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BSP254A,126
NXP

MOSFET P-CH 250V 0.2A SOT54

Package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

Stock2,064
AFT23H200-4S2LR6
NXP

FET RF 2CH 65V 2.3GHZ NI1230-4

Package: NI-1230-4LS2L

Stock3,872
2PB709AQ,115
NXP

TRANS PNP 45V 0.1A SC59

Package: TO-236-3, SC-59, SOT-23-3

Stock7,504
SSTU32864EC/G,557
NXP

IC 25BIT CONFIG REG BUFF 96LFBGA

Package: 96-LFBGA

Stock6,000
TDF8546TH/N2,118
NXP

IC AMP AUDIO BTL 36HSOP

Package: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad

Stock5,232
UJA1061TW/3V3/C/T/
NXP

IC CAN/LIN FAIL-SAFE HS 32HTSSOP

Package: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

Stock7,648
PCF8575CTS/1,112
NXP

IC I/O EXPANDER I2C 16B 24SSOP

Package: 24-SSOP (0.209", 5.30mm Width)

Stock19,428
TJA1055T/CM,118
NXP

IC TXRX CAN ENH FAULT-TOL 14SOIC

Package: 14-SOIC (0.154", 3.90mm Width)

Stock7,488
MPC8378ECVRANG
NXP

IC MPU MPC83XX 800MHZ 689TEBGA

Package: 689-BBGA Exposed Pad

Stock4,096
KMC8360CVVAJDGA
NXP

IC MPU MPC83XX 533MHZ 740TBGA

Package: 740-LBGA

Stock2,224
KMPC8543EVUAQG
NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

Package: 783-BBGA, FCBGA

Stock5,328
KMPC8547VUAUJ
NXP

IC MPU MPC85XX 1.333GHZ 783BGA

Package: 783-BBGA, FCBGA

Stock5,200
MPC8308CZQAFDA
NXP

IC MPU MPC83XX 333MHZ 473MAPBGA

Package: 473-LFBGA

Stock3,552
MCF52258CVN66
NXP

IC MCU 32BIT 512KB FLASH 144BGA

Package: 144-LBGA

Stock12,012
SPC5604CF2MLL6
NXP

IC MCU 32BIT 512KB FLASH 100LQFP

Package: 100-LQFP

Stock5,344
S9S08SG4E2CTJR
NXP

IC MCU 8BIT 4KB FLASH 20TSSOP

Package: 20-TSSOP (0.173", 4.40mm Width)

Stock3,088
MCF5232CVM100
NXP

IC MCU 32BIT ROMLESS 196MAPBGA

Package: 196-LBGA

Stock14,724
LPC11E12FBD48/201,
NXP

IC MCU 32BIT 16KB FLASH 48LQFP

Package: 48-LQFP

Stock7,992
MKE04Z8VFK4
NXP

IC MCU 32BIT 8KB FLASH 24QFN

Package: 24-VFQFN Exposed Pad

Stock9,636
MKV46F256VLL16
NXP

IC MCU 32BIT 256KB FLASH 100LQFP

Package: 100-LQFP

Stock7,792

Part Number	Manufacturer	Description	Package	Stock
BSP254A,126	NXP	MOSFET P-CH 250V 0.2A SOT54 FET Type: P-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 250V Current - Continuous Drain (Id) @ 25°C: 200mA (Ta) Drive Voltage (Max Rds On, Min Rds On): 10V Vgs(th) (Max) @ Id: 2.8V @ 1mA Gate Charge (Qg) (Max) @ Vgs: - Input Capacitance (Ciss) (Max) @ Vds: 90pF @ 25V Vgs (Max): 20V FET Feature: - Power Dissipation (Max): 1W (Ta) Rds On (Max) @ Id, Vgs: 15 Ohm @ 200mA, 10V Operating Temperature: 150°C (TJ) Mounting Type: Through Hole Supplier Device Package: TO-92-3 Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)	Package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)	Stock2,064
AFT23H200-4S2LR6	NXP	FET RF 2CH 65V 2.3GHZ NI1230-4 Transistor Type: LDMOS (Dual) Frequency: 2.3GHz Gain: 15.3dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 500mA Power - Output: 45W Voltage - Rated: 65V Package / Case: NI-1230-4LS2L Supplier Device Package: NI-1230-4LS2L	Package: NI-1230-4LS2L	Stock3,872
2PB709AQ,115	NXP	TRANS PNP 45V 0.1A SC59 Transistor Type: PNP Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 45V Vce Saturation (Max) @ Ib, Ic: 500mV @ 10mA, 100mA Current - Collector Cutoff (Max): 10nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 2mA, 10V Power - Max: 250mW Frequency - Transition: 60MHz Operating Temperature: 150°C (TJ) Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	Package: TO-236-3, SC-59, SOT-23-3	Stock7,504
SSTU32864EC/G,557	NXP	IC 25BIT CONFIG REG BUFF 96LFBGA Logic Type: 1:1, 1:2 Configurable Registered Buffer Supply Voltage: 1.7 V ~ 1.9 V Number of Bits: 25, 14 Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 96-LFBGA Supplier Device Package: 96-LFBGA (13.5x5.5)	Package: 96-LFBGA	Stock6,000
TDF8546TH/N2,118	NXP	IC AMP AUDIO BTL 36HSOP Type: Class AB Output Type: 4-Channel (Quad) Max Output Power x Channels @ Load: 64W x 4 @ 2 Ohm Voltage - Supply: 6 V ~ 18 V Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby Mounting Type: Surface Mount Operating Temperature: - Supplier Device Package: 36-HSOP Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad	Package: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad	Stock5,232
UJA1061TW/3V3/C/T/	NXP	IC CAN/LIN FAIL-SAFE HS 32HTSSOP Applications: Automotive Networking Interface: CAN, LIN Voltage - Supply: 5.5 V ~ 27 V Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Supplier Device Package: 32-HTSSOP Mounting Type: Surface Mount	Package: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad	Stock7,648
PCF8575CTS/1,112	NXP	IC I/O EXPANDER I2C 16B 24SSOP Number of I/O: 16 Interface: I2C Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-SSOP (0.209", 5.30mm Width) Supplier Device Package: 24-SSOP	Package: 24-SSOP (0.209", 5.30mm Width)	Stock19,428
TJA1055T/CM,118	NXP	IC TXRX CAN ENH FAULT-TOL 14SOIC Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: - Data Rate: - Voltage - Supply: 4.75 V ~ 5.25 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SO	Package: 14-SOIC (0.154", 3.90mm Width)	Stock7,488
MPC8378ECVRANG	NXP	IC MPU MPC83XX 800MHZ 689TEBGA Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Security; SEC 3.0 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	Package: 689-BBGA Exposed Pad	Stock4,096
KMC8360CVVAJDGA	NXP	IC MPU MPC83XX 533MHZ 740TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 533MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 740-LBGA Supplier Device Package: 740-TBGA (37.5x37.5)	Package: 740-LBGA	Stock2,224
KMPC8543EVUAQG	NXP	IC MPU MPC85XX 1.0GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	Package: 783-BBGA, FCBGA	Stock5,328
KMPC8547VUAUJ	NXP	IC MPU MPC85XX 1.333GHZ 783BGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.333GHz Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	Package: 783-BBGA, FCBGA	Stock5,200
MPC8308CZQAFDA	NXP	IC MPU MPC83XX 333MHZ 473MAPBGA Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz Co-Processors/DSP: - RAM Controllers: DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 473-LFBGA Supplier Device Package: 473-MAPBGA (19x19)	Package: 473-LFBGA	Stock3,552
MCF52258CVN66	NXP	IC MCU 32BIT 512KB FLASH 144BGA Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 66MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 96 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 144-LBGA Supplier Device Package: 144-MAPBGA (13x13)	Package: 144-LBGA	Stock12,012
SPC5604CF2MLL6	NXP	IC MCU 32BIT 512KB FLASH 100LQFP Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CAN, I2C, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 79 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 16 RAM Size: 48K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 28x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	Package: 100-LQFP	Stock5,344
S9S08SG4E2CTJR	NXP	IC MCU 8BIT 4KB FLASH 20TSSOP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 16 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	Package: 20-TSSOP (0.173", 4.40mm Width)	Stock3,088
MCF5232CVM100	NXP	IC MCU 32BIT ROMLESS 196MAPBGA Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 100MHz Connectivity: CAN, EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, WDT Number of I/O: 97 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.4 V ~ 1.6 V Data Converters: - Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 196-LBGA Supplier Device Package: 196-MAPBGA (15x15)	Package: 196-LBGA	Stock14,724
LPC11E12FBD48/201,	NXP	IC MCU 32BIT 16KB FLASH 48LQFP Core Processor: ARM? Cortex?-M0 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 40 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 6K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	Package: 48-LQFP	Stock7,992
MKE04Z8VFK4	NXP	IC MCU 32BIT 8KB FLASH 24QFN Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PWM, WDT Number of I/O: 22 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 12x12b, D/A 2x6b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-QFN (4x4)	Package: 24-VFQFN Exposed Pad	Stock9,636
MKV46F256VLL16	NXP	IC MCU 32BIT 256KB FLASH 100LQFP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 168MHz Connectivity: CAN, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 74 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 38x12b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	Package: 100-LQFP	Stock7,792
MK22DN512VLH5	NXP	IC MCU 32BIT 512KB FLASH 64LQFP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 18x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	Package: 64-LQFP	Stock6,012
MK10DX32VFM5	NXP	IC MCU 32BIT 32KB FLASH 32QFN Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, IrDA, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 24 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 10x16b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-QFN Exposed Pad (5x5)	Package: 32-VFQFN Exposed Pad	Stock8,268
MSC8157TAG1000A	NXP	IC DSP 6X 1GHZ SC3850 783FCBGA Type: SC3850 Six Core Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART Clock Rate: 1GHz Non-Volatile Memory: ROM (96 kB) On-Chip RAM: 6.375MB Voltage - I/O: 1.0V, 1.5V, 2.5V Voltage - Core: 1.00V Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	Package: 783-BBGA, FCBGA	Stock5,280
PCK940LBD,151	NXP	IC CLK BUFFER 1:18 250MHZ 32LQFP Type: Fanout Buffer (Distribution), Multiplexer Number of Circuits: 1 Ratio - Input:Output: 1:18 Differential - Input:Output: Yes/Yes Input: LVCMOS, LVPECL Output: LVCMOS Frequency - Max: 250MHz Voltage - Supply: 2.375 V ~ 3.465 V Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	Package: 32-LQFP	Stock5,168
MC34932SEKR2	NXP	H-BRIDGE DUAL BRUSHED DC & STE Motor Type - Stepper: - Motor Type - AC, DC: - Function: - Output Configuration: - Interface: - Technology: - Step Resolution: - Applications: - Current - Output: - Voltage - Supply: - Voltage - Load: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock7,680
MIMXRT117TCVM8A	NXP	IC MCU 32BIT EXT MEM 289LFBGA Core Processor: ARM® Cortex®-M4, Cortex®-M7 Core Size: 32-Bit Dual-Core Speed: 400MHz, 800MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT Number of I/O: 13 Program Memory Size: - Program Memory Type: External Program Memory EEPROM Size: - RAM Size: 2M x 8 Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V Data Converters: A/D 20x12b SAR; D/A 1x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 289-LFBGA Supplier Device Package: 289-LFBGA (14x14)	Package: -	Request a Quote
S912ZVLA96ACLC	NXP	S12Z CPU, 96K FLASH Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 19 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Data Converters: A/D 6x10b, 6x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	Package: -	Request a Quote
MVR5510AMBANES	NXP	SAFETY POWER MANAGEMENT IC, QFN5 Applications: - Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Package: -	Request a Quote