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NXP |
MOSFET N-CH 100V 2.5A SOT223
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 100V
- Current - Continuous Drain (Id) @ 25°C: 2.5A (Tc)
- Drive Voltage (Max Rds On, Min Rds On): 10V
- Vgs(th) (Max) @ Id: 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs: 5.1nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds: 160pF @ 25V
- Vgs (Max): ±20V
- FET Feature: -
- Power Dissipation (Max): 6.25W (Tc)
- Rds On (Max) @ Id, Vgs: 430 mOhm @ 1.75A, 10V
- Operating Temperature: -65°C ~ 150°C (TJ)
- Mounting Type: Surface Mount
- Supplier Device Package: SOT-223
- Package / Case: TO-261-4, TO-261AA
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Package: TO-261-4, TO-261AA |
Stock2,992 |
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NXP |
DIODE ZENER 6.2V 300MW SMT3
- Voltage - Zener (Nom) (Vz): 6.2V
- Tolerance: ±2%
- Power - Max: 300mW
- Impedance (Max) (Zzt): 10 Ohms
- Current - Reverse Leakage @ Vr: 2µA @ 3V
- Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
- Operating Temperature: -65°C ~ 150°C
- Mounting Type: Surface Mount
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Supplier Device Package: SMT3; MPAK
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Package: TO-236-3, SC-59, SOT-23-3 |
Stock3,312 |
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NXP |
IC REG LINEAR 1.8V 150MA 4WLCSP
- Output Configuration: Positive
- Output Type: Fixed
- Number of Regulators: 1
- Voltage - Input (Max): 5.5V
- Voltage - Output (Min/Fixed): 1.8V
- Voltage - Output (Max): -
- Voltage Dropout (Max): 0.075V @ 150mA
- Current - Output: 150mA
- Current - Quiescent (Iq): -
- Current - Supply (Max): 100µA ~ 250µA
- PSRR: 55dB (1kHz)
- Control Features: Enable
- Protection Features: Over Current, Over Temperature, Transient Voltage
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 4-XFBGA, WLCSP
- Supplier Device Package: 4-WLCSP (0.76x0.76)
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Package: 4-XFBGA, WLCSP |
Stock3,648 |
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NXP |
IC REG LINEAR 2.7V 300MA 4WLCSP
- Output Configuration: Positive
- Output Type: Fixed
- Number of Regulators: 1
- Voltage - Input (Max): 5.5V
- Voltage - Output (Min/Fixed): 2.7V
- Voltage - Output (Max): -
- Voltage Dropout (Max): 0.16V @ 300mA
- Current - Output: 300mA
- Current - Quiescent (Iq): -
- Current - Supply (Max): 100µA ~ 250µA
- PSRR: 55dB (1kHz)
- Control Features: Enable
- Protection Features: Over Current, Over Temperature
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 4-XFBGA, WLCSP
- Supplier Device Package: 4-WLCSP (0.76x0.76)
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Package: 4-XFBGA, WLCSP |
Stock3,600 |
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NXP |
IC DDR TERM W/STANDBY 8-SOIC
- Applications: Memory, DDR/DDR2 Regulator
- Current - Supply: 14mA
- Voltage - Supply: 1.6 V ~ 3.6 V
- Operating Temperature: 0°C ~ 70°C
- Mounting Type: Surface Mount
- Package / Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad
- Supplier Device Package: 8-HSO
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Package: 8-SOIC (0.154", 3.90mm Width) Exposed Pad |
Stock4,032 |
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NXP |
IC LED DRVR LIN DIM 25MA 24TSSOP
- Type: Power Switch
- Topology: -
- Internal Switch(s): Yes
- Number of Outputs: 16
- Voltage - Supply (Min): 2.3V
- Voltage - Supply (Max): 5.5V
- Voltage - Output: -
- Current - Output / Channel: 25mA
- Frequency: 400kHz
- Dimming: I2C
- Applications: -
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 24-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 24-TSSOP
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Package: 24-TSSOP (0.173", 4.40mm Width) |
Stock6,192 |
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NXP |
IC XLATR QUAD BI-DIREC 14-TSSOP
- Translator Type: Mixed Signal
- Channel Type: Bidirectional
- Number of Circuits: 1
- Channels per Circuit: 4
- Voltage - VCCA: -
- Voltage - VCCB: -
- Input Signal: GTL
- Output Signal: LVTTL, TTL
- Output Type: Non-Inverted
- Data Rate: -
- Operating Temperature: -40°C ~ 85°C (TA)
- Features: -
- Mounting Type: Surface Mount
- Package / Case: 14-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 14-TSSOP
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Package: 14-TSSOP (0.173", 4.40mm Width) |
Stock18,642 |
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NXP |
IC TRANSCVR TRI-ST 32BIT 96BGA
- Logic Type: Transceiver, Non-Inverting
- Number of Elements: 4
- Number of Bits per Element: 8
- Input Type: -
- Output Type: Push-Pull
- Current - Output High, Low: 24mA, 24mA
- Voltage - Supply: 1.2 V ~ 3.6 V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 96-LFBGA
- Supplier Device Package: 96-LFBGA (13.5x5.5)
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Package: 96-LFBGA |
Stock6,480 |
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NXP |
IC PUSH-PULL AMP 600MHZ SOT115J
- Applications: CATV
- Output Type: Push-Pull
- Number of Circuits: 1
- -3db Bandwidth: -
- Slew Rate: -
- Current - Supply: 240mA
- Current - Output / Channel: -
- Voltage - Supply, Single/Dual (±): -
- Mounting Type: -
- Package / Case: SOT-115J
- Supplier Device Package: SOT115J
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Package: SOT-115J |
Stock6,112 |
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NXP |
IC HDMI INTERFACE 144HLQFP
- Applications: HDTV
- Interface: HDMI
- Voltage - Supply: 1.8V, 3.3V
- Package / Case: 144-LQFP Exposed Pad
- Supplier Device Package: 144-HLQFP (20x20)
- Mounting Type: Surface Mount
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Package: 144-LQFP Exposed Pad |
Stock2,624 |
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NXP |
IC MPU MPC83XX 533MHZ 740TBGA
- Core Processor: PowerPC e300
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 533MHz
- Co-Processors/DSP: Communications; QUICC Engine
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (1)
- SATA: -
- USB: USB 1.x (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 740-LBGA
- Supplier Device Package: 740-TBGA (37.5x37.5)
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Package: 740-LBGA |
Stock4,992 |
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NXP |
IC MPU MPC82XX 450MHZ 408TBGA
- Core Processor: PowerPC G2_LE
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 450MHz
- Co-Processors/DSP: Communications; RISC CPM
- RAM Controllers: DRAM, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100 Mbps (3)
- SATA: -
- USB: USB 2.0 (1)
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 480-LBGA
- Supplier Device Package: 408-TBGA (37.5x37.5)
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Package: 480-LBGA |
Stock7,584 |
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NXP |
IC MPU MPC8XX 80MHZ 357BGA
- Core Processor: MPC8xx
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 80MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (4)
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 95°C (TA)
- Security Features: -
- Package / Case: 357-BBGA
- Supplier Device Package: 357-PBGA (25x25)
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Package: 357-BBGA |
Stock6,848 |
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NXP |
IC MPU MPC8XX 80MHZ 256BGA
- Core Processor: MPC8xx
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 80MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (1)
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 95°C (TA)
- Security Features: -
- Package / Case: 256-BBGA
- Supplier Device Package: 256-PBGA (23x23)
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Package: 256-BBGA |
Stock3,440 |
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NXP |
IC MCU 8BIT 8KB FLASH 32LQFP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: I2C, LIN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 30
- Program Memory Size: 8KB (8K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 768 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 12x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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Package: 32-LQFP |
Stock4,352 |
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NXP |
IC MCU 16BIT 96KB FLASH 80QFP
- Core Processor: HCS12
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: CAN, EBI/EMI, SCI, SPI
- Peripherals: POR, PWM, WDT
- Number of I/O: 60
- Program Memory Size: 96KB (96K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 80-QFP
- Supplier Device Package: 80-QFP (14x14)
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Package: 80-QFP |
Stock2,880 |
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NXP |
IC MCU 32BIT 256KB FLASH 49WLCSP
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 100MHz
- Connectivity: I2C, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O: 39
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 104K x 8
- Voltage - Supply (Vcc/Vdd): 1.62 V ~ 3.6 V
- Data Converters: A/D 12x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 49-UFBGA, WLCSP
- Supplier Device Package: 49-WLCSP (3.29x3.29)
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Package: 49-UFBGA, WLCSP |
Stock5,952 |
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NXP |
IC MCU 32BIT 256KB FLASH 64LQFP
- Core Processor: ARM7?
- Core Size: 16/32-Bit
- Speed: 60MHz
- Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
- Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O: 45
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 40K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
- Data Converters: A/D 14x10b; D/A 1x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
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Package: 64-LQFP |
Stock15,900 |
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NXP |
DSP 16BIT 300MHZ CPM 332FCBGA
- Type: SC140 Core
- Interface: Communications Processor Module (CPM)
- Clock Rate: 300MHz
- Non-Volatile Memory: External
- On-Chip RAM: 512kB
- Voltage - I/O: 3.30V
- Voltage - Core: 1.60V
- Operating Temperature: -40°C ~ 75°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 332-BFBGA, FCPBGA
- Supplier Device Package: 332-FCBGA (17x17)
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Package: 332-BFBGA, FCPBGA |
Stock2,512 |
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NXP |
SENSOR TEMPERATURE I2C/SMBUS 8SO
- Sensor Type: Digital, Local/Remote
- Sensing Temperature - Local: -40°C ~ 125°C
- Sensing Temperature - Remote: -40°C ~ 125°C
- Output Type: I2C/SMBus
- Voltage - Supply: 3 V ~ 5.5 V
- Resolution: 10 b
- Features: Output Switch, Programmable Limit
- Accuracy - Highest (Lowest): ±2°C (±3°C)
- Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SO
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock5,184 |
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NXP |
IC PRESSURE SENSOR 8-SOP
- Pressure Type: Differential
- Operating Pressure: 0.57 PSI (3.92 kPa)
- Output Type: Analog Voltage
- Output: 0.6 V ~ 3 V
- Accuracy: ±2.5%
- Voltage - Supply: 2.7 V ~ 3.3 V
- Port Size: Male - 0.13" (3.3mm) Tube, Dual
- Port Style: Barbed
- Features: Temperature Compensated
- Termination Style: PCB
- Maximum Pressure: 2.32 PSI (16 kPa)
- Operating Temperature: 0°C ~ 85°C
- Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
- Supplier Device Package: -
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Package: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side |
Stock9,768 |
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NXP |
CARD READER MIFARE
- RF Type: -
- Frequency: -
- Features: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock6,426 |
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NXP |
IC AMP LNA 5V 900MHZ 8HWSON
- Frequency: 300MHz ~ 1.5GHz
- P1dB: 19dBm
- Gain: 18.3dB
- Noise Figure: 0.43dB
- RF Type: GSM, LTE, W-CDMA
- Voltage - Supply: 4.75 V ~ 5.25 V
- Current - Supply: 48mA
- Test Frequency: 900MHz
- Package / Case: 8-WFDFN Exposed Pad
- Supplier Device Package: 8-HWSON (2x2)
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Package: 8-WFDFN Exposed Pad |
Stock4,500 |
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NXP |
LS1 32BIT ARM SOC 800MHZ DDR3/
- Core Processor: -
- Number of Cores/Bus Width: -
- Speed: -
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: -
- Operating Temperature: -
- Security Features: -
- Package / Case: 525-FBGA, FCBGA
- Supplier Device Package: 525-FCPBGA (19x19)
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Package: 525-FBGA, FCBGA |
Stock6,160 |
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NXP |
MAGNIV 16-BIT MCU S12Z CORE 32
- Core Processor: S12Z
- Core Size: 16-Bit
- Speed: 32MHz
- Connectivity: I²C, IrDA, LINbus, SCI, SPI, UART/USART
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 34
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 128 x 8
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V
- Data Converters: A/D 10x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP |
Stock2,352 |
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NXP |
IC MCU 16BIT 64KB FLASH 48LQFP
- Core Processor: 56800E
- Core Size: 16-Bit
- Speed: 60MHz
- Connectivity: CANbus, I²C, LINbus, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 39
- Program Memory Size: 64KB (32K x 16)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 4K x 16
- Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
- Data Converters: A/D 10x12b; D/A 1x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP |
Stock3,808 |
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NXP |
IC MCU 32BIT 64KB FLASH 32VFQFN
- Core Processor: ARM® Cortex®-M0+
- Core Size: 32-Bit
- Speed: 60MHz
- Connectivity: I2C, I3C, SMBus, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O: 29
- Program Memory Size: 64KB (64K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
- Data Converters: A/D 12x12b SAR
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 32-VFQFN Exposed Pad
- Supplier Device Package: 32-HVQFN (5x5)
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Package: - |
Request a Quote |
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NXP |
IC MCU 32BIT 32KB FLASH 48LQFP
- Core Processor: ARM® Cortex®-M0
- Core Size: 32-Bit Single-Core
- Speed: 50MHz
- Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
- Peripherals: Brown-out Detect/Reset, POR, WDT
- Number of I/O: 40
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 6K x 8
- Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
- Data Converters: A/D 8x10b SAR
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Package: - |
Stock3,300 |
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