|
|
NXP |
MOSFET N-CH 80V LFPAK
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 80V
- Current - Continuous Drain (Id) @ 25°C: -
- Drive Voltage (Max Rds On, Min Rds On): -
- Vgs(th) (Max) @ Id: -
- Gate Charge (Qg) (Max) @ Vgs: -
- Input Capacitance (Ciss) (Max) @ Vds: -
- Vgs (Max): -
- FET Feature: -
- Power Dissipation (Max): -
- Rds On (Max) @ Id, Vgs: -
- Operating Temperature: -
- Mounting Type: Surface Mount
- Supplier Device Package: LFPAK56, Power-SO8
- Package / Case: SC-100, SOT-669
|
Package: SC-100, SOT-669 |
Stock6,640 |
|
|
|
NXP |
MOSFET N-CH 25V 75A D2PAK
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 25V
- Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
- Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
- Vgs(th) (Max) @ Id: 2V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs: 26.7nC @ 5V
- Input Capacitance (Ciss) (Max) @ Vds: 2200pF @ 25V
- Vgs (Max): ±20V
- FET Feature: -
- Power Dissipation (Max): 115W (Tc)
- Rds On (Max) @ Id, Vgs: 4.95 mOhm @ 25A, 10V
- Operating Temperature: -55°C ~ 175°C (TJ)
- Mounting Type: Surface Mount
- Supplier Device Package: D2PAK
- Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
|
Package: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB |
Stock3,056 |
|
|
|
NXP |
IC AIR-CORE DRIVER 28-SOIC
- Applications: Automotive
- Current - Supply: 500µA
- Voltage - Supply: 8 V ~ 16 V
- Operating Temperature: -40°C ~ 105°C
- Mounting Type: Surface Mount
- Package / Case: 28-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 28-SO
|
Package: 28-SOIC (0.295", 7.50mm Width) |
Stock2,096 |
|
|
|
NXP |
IC TXRX TRANSLATING 2BIT 8XSON
- Translator Type: Voltage Level
- Channel Type: Bidirectional
- Number of Circuits: 1
- Channels per Circuit: 2
- Voltage - VCCA: 1.65V ~ 3.6V
- Voltage - VCCB: 2.3V ~ 5.5V
- Input Signal: -
- Output Signal: -
- Output Type: Open Drain, Tri-State
- Data Rate: 50Mbps
- Operating Temperature: -40°C ~ 125°C (TA)
- Features: Auto-Direction Sensing
- Mounting Type: Surface Mount
- Package / Case: 8-XFDFN
- Supplier Device Package: 8-XSON, SOT996-2 (2x3)
|
Package: 8-XFDFN |
Stock2,992 |
|
|
|
NXP |
IC MULTIVIBRATR DUAL MONO 16SOIC
- Logic Type: Monostable
- Independent Circuits: 2
- Schmitt Trigger Input: Yes
- Propagation Delay: 24ns
- Current - Output High, Low: 5.2mA, 5.2mA
- Voltage - Supply: 2 V ~ 6 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 16-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 16-SO
|
Package: 16-SOIC (0.154", 3.90mm Width) |
Stock4,576 |
|
|
|
NXP |
IC GATE NOR 4CH 2-INP 14-DIP
- Logic Type: NOR Gate
- Number of Circuits: 4
- Number of Inputs: 2
- Features: -
- Voltage - Supply: 2 V ~ 6 V
- Current - Quiescent (Max): 2µA
- Current - Output High, Low: 5.2mA, 5.2mA
- Logic Level - Low: 0.5 V ~ 1.8 V
- Logic Level - High: 1.5 V ~ 4.2 V
- Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Through Hole
- Supplier Device Package: 14-DIP
- Package / Case: 14-DIP (0.300", 7.62mm)
|
Package: 14-DIP (0.300", 7.62mm) |
Stock4,464 |
|
|
|
NXP |
IC D-TYPE POS TRG DUAL 56VFBGA
- Function: Standard
- Type: D-Type
- Output Type: Tri-State, Non-Inverted
- Number of Elements: 2
- Number of Bits per Element: 8
- Clock Frequency: 150MHz
- Max Propagation Delay @ V, Max CL: 5ns @ 3.3V, 50pF
- Trigger Type: Positive Edge
- Current - Output High, Low: 32mA, 64mA
- Voltage - Supply: 2.7 V ~ 3.6 V
- Current - Quiescent (Iq): 120µA
- Input Capacitance: 3pF
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 56-VFBGA
|
Package: 56-VFBGA |
Stock5,248 |
|
|
|
NXP |
IC D-TYPE POS TRG SNGL 16SOIC
- Function: Master Reset
- Type: D-Type
- Output Type: Non-Inverted
- Number of Elements: 1
- Number of Bits per Element: 6
- Clock Frequency: 100MHz
- Max Propagation Delay @ V, Max CL: 10ns @ 5V, 50pF
- Trigger Type: Positive Edge
- Current - Output High, Low: 1mA, 20mA
- Voltage - Supply: 4.5 V ~ 5.5 V
- Current - Quiescent (Iq): 45mA
- Input Capacitance: -
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 16-SOIC (0.154", 3.90mm Width)
|
Package: 16-SOIC (0.154", 3.90mm Width) |
Stock7,328 |
|
|
|
NXP |
IC 16BIT TXRX 3-ST 48SSOP
- Logic Type: Transceiver, Non-Inverting
- Number of Elements: 2
- Number of Bits per Element: 8
- Input Type: -
- Output Type: Push-Pull
- Current - Output High, Low: 24mA, 24mA
- Voltage - Supply: 1.2 V ~ 3.6 V
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-TFSOP (0.240", 6.10mm Width)
- Supplier Device Package: 48-TSSOP
|
Package: 48-TFSOP (0.240", 6.10mm Width) |
Stock5,696 |
|
|
|
NXP |
IC BUFF/DVR TRI-ST DUAL 20DIP
- Logic Type: Buffer, Non-Inverting
- Number of Elements: 2
- Number of Bits per Element: 4
- Input Type: -
- Output Type: Push-Pull
- Current - Output High, Low: 6mA, 6mA
- Voltage - Supply: 4.5 V ~ 5.5 V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Through Hole
- Package / Case: 20-DIP (0.300", 7.62mm)
- Supplier Device Package: 20-DIP
|
Package: 20-DIP (0.300", 7.62mm) |
Stock3,680 |
|
|
|
NXP |
IC SYSTEM BASIS CHIP GEN2 32SOIC
- Applications: System Basis Chip
- Interface: CAN, LIN
- Voltage - Supply: 5.5 V ~ 28 V
- Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Supplier Device Package: 32-SOIC EP
- Mounting Type: Surface Mount
|
Package: 32-SSOP (0.295", 7.50mm Width) Exposed Pad |
Stock6,496 |
|
|
|
NXP |
IC REDRIVER I2C 1CH 8HWSON
- Type: Buffer, ReDriver
- Applications: I2C
- Input: 2-Wire Bus
- Output: 2-Wire Bus
- Data Rate (Max): 400kHz
- Number of Channels: 2
- Delay Time: -
- Signal Conditioning: -
- Capacitance - Input: 6pF
- Voltage - Supply: 2.7 V ~ 5.5 V
- Current - Supply: 5mA
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: -
- Package / Case: 8-WFDFN Exposed Pad
- Supplier Device Package: 8-HWSON (2x3)
|
Package: 8-WFDFN Exposed Pad |
Stock32,850 |
|
|
|
NXP |
IC I2C/SMBUS 16BIT GPIO 28-TSSOP
- Number of I/O: 16
- Interface: I2C, SMBus
- Interrupt Output: Yes
- Features: POR
- Output Type: Push-Pull
- Current - Output Source/Sink: 1mA, 3mA
- Clock Frequency: 400kHz
- Voltage - Supply: 1.1 V ~ 3.6 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 28-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 28-TSSOP
|
Package: 28-TSSOP (0.173", 4.40mm Width) |
Stock232,728 |
|
|
|
NXP |
IC MPU MPC86XX 1.066GHZ 783BGA
- Core Processor: PowerPC e600
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.066GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: DIU, LCD
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
|
Package: 783-BBGA, FCBGA |
Stock3,072 |
|
|
|
NXP |
IC MCU 16BIT 128KB FLASH 112LQFP
- Core Processor: HCS12
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: CAN, I2C, SCI, SPI
- Peripherals: PWM, WDT
- Number of I/O: 91
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
- Data Converters: A/D 16x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 112-LQFP
- Supplier Device Package: 112-LQFP (20x20)
|
Package: 112-LQFP |
Stock28,476 |
|
|
|
NXP |
IC MCU 32BIT 3MB FLASH 256MAPBGA
- Core Processor: e200z2, e200z4
- Core Size: 32-Bit Dual-Core
- Speed: 80MHz/160MHz
- Connectivity: CAN, Ethernet, I2C, LIN, SAI, SPI, USB, USB OTG
- Peripherals: DMA, LVD, POR, WDT
- Number of I/O: 178
- Program Memory Size: 3MB (3M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 80x10b, 64x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 256-LBGA
- Supplier Device Package: 256-MAPPBGA (17x17)
|
Package: 256-LBGA |
Stock5,136 |
|
|
|
NXP |
IC MCU 16BIT 256KB FLASH 112LQFP
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 40MHz
- Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
- Peripherals: LCD, Motor control PWM, POR, PWM, WDT
- Number of I/O: 88
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 8K x 8
- RAM Size: 12K x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Data Converters: A/D 12x10b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 112-LQFP
- Supplier Device Package: 112-LQFP (20x20)
|
Package: 112-LQFP |
Stock5,760 |
|
|
|
NXP |
IC MCU 16BIT 128KB FLASH 144LQFP
- Core Processor: S12Z
- Core Size: 16-Bit
- Speed: 32MHz
- Connectivity: CAN, I2C, LIN, SCI, SPI
- Peripherals: DMA, LCD, POR, PWM, WDT
- Number of I/O: 100
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
|
Package: 144-LQFP |
Stock3,152 |
|
|
|
NXP |
IC MCU 16BIT 64KB FLASH 144LQFP
- Core Processor: S12Z
- Core Size: 16-Bit
- Speed: 32MHz
- Connectivity: CAN, I2C, LIN, SCI, SPI
- Peripherals: DMA, LCD, POR, PWM, WDT
- Number of I/O: 100
- Program Memory Size: 64KB (64K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
|
Package: 144-LQFP |
Stock4,992 |
|
|
|
NXP |
IC PRESSURE SENSOR 8-SOP
- Pressure Type: Compound
- Operating Pressure: ±3.63 PSI (±25 kPa)
- Output Type: Analog Voltage
- Output: 0.2 V ~ 4.7 V
- Accuracy: ±5%
- Voltage - Supply: 4.75 V ~ 5.25 V
- Port Size: -
- Port Style: No Port
- Features: Temperature Compensated
- Termination Style: PCB
- Maximum Pressure: ±29.01 PSI (±200 kPa)
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 8-SMD Module
- Supplier Device Package: -
|
Package: 8-SMD Module |
Stock6,444 |
|
|
|
NXP |
IC FRACTIONAL NPLL 14-SOIC
- Type: -
- Frequency: -
- Standards: -
- Interface: -
- Voltage - Supply: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
|
Package: - |
Stock3,186 |
|
|
|
NXP |
LOW POWER SMART CARD INTERFACE
- Applications: -
- Interface: Analog
- Voltage - Supply: 1.8V, 3V, 5V
- Package / Case: 24-VFQFN Exposed Pad
- Supplier Device Package: 24-HVQFN (4x4)
- Mounting Type: Surface Mount
|
Package: 24-VFQFN Exposed Pad |
Stock3,584 |
|
|
|
NXP |
IC MCU 32BIT 128KB FLASH 64HTQFP
- Core Processor: ARM® Cortex®-M33
- Core Size: 32-Bit Single-Core
- Speed: 96MHz
- Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
- Number of I/O: 45
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 80K x 8
- Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
- Data Converters: A/D 9x16b SAR
- Oscillator Type: External, Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 64-TQFP Exposed Pad
- Supplier Device Package: 64-HTQFP (10x10)
|
Package: - |
Request a Quote |
|
|
|
NXP |
IC MPU QORIQ LAYER 1GHZ 448FBGA
- Core Processor: ARM® Cortex®-A72
- Number of Cores/Bus Width: 1 Core, 64-Bit
- Speed: 1GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: 1Gbps (1), 2.5Gbps (5)
- SATA: SATA 6Gbps (1)
- USB: -
- Voltage - I/O: -
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 448-BFBGA
- Supplier Device Package: 448-FBGA (17x17)
|
Package: - |
Request a Quote |
|
|
|
NXP |
AUDIO AMP SPEAKER 1-CH CLASS-B 2
- Type: -
- Output Type: -
- Max Output Power x Channels @ Load: -
- Voltage - Supply: -
- Features: -
- Mounting Type: -
- Operating Temperature: -
- Supplier Device Package: -
- Package / Case: -
|
Package: - |
Request a Quote |
|
|
|
NXP |
IC HDMI RECEIVER 144HLQFP
- Applications: -
- Interface: -
- Voltage - Supply: -
- Package / Case: -
- Supplier Device Package: -
- Mounting Type: -
|
Package: - |
Request a Quote |
|
|
|
NXP |
IC MPU QORLQ LX2 2GHZ 1517FCPBGA
- Core Processor: ARM® Cortex®-A72
- Number of Cores/Bus Width: 8 Core, 64-Bit
- Speed: 2GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR4
- Graphics Acceleration: Yes
- Display & Interface Controllers: -
- Ethernet: 100Gbps (2)
- SATA: SATA 3.0 (4)
- USB: USB 3.0 (2) + PHY (2)
- Voltage - I/O: 1.2V, 1.8V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TJ)
- Security Features: Secure Boot, TrustZone®
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FCPBGA (40x40)
|
Package: - |
Request a Quote |
|
|
|
NXP |
IC MCU 32BIT 512KB FLASH 64LQFP
- Core Processor: ARM® Cortex®-M4F
- Core Size: 32-Bit Single-Core
- Speed: 112MHz
- Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
- Peripherals: POR, PWM, WDT
- Number of I/O: 58
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
- Data Converters: A/D 16x12b SAR; D/A1x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
|
Package: - |
Request a Quote |
|