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NXP |
IC MODULATOR AUD/VID U/V 20-QFN
- Type: NTSC/PAL Modulator
- Applications: Audio/Video, VCR's, Set-Top Boxes
- Mounting Type: Surface Mount
- Package / Case: 20-VQFN Exposed Pad
- Supplier Device Package: 20-QFN-EP (5x5)
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Package: 20-VQFN Exposed Pad |
Stock8,316 |
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NXP |
IC REG LINEAR 3.1V 300MA 4HXSON
- Output Configuration: Positive
- Output Type: Fixed
- Number of Regulators: 1
- Voltage - Input (Max): 5.5V
- Voltage - Output (Min/Fixed): 3.1V
- Voltage - Output (Max): -
- Voltage Dropout (Max): 0.24V @ 300mA (Typ)
- Current - Output: 300mA
- Current - Quiescent (Iq): -
- Current - Supply (Max): 75µA
- PSRR: 75dB (1kHz)
- Control Features: Enable
- Protection Features: Over Current, Over Temperature, Soft Start
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 4-XDFN Exposed Pad
- Supplier Device Package: 4-HXSON (1x1)
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Package: 4-XDFN Exposed Pad |
Stock5,552 |
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NXP |
IC HEX SCHMITT-TRIG INV 14DIP
- Logic Type: Inverter
- Number of Circuits: 6
- Number of Inputs: 6
- Features: Schmitt Trigger
- Voltage - Supply: 2 V ~ 6 V
- Current - Quiescent (Max): 2µA
- Current - Output High, Low: 5.2mA, 7.8mA
- Logic Level - Low: 0.3 V ~ 1.2 V
- Logic Level - High: 1.5 V ~ 4.2 V
- Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Through Hole
- Supplier Device Package: 14-DIP
- Package / Case: 14-DIP (0.300", 7.62mm)
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Package: 14-DIP (0.300", 7.62mm) |
Stock2,768 |
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NXP |
IC BUFF DVR TRI-ST 16BIT 48TSSOP
- Logic Type: Buffer, Non-Inverting
- Number of Elements: 4
- Number of Bits per Element: 4
- Input Type: -
- Output Type: Push-Pull
- Current - Output High, Low: 12mA, 12mA
- Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-TFSOP (0.240", 6.10mm Width)
- Supplier Device Package: 48-TSSOP
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Package: 48-TFSOP (0.240", 6.10mm Width) |
Stock2,100 |
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NXP |
IC AMP AUDIO PWR 69W QUAD 37SIL
- Type: Class AB
- Output Type: 4-Channel (Quad)
- Max Output Power x Channels @ Load: 69W x 4 @ 2 Ohm
- Voltage - Supply: 8 V ~ 18 V
- Features: I2C, Mute, Short-Circuit and Thermal Protection, Standby
- Mounting Type: Through Hole
- Operating Temperature: -40°C ~ 85°C (TA)
- Supplier Device Package: 37-DBS
- Package / Case: 37-SIP Formed Leads
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Package: 37-SIP Formed Leads |
Stock4,064 |
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NXP |
IC AMP AUDIO 1.3W STER D 16WLCSP
- Type: Class D
- Output Type: 2-Channel (Stereo)
- Max Output Power x Channels @ Load: 1.3W x 2 @ 8 Ohm
- Voltage - Supply: 2.5 V ~ 5.5 V
- Features: Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Supplier Device Package: 16-WLCSP (2.06x2.11)
- Package / Case: 16-UFBGA, WLCSP
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Package: 16-UFBGA, WLCSP |
Stock4,128 |
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NXP |
IC HDMI INTERFACE 144HLQFP
- Applications: HDTV
- Interface: HDMI
- Voltage - Supply: 1.8V, 3.3V
- Package / Case: 144-LQFP Exposed Pad
- Supplier Device Package: 144-HLQFP (20x20)
- Mounting Type: Surface Mount
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Package: 144-LQFP Exposed Pad |
Stock6,352 |
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NXP |
IC REDRIVER I2C 1CH 400KHZ 8SO
- Type: Buffer, ReDriver
- Applications: I2C
- Input: 2-Wire Bus
- Output: 2-Wire Bus
- Data Rate (Max): 400kHz
- Number of Channels: 1
- Delay Time: -
- Signal Conditioning: -
- Capacitance - Input: 2pF
- Voltage - Supply: 3 V ~ 5.5 V
- Current - Supply: 3mA
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: -
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SO
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock4,544 |
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NXP |
IC LIN INTERFACE W/WAKE 14SOIC
- Type: Transceiver
- Protocol: LIN
- Number of Drivers/Receivers: 2/2
- Duplex: -
- Receiver Hysteresis: -
- Data Rate: -
- Voltage - Supply: 7 V ~ 18 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 14-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 14-SOIC
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Package: 14-SOIC (0.154", 3.90mm Width) |
Stock4,880 |
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NXP |
IC UART 64BYTE 24TSSOP
- Protocol: RS232, RS485
- Function: Controller
- Interface: I2C, SPI, UART
- Standards: -
- Voltage - Supply: 2.5V, 3.3V
- Current - Supply: 6mA
- Operating Temperature: -40°C ~ 95°C
- Package / Case: 24-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 24-TSSOP
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Package: 24-TSSOP (0.173", 4.40mm Width) |
Stock21,066 |
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NXP |
IC MUX/DEMUX 3X8 16SOIC
- Switch Circuit: -
- Multiplexer/Demultiplexer Circuit: 8:2
- Number of Circuits: 1
- On-State Resistance (Max): 360 Ohm
- Channel-to-Channel Matching (ΔRon): 10 Ohm
- Voltage - Supply, Single (V+): 5 V ~ 15 V
- Voltage - Supply, Dual (V±): ±15V
- Switch Time (Ton, Toff) (Max): -
- -3db Bandwidth: -
- Charge Injection: -
- Channel Capacitance (CS(off), CD(off)): 7.5pF
- Current - Leakage (IS(off)) (Max): 200nA
- Crosstalk: -
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 16-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 16-SO
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Package: 16-SOIC (0.154", 3.90mm Width) |
Stock2,464 |
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NXP |
IC MPU MPC85XX 800MHZ 783FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: Signal Processing; SPE, Security; SEC
- RAM Controllers: DDR, DDR2, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: -
- USB: -
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 783-BBGA, FCBGA |
Stock5,136 |
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NXP |
IC MPU MPC83XX 667MHZ 740TBGA
- Core Processor: PowerPC e300
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 667MHz
- Co-Processors/DSP: Communications; QUICC Engine
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (1)
- SATA: -
- USB: USB 1.x (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 740-LBGA
- Supplier Device Package: 740-TBGA (37.5x37.5)
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Package: 740-LBGA |
Stock5,936 |
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NXP |
IC MPU MPC85XX 1.067GHZ 783BGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.067GHz
- Co-Processors/DSP: Signal Processing; SPE
- RAM Controllers: DDR, DDR2, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: -
- USB: -
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 783-BBGA, FCBGA |
Stock6,592 |
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NXP |
IC MCU 8BIT 4KB FLASH 8QFN
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: -
- Peripherals: LVD, POR, PWM
- Number of I/O: 5
- Program Memory Size: 4KB (4K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 6x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 8-VDFN Exposed Pad
- Supplier Device Package: 8-DFN-EP (4x4)
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Package: 8-VDFN Exposed Pad |
Stock6,336 |
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NXP |
IC MCU 8BIT 32KB FLASH 32LQFP
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: SCI, SPI
- Peripherals: LVD, POR, PWM
- Number of I/O: 21
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 1.5K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 24x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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Package: 32-LQFP |
Stock5,824 |
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NXP |
IC MCU 32BIT ROMLESS 132QFP
- Core Processor: CPU32
- Core Size: 32-Bit
- Speed: 16MHz
- Connectivity: EBI/EMI, SCI, SPI, UART/USART
- Peripherals: POR, PWM, WDT
- Number of I/O: 18
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: -
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 132-BQFP Bumpered
- Supplier Device Package: 132-PQFP (24.13x24.13)
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Package: 132-BQFP Bumpered |
Stock3,024 |
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NXP |
IC MCU 8BIT 32KB FLASH 48LQFP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 20MHz
- Connectivity: I2C, LIN, SPI, UART/USART
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 41
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 256 x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 12x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP |
Stock4,512 |
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NXP |
IC MCU 32BIT 128KB FLASH 100LQFP
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 72MHz
- Connectivity: CAN, I2C, IrDA, SPI, UART/USART, USB, USB OTG
- Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
- Number of I/O: 66
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 34x16b, D/A 1x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
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Package: 100-LQFP |
Stock15,036 |
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NXP |
IC MCU 32BIT 128KB FLASH 80LQFP
- Core Processor: ARM? Cortex?-M0+
- Core Size: 32-Bit
- Speed: 48MHz
- Connectivity: I2C, LIN, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
- Number of I/O: 70
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 16K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 16x16b, D/A 1x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 80-LQFP
- Supplier Device Package: 80-LQFP (12x12)
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Package: 80-LQFP |
Stock7,968 |
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NXP |
DSP 16BIT QUAD 500MHZ 431FCBGA
- Type: SC140 Core
- Interface: DSI, Ethernet, RS-232
- Clock Rate: 500MHz
- Non-Volatile Memory: External
- On-Chip RAM: 1.436MB
- Voltage - I/O: 3.30V
- Voltage - Core: 1.20V
- Operating Temperature: 0°C ~ 90°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 431-BFBGA, FCBGA
- Supplier Device Package: 431-FCPBGA (20x20)
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Package: 431-BFBGA, FCBGA |
Stock2,656 |
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NXP |
IC PWR AMP RF 26V 20W TO272-16GW
- Frequency: 1.6GHz ~ 2.4GHz
- P1dB: -
- Gain: 29dB
- Noise Figure: -
- RF Type: Cellular, GSM, EDGE, CDMA
- Voltage - Supply: 26V
- Current - Supply: 80mA
- Test Frequency: -
- Package / Case: TO-272-16 Variant, Gull Wing
- Supplier Device Package: TO-272 WB-16 GULL
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Package: TO-272-16 Variant, Gull Wing |
Stock2,214 |
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NXP |
16-BIT MCU S12X CORE 512KB FLA
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 50MHz
- Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 59
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
- Data Converters: A/D 8x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 80-QFP
- Supplier Device Package: 80-QFP (14x14)
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Package: 80-QFP |
Stock7,088 |
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NXP |
MAGNIV 16-BIT MCU S12Z CORE 12
- Core Processor: S12Z
- Core Size: 16-Bit
- Speed: 32MHz
- Connectivity: CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 34
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 512 x 8
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V
- Data Converters: A/D 10x10b, D/A 1x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP |
Stock3,712 |
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NXP |
IC TRANSCEIVER FULL 1/1 14HVSON
- Type: Transceiver
- Protocol: LIN
- Number of Drivers/Receivers: 1/1
- Duplex: Full
- Receiver Hysteresis: -
- Data Rate: 20kBd
- Voltage - Supply: 5V ~ 28V
- Operating Temperature: -40°C ~ 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 14-VDFN Exposed Pad
- Supplier Device Package: 14-HVSON (3x4.5)
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Package: 14-VDFN Exposed Pad |
Stock4,752 |
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NXP |
IC MCU 16BIT 64KB FLASH 48QFN
- Core Processor: CPU12V1
- Core Size: 16-Bit
- Speed: 32MHz
- Connectivity: CANbus, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 34
- Program Memory Size: 64KB (64K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
- Data Converters: A/D 10x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-TFQFN Exposed Pad
- Supplier Device Package: 48-QFN-EP (7x7)
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Package: - |
Request a Quote |
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NXP |
15W, MULTI-COIL AUTO, MULTI-DEVI
- Applications: Controller, Wireless Power Transmitter
- Current - Supply: 300µA
- Voltage - Supply: 2.7V ~ 3.6V
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
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Package: - |
Request a Quote |
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NXP |
RF MOSFET LDMOS 48V OM780G-4
- Transistor Type: LDMOS
- Frequency: 720MHz ~ 960MHz
- Gain: 19.7dB
- Voltage - Test: 48 V
- Current Rating: 10µA
- Noise Figure: -
- Current - Test: 400 mA
- Power - Output: 53dBm
- Voltage - Rated: 105 V
- Package / Case: OM-780G-4L
- Supplier Device Package: OM-780G-4L
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Package: - |
Request a Quote |
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