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NXP |
MOSFET N-CH 200V 50A SOT429
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 200V
- Current - Continuous Drain (Id) @ 25°C: 50A (Tc)
- Drive Voltage (Max Rds On, Min Rds On): 10V
- Vgs(th) (Max) @ Id: 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs: 183nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds: 9530pF @ 25V
- Vgs (Max): ±20V
- FET Feature: -
- Power Dissipation (Max): 300W (Tc)
- Rds On (Max) @ Id, Vgs: 40 mOhm @ 25A, 10V
- Operating Temperature: -55°C ~ 175°C (TJ)
- Mounting Type: Through Hole
- Supplier Device Package: TO-247-3
- Package / Case: TO-247-3
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Package: TO-247-3 |
Stock3,248 |
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NXP |
TRANS PREBIAS PNP 500MW TO92-3
- Transistor Type: PNP - Pre-Biased
- Current - Collector (Ic) (Max): 500mA
- Voltage - Collector Emitter Breakdown (Max): 50V
- Resistor - Base (R1) (Ohms): 2.2k
- Resistor - Emitter Base (R2) (Ohms): 2.2k
- DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 50mA, 5V
- Vce Saturation (Max) @ Ib, Ic: 300mV @ 2.5mA, 50mA
- Current - Collector Cutoff (Max): 500nA
- Frequency - Transition: -
- Power - Max: 500mW
- Mounting Type: Through Hole
- Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
- Supplier Device Package: TO-92-3
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Package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) |
Stock7,472 |
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NXP |
IC RESONANT CONVRTR CTRLR 16SOIC
- Applications: Resonant Converter Controller
- Voltage - Input: 600V
- Voltage - Supply: 0 V ~ 15 V
- Current - Supply: 2.4mA
- Operating Temperature: -25°C ~ 70°C
- Mounting Type: Surface Mount
- Package / Case: 16-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 16-SO
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Package: 16-SOIC (0.154", 3.90mm Width) |
Stock3,632 |
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NXP |
IC LED DRIVER AUTO 14HVSON
- Type: -
- Topology: -
- Internal Switch(s): -
- Number of Outputs: -
- Voltage - Supply (Min): -
- Voltage - Supply (Max): -
- Voltage - Output: -
- Current - Output / Channel: -
- Frequency: -
- Dimming: -
- Applications: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock6,448 |
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NXP |
IC 4BIT BINARY FULL ADDER 16SSOP
- Logic Type: Binary Full Adder with Fast Carry
- Supply Voltage: 2 V ~ 6 V
- Number of Bits: 4
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 16-SSOP (0.209", 5.30mm Width)
- Supplier Device Package: 16-SSOP
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Package: 16-SSOP (0.209", 5.30mm Width) |
Stock5,488 |
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NXP |
IC ADDRESSABLE LATCH 8BIT 16SOIC
- Logic Type: D-Type, Addressable
- Circuit: 1 x 3:8
- Output Type: Standard
- Voltage - Supply: 4.5 V ~ 5.5 V
- Independent Circuits: 1
- Delay Time - Propagation: 10ns
- Current - Output High, Low: 8mA, 8mA
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 16-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 16-SO
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Package: 16-SOIC (0.154", 3.90mm Width) |
Stock7,888 |
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NXP |
IC GATE NAND 3CH 3-INP 14-SSOP
- Logic Type: NAND Gate
- Number of Circuits: 3
- Number of Inputs: 3
- Features: -
- Voltage - Supply: 2.7 V ~ 3.6 V
- Current - Quiescent (Max): -
- Current - Output High, Low: 20mA, 32mA
- Logic Level - Low: 0.8V
- Logic Level - High: 2V
- Max Propagation Delay @ V, Max CL: 3.8ns @ 3.3V, 50pF
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Supplier Device Package: 14-SSOP
- Package / Case: 14-SSOP (0.209", 5.30mm Width)
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Package: 14-SSOP (0.209", 5.30mm Width) |
Stock5,760 |
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NXP |
IC SMOKE DETECT PHOTOELEC 16SOIC
- Type: Smoke Detector
- Input Type: Photoelectric
- Output Type: Voltage
- Interface: -
- Current - Supply: 8µA
- Operating Temperature: -10°C ~ 60°C
- Mounting Type: Surface Mount
- Package / Case: 16-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 16-SOIC
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Package: 16-SOIC (0.295", 7.50mm Width) |
Stock2,100 |
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NXP |
IC I/O EXPANDER I2C 8B 16SSOP
- Number of I/O: 8
- Interface: I2C, SMBus
- Interrupt Output: Yes
- Features: POR
- Output Type: Push-Pull
- Current - Output Source/Sink: 10mA, 25mA
- Clock Frequency: 400kHz
- Voltage - Supply: 2.3 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 16-SSOP (0.209", 5.30mm Width)
- Supplier Device Package: 16-SSOP
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Package: 16-SSOP (0.209", 5.30mm Width) |
Stock56,664 |
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NXP |
IC ANALOG SWITCH SPDT 16HXQFN
- Switch Circuit: SPDT
- Multiplexer/Demultiplexer Circuit: 2:1
- Number of Circuits: 3
- On-State Resistance (Max): 800 mOhm
- Channel-to-Channel Matching (ΔRon): 120 mOhm
- Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V
- Voltage - Supply, Dual (V±): -
- Switch Time (Ton, Toff) (Max): 40ns, 20ns
- -3db Bandwidth: 60MHz
- Charge Injection: 15pC
- Channel Capacitance (CS(off), CD(off)): 35pF
- Current - Leakage (IS(off)) (Max): 10nA
- Crosstalk: -90dB @ 100kHz
- Operating Temperature: -40°C ~ 125°C (TA)
- Package / Case: 16-XFQFN Exposed Pad
- Supplier Device Package: 16-HXQFN (3x3)
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Package: 16-XFQFN Exposed Pad |
Stock4,944 |
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NXP |
IC MPU MPC85XX 800MHZ 783FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: Signal Processing; SPE
- RAM Controllers: DDR, DDR2, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (4)
- SATA: -
- USB: -
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 783-BBGA, FCBGA |
Stock2,320 |
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NXP |
IC MPU MPC83XX 400MHZ 740TBGA
- Core Processor: PowerPC e300
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 400MHz
- Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (1)
- SATA: -
- USB: USB 1.x (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 740-LBGA
- Supplier Device Package: 740-TBGA (37.5x37.5)
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Package: 740-LBGA |
Stock2,736 |
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NXP |
IC MPU MPC8XX 133MHZ 357BGA
- Core Processor: MPC8xx
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 133MHz
- Co-Processors/DSP: Communications; CPM, Security; SEC
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (3), 10/100 Mbps (2)
- SATA: -
- USB: USB 2.0 (1)
- Voltage - I/O: 3.3V
- Operating Temperature: -40°C ~ 100°C (TA)
- Security Features: Cryptography
- Package / Case: 357-BBGA
- Supplier Device Package: 357-PBGA (25x25)
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Package: 357-BBGA |
Stock4,256 |
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NXP |
IC MCU 8BIT 16KB FLASH 32LQFP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: CAN, I2C, LIN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 25
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 10x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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Package: 32-LQFP |
Stock6,592 |
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NXP |
IC MCU 8BIT 32KB FLASH 44PLCC
- Core Processor: 8051
- Core Size: 8-Bit
- Speed: 33MHz
- Connectivity: UART/USART
- Peripherals: POR, PWM, WDT
- Number of I/O: 32
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512 x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 44-LCC (J-Lead)
- Supplier Device Package: 44-PLCC (16.59x16.59)
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Package: 44-LCC (J-Lead) |
Stock4,800 |
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NXP |
IC MCU 32BIT 16KB FLASH 24QFN
- Core Processor: ARM? Cortex?-M0+
- Core Size: 32-Bit
- Speed: 48MHz
- Connectivity: I2C, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
- Number of I/O: 22
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 12x12b, D/A 1x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 24-VFQFN Exposed Pad
- Supplier Device Package: 24-QFN (4x4)
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Package: 24-VFQFN Exposed Pad |
Stock8,364 |
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NXP |
IC MCU 32BIT 1MB FLASH 100LQFP
- Core Processor: ARM? Cortex?-M7
- Core Size: 32-Bit
- Speed: 240MHz
- Connectivity: CAN, Ethernet, I2C, SPI, UART/USART
- Peripherals: DMA, LVD, POR, PWM, WDT
- Number of I/O: 74
- Program Memory Size: 1MB (1M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 256K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 4x12b, 1x16b, D/A 1x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
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Package: 100-LQFP |
Stock6,384 |
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NXP |
IC READER 13.56MHZ 32-HVQFN
- Type: RFID Reader
- Frequency: 13.56MHz
- Standards: ISO 14443, MIFARE
- Interface: I2C, SPI, UART
- Voltage - Supply: 2.5 V ~ 3.3 V
- Operating Temperature: -25°C ~ 85°C
- Package / Case: 32-VFQFN Exposed Pad
- Supplier Device Package: 32-HVQFN (5x5)
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Package: 32-VFQFN Exposed Pad |
Stock8,514 |
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NXP |
IC PWR AMP RF 960MHZ TO-270-14
- Frequency: 728MHz ~ 960MHz
- P1dB: 43dBm (20W)
- Gain: 36.2dB
- Noise Figure: -
- RF Type: W-CDMA
- Voltage - Supply: 24 V ~ 32 V
- Current - Supply: 222mA
- Test Frequency: 700MHz
- Package / Case: TO-270-14 Variant, Gull Wing
- Supplier Device Package: TO-270 WB-14 GULL
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Package: TO-270-14 Variant, Gull Wing |
Stock8,604 |
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NXP |
SYSTEM BASIS CHIP DCDC 2.2A VCO
- Applications: System Basis Chip
- Current - Supply: -
- Voltage - Supply: -1.0 V ~ 40 V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP Exposed Pad |
Stock3,360 |
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NXP |
QORIQ 4XCPU 64-BIT ARM ARCH 1.
- Core Processor: -
- Number of Cores/Bus Width: -
- Speed: -
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: -
- Operating Temperature: -
- Security Features: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock7,152 |
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NXP |
DUAL CORE 3M FLASH 384K RAM F
- Core Processor: e200z2, e200z4
- Core Size: 32-Bit Dual-Core
- Speed: 80MHz/160MHz
- Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
- Peripherals: DMA, LVD, POR, WDT
- Number of I/O: 129
- Program Memory Size: 3MB (3M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 80x10b, 64x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 176-LQFP Exposed Pad
- Supplier Device Package: 176-LQFP (24x24)
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Package: 176-LQFP Exposed Pad |
Stock4,208 |
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NXP |
DUAL CORE, 3M FLASH, 256
- Core Processor: e200z2, e200z4
- Core Size: 32-Bit Dual-Core
- Speed: 80MHz, 160MHz
- Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
- Peripherals: DMA, LVD, POR, WDT
- Number of I/O: -
- Program Memory Size: 3MB (3M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 80x10b, 64x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 100-LBGA
- Supplier Device Package: 100-MAPBGA (11x11)
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Package: 100-LBGA |
Stock6,784 |
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NXP |
8-BIT MCU S08 CORE 32KB FLASH
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 20MHz
- Connectivity: I²C, LINbus, SPI, UART/USART
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 26
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 256 x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 16x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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Package: 32-LQFP |
Stock3,072 |
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NXP |
IC MCU 32BIT 1.5MB FLASH 176LQFP
- Core Processor: e200z2, e200z4
- Core Size: 32-Bit Dual-Core
- Speed: 80MHz, 160MHz
- Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
- Peripherals: DMA, I2S, POR, WDT
- Number of I/O: 129
- Program Memory Size: 1.5MB (1.5M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 192K x 8
- Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
- Data Converters: A/D 36x10b, 16x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 176-LQFP Exposed Pad
- Supplier Device Package: 176-LQFP (24x24)
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Package: - |
Request a Quote |
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NXP |
SWITCH 1-2 PCIE GEN4 HUQFN16
- Applications: PCIe
- Multiplexer/Demultiplexer Circuit: 1:2
- Switch Circuit: SPDT
- Number of Channels: 2
- On-State Resistance (Max): 14Ohm
- Voltage - Supply, Single (V+): 1.62V ~ 3.63V
- Voltage - Supply, Dual (V±): -
- -3db Bandwidth: 17GHz
- Features: -
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 16-UFQFN Exposed Pad
- Supplier Device Package: 16-HUQFN (1.6x2.4)
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Package: - |
Stock144,750 |
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NXP |
IC FS86 SYSTEM BASIS CHIP ASIL
- Applications: Camera
- Current - Supply: -
- Voltage - Supply: 4.5V ~ 60V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-VFQFN Exposed Pad
- Supplier Device Package: 48-QFN (7x7)
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Package: - |
Request a Quote |
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NXP |
IC
- Type: -
- Circuit: -
- Independent Circuits: -
- Current - Output High, Low: -
- Voltage Supply Source: -
- Voltage - Supply: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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