FLASH 64LQFP
- Core Processor: ARM? Cortex?-M0+
- Core Size: 32-Bit
- Speed: 48MHz
- Connectivity: CAN, I2C, LIN, SPI, UART/USART
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 58
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 16K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 16x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
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Package: 64-LQFP |
Stock3,456 |
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NXP |
IC PRESSURE SENSOR 8-SOP
- Pressure Type: Differential
- Operating Pressure: 7.25 PSI (50 kPa)
- Output Type: Analog Voltage
- Output: 0.06 V ~ 2.82 V
- Accuracy: ±2.5%
- Voltage - Supply: 2.7 V ~ 3.3 V
- Port Size: Male - 0.13" (3.3mm) Tube, Dual
- Port Style: Barbed
- Features: Temperature Compensated
- Termination Style: PCB
- Maximum Pressure: 29.01 PSI (200 kPa)
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
- Supplier Device Package: 8-SOP
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Package: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side |
Stock7,578 |
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NXP |
PF4210
- Applications: Audio, Video
- Current - Supply: -
- Voltage - Supply: 2.8 V ~ 4.5 V
- Operating Temperature: 0°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 56-VFQFN Exposed Pad
- Supplier Device Package: 56-QFN-EP (8x8)
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Package: 56-VFQFN Exposed Pad |
Stock7,392 |
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NXP |
I.MX 32-BIT MPU ARM CORTEX-A7 C
- Core Processor: ARM® Cortex®-A7
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 528MHz
- Co-Processors/DSP: Multimedia; NEON™ SIMD
- RAM Controllers: LPDDR2, DDR3, DDR3L
- Graphics Acceleration: No
- Display & Interface Controllers: LVDS
- Ethernet: 10/100 Mbps (1)
- SATA: -
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TJ)
- Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
- Package / Case: 289-LFBGA
- Supplier Device Package: 289-MAPBGA (14x14)
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Package: 289-LFBGA |
Stock5,184 |
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NXP |
16BIT 128K FLASH
- Core Processor: 12V1
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: CANbus, IrDA, LINbus, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 40
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
- Data Converters: A/D 12x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP |
Stock6,848 |
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NXP |
POWER MANAGEMENT IC I.MX8 NON-PR
- Applications: High Performance i.MX 8, S32x Processor Based
- Current - Supply: -
- Voltage - Supply: 2.5V ~ 5.5V
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount, Wettable Flank
- Package / Case: 56-VFQFN Exposed Pad
- Supplier Device Package: 56-HVQFN (8x8)
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Package: - |
Request a Quote |
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NXP |
S32K144 32-BIT MCU, ARM CORTEX-M
- Core Processor: -
- Core Size: -
- Speed: -
- Connectivity: -
- Peripherals: -
- Number of I/O: -
- Program Memory Size: -
- Program Memory Type: -
- EEPROM Size: -
- RAM Size: -
- Voltage - Supply (Vcc/Vdd): -
- Data Converters: -
- Oscillator Type: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
POWER MANAGEMENT IC, PRE-PROG, 3
- Applications: High Performance i.MX 8, S32x Processor Based
- Current - Supply: 200µA
- Voltage - Supply: 2.5V ~ 5.5V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount, Wettable Flank
- Package / Case: 40-VFQFN Exposed Pad
- Supplier Device Package: 40-HVQFN (6x6)
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Package: - |
Request a Quote |
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