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NXP |
MOSFET N-CH 30V 98A LFPAK
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 30V
- Current - Continuous Drain (Id) @ 25°C: 98A (Tc)
- Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
- Vgs(th) (Max) @ Id: 2V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs: 33nC @ 5V
- Input Capacitance (Ciss) (Max) @ Vds: 3190pF @ 10V
- Vgs (Max): ±20V
- FET Feature: -
- Power Dissipation (Max): 62.5W (Tc)
- Rds On (Max) @ Id, Vgs: 3.8 mOhm @ 25A, 10V
- Operating Temperature: -55°C ~ 150°C (TJ)
- Mounting Type: Surface Mount
- Supplier Device Package: LFPAK56, Power-SO8
- Package / Case: SC-100, SOT-669
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Package: SC-100, SOT-669 |
Stock6,784 |
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NXP |
TRANS NPN 300V 0.1A SOT54
- Transistor Type: NPN
- Current - Collector (Ic) (Max): 100mA
- Voltage - Collector Emitter Breakdown (Max): 300V
- Vce Saturation (Max) @ Ib, Ic: 500mV @ 2mA, 20mA
- Current - Collector Cutoff (Max): 100nA (ICBO)
- DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 30mA, 10V
- Power - Max: 500mW
- Frequency - Transition: 50MHz
- Operating Temperature: 150°C (TJ)
- Mounting Type: Through Hole
- Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
- Supplier Device Package: TO-92-3
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Package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) |
Stock2,800 |
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NXP |
MOSFET N-CH 50V 20SOIC
- Switch Type: General Purpose
- Number of Outputs: 4
- Ratio - Input:Output: 1:1
- Output Configuration: Low Side
- Output Type: N-Channel
- Interface: On/Off
- Voltage - Load: 50V (Max)
- Voltage - Supply (Vcc/Vdd): Not Required
- Current - Output (Max): 2.7A
- Rds On (Typ): 150 mOhm
- Input Type: Non-Inverting
- Features: -
- Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage
- Operating Temperature: 150°C (TJ)
- Package / Case: 20-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 20-SO
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Package: 20-SOIC (0.295", 7.50mm Width) |
Stock7,424 |
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NXP |
IC DUAL RETRIG MULTVIB 16DHVQFN
- Logic Type: Monostable
- Independent Circuits: 2
- Schmitt Trigger Input: No
- Propagation Delay: 22ns
- Current - Output High, Low: 4mA, 4mA
- Voltage - Supply: 4.5 V ~ 5.5 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 16-VFQFN Exposed Pad
- Supplier Device Package: 16-DHVQFN (2.5x3.5)
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Package: 16-VFQFN Exposed Pad |
Stock2,608 |
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NXP |
IC GATE NAND 2CH 4-INP 14-DIP
- Logic Type: NAND Gate
- Number of Circuits: 2
- Number of Inputs: 4
- Features: -
- Voltage - Supply: 4.5 V ~ 5.5 V
- Current - Quiescent (Max): 2µA
- Current - Output High, Low: 4mA, 4mA
- Logic Level - Low: 0.8V
- Logic Level - High: 2V
- Max Propagation Delay @ V, Max CL: 28ns @ 4.5V, 50pF
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Through Hole
- Supplier Device Package: 14-DIP
- Package / Case: 14-DIP (0.300", 7.62mm)
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Package: 14-DIP (0.300", 7.62mm) |
Stock2,176 |
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NXP |
IC CAN TXRX HI-SPEED 8-SOIC
- Type: Transceiver
- Protocol: CAN
- Number of Drivers/Receivers: 1/1
- Duplex: Half
- Receiver Hysteresis: 70mV
- Data Rate: -
- Voltage - Supply: 4.75 V ~ 5.25 V
- Operating Temperature: -40°C ~ 150°C
- Mounting Type: Surface Mount
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SO
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock6,928 |
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NXP |
IC MPU MPC85XX 1.5GHZ 1023FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 1.5GHz
- Co-Processors/DSP: Signal Processing; SPE, Security; SEC
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (4)
- SATA: -
- USB: -
- Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 1023-BFBGA, FCBGA
- Supplier Device Package: 1023-FCPBGA (33x33)
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Package: 1023-BFBGA, FCBGA |
Stock5,936 |
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NXP |
IC MPU MPC83XX 667MHZ 740TBGA
- Core Processor: PowerPC e300
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 667MHz
- Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (1)
- SATA: -
- USB: USB 1.x (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 740-LBGA
- Supplier Device Package: 740-TBGA (37.5x37.5)
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Package: 740-LBGA |
Stock7,456 |
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NXP |
IC MPU MPC82XX 266MHZ 516BGA
- Core Processor: PowerPC G2_LE
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 266MHz
- Co-Processors/DSP: Communications; RISC CPM, Security; SEC
- RAM Controllers: DRAM, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100 Mbps (2)
- SATA: -
- USB: USB 2.0 (1)
- Voltage - I/O: 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 516-BBGA
- Supplier Device Package: 516-FPBGA (27x27)
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Package: 516-BBGA |
Stock7,044 |
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NXP |
IC MCU 16BIT 128KB FLASH 64LQFP
- Core Processor: S12Z
- Core Size: 16-Bit
- Speed: 50MHz
- Connectivity: CAN, LIN, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 42
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 512 x 8
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Data Converters: A/D 9x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP Exposed Pad
- Supplier Device Package: 64-LQFP EP (10x10)
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Package: 64-LQFP Exposed Pad |
Stock4,032 |
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NXP |
IC MCU 8BIT 8KB FLASH 20SOIC
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: -
- Peripherals: LVR, POR, PWM
- Number of I/O: 18
- Program Memory Size: 8KB (8K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128 x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Data Converters: A/D 7x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 20-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 20-SOIC
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Package: 20-SOIC (0.295", 7.50mm Width) |
Stock5,856 |
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NXP |
IC MCU 32BIT 2MB FLASH 416BGA
- Core Processor: e200z6
- Core Size: 32-Bit
- Speed: 132MHz
- Connectivity: CAN, EBI/EMI, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 256
- Program Memory Size: 2MB (2M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V
- Data Converters: A/D 40x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 416-BBGA
- Supplier Device Package: 416-PBGA (27x27)
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Package: 416-BBGA |
Stock5,696 |
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NXP |
IC MCU 16BIT 512KB FLASH 144LQFP
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 50MHz
- Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 119
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
- Data Converters: A/D 24x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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Package: 144-LQFP |
Stock6,656 |
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NXP |
IC MCU 16BIT 64KB FLASH 80QFP
- Core Processor: HCS12
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: EBI/EMI, SCI, SPI
- Peripherals: POR, PWM, WDT
- Number of I/O: 60
- Program Memory Size: 64KB (64K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 80-QFP
- Supplier Device Package: 80-QFP (14x14)
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Package: 80-QFP |
Stock4,832 |
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NXP |
ENCRYPTION PACSUN R2.1 783FCBGA
- Type: SC3400 Core
- Interface: Ethernet, I2C, SPI, TDM, UART, UTOPIA
- Clock Rate: 800MHz
- Non-Volatile Memory: External
- On-Chip RAM: 10.5MB
- Voltage - I/O: 3.30V
- Voltage - Core: 1.00V
- Operating Temperature: -40°C ~ 105°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 783-BBGA, FCBGA |
Stock2,096 |
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NXP |
ADC 10BIT 125MSPS 40HVQFN
- Number of Bits: 10
- Sampling Rate (Per Second): 125M
- Number of Inputs: 1
- Input Type: Differential, Single Ended
- Data Interface: LVDS - Parallel, Parallel
- Configuration: S/H-ADC
- Ratio - S/H:ADC: 1:1
- Number of A/D Converters: 1
- Architecture: Pipelined
- Reference Type: External, Internal
- Voltage - Supply, Analog: 2.85 V ~ 3.4 V, 5V
- Voltage - Supply, Digital: 1.65 V ~ 3.6 V
- Features: -
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 40-VFQFN Exposed Pad
- Supplier Device Package: 40-HVQFN (6x6)
- Mounting Type: -
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Package: 40-VFQFN Exposed Pad |
Stock7,600 |
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NXP |
IC BAROMETER I2C DGTL MINI 8-LGA
- Pressure Type: Absolute
- Operating Pressure: 7.25 PSI ~ 16.68 PSI (50 kPa ~ 115 kPa)
- Output Type: I2C
- Output: 10 b
- Accuracy: ±0.145 PSI (±1 kPa)
- Voltage - Supply: 2.375 V ~ 5.5 V
- Port Size: -
- Port Style: No Port
- Features: Shutdown Mode, Standby Mode
- Termination Style: PCB
- Maximum Pressure: 145.04 PSI (1000 kPa)
- Operating Temperature: -40°C ~ 105°C
- Package / Case: 8-TLGA
- Supplier Device Package: 8-LGA
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Package: 8-TLGA |
Stock101,676 |
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NXP |
IC PWR AMP RF LDMOS TO270-14
- Frequency: 1.805GHz ~ 2.05GHz
- P1dB: 51.93dBm (155.955W)
- Gain: 30dB
- Noise Figure: -
- RF Type: GSM, EDGE
- Voltage - Supply: 24 V ~ 32 V
- Current - Supply: 1.18A
- Test Frequency: 1.9GHz
- Package / Case: TO-270-14 Variant, Flat Leads
- Supplier Device Package: TO-270 WB-14
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Package: TO-270-14 Variant, Flat Leads |
Stock5,454 |
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NXP |
SYSTEM BASIS CHIP DCDC 1.5A VCO
- Applications: System Basis Chip
- Current - Supply: -
- Voltage - Supply: -1.0 V ~ 40 V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP Exposed Pad |
Stock5,552 |
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NXP |
KINETIS E 32-BIT MCU ARM CORTEX
- Core Processor: ARM® Cortex®-M0+
- Core Size: 32-Bit
- Speed: 48MHz
- Connectivity: I²C, LINbus, SPI, UART/USART
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 22
- Program Memory Size: 8KB (8K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 12x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 24-VFQFN Exposed Pad
- Supplier Device Package: 24-QFN (4x4)
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Package: 24-VFQFN Exposed Pad |
Stock4,576 |
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NXP |
IC MEDIA PROCESSOR
- Applications: Multimedia
- Core Processor: TriMedia™
- Program Memory Type: -
- Controller Series: Nexperia
- RAM Size: -
- Interface: GPIO, Host Interface, I²C, PCI, USB, XIO
- Number of I/O: 8
- Voltage - Supply: 1.16V ~ 1.24V, 3.15V ~ 3.6V
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 456-BGA
- Supplier Device Package: 456-PBGA (27x27)
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Package: 456-BGA |
Stock5,904 |
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NXP |
IC MCU 32BIT 256KB FLASH 59BGA
- Core Processor: ARM® Cortex®-M33
- Core Size: 32-Bit Single-Core
- Speed: 150MHz
- Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
- Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
- Number of I/O: 37
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 96K x 8
- Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
- Data Converters: A/D 10x16b SAR
- Oscillator Type: External, Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 59-VFBGA
- Supplier Device Package: 59-VFBGA (4x4)
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Package: - |
Request a Quote |
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NXP |
MPU I.MX8 QUAD PLUS
- Core Processor: -
- Number of Cores/Bus Width: -
- Speed: -
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: -
- Operating Temperature: -
- Security Features: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
POWER MANAGEMENT IC, I.MX 8DX/8D
- Applications: i.MX Processors
- Current - Supply: 10µA
- Voltage - Supply: 2.5V ~ 5.5V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount, Wettable Flank
- Package / Case: 48-VFQFN Exposed Pad
- Supplier Device Package: 48-HVQFN (7x7)
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Package: - |
Request a Quote |
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NXP |
IC
- Applications: System Basis Chip
- Current - Supply: 40µA
- Voltage - Supply: 5.5V ~ 40V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount, Wettable Flank
- Package / Case: 48-VFQFN Exposed Pad
- Supplier Device Package: 48-HVQFN (7x7)
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Package: - |
Request a Quote |
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NXP |
IC
- Type: -
- Interface: -
- Clock Rate: -
- Non-Volatile Memory: -
- On-Chip RAM: -
- Voltage - I/O: -
- Voltage - Core: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
IC
- Architecture: MPU
- Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4
- Flash Size: -
- RAM Size: 288KB
- Peripherals: DMA, PWM, WDT
- Connectivity: AC'97, I2C, I2S, MMC/SD, PCIe, SAI, SDHC, SPDIF, SPI, TDM, UART
- Speed: 1.8GHz, 400MHz
- Primary Attributes: -
- Operating Temperature: 0°C ~ 95°C (TJ)
- Package / Case: 486-LFBGA, FCBGA
- Supplier Device Package: 486-LFBGA (14x14)
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Package: - |
Request a Quote |
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NXP |
POWER MANAGEMENT IC I.MX8 PRE-PR
- Applications: High Performance i.MX 8, S32x Processor Based
- Current - Supply: -
- Voltage - Supply: 2.5V ~ 5.5V
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount, Wettable Flank
- Package / Case: 56-VFQFN Exposed Pad
- Supplier Device Package: 56-HVQFN (8x8)
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Package: - |
Request a Quote |
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