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NXP |
MOSFET N-CH 55V 75A TO220AB
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 55V
- Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
- Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
- Vgs(th) (Max) @ Id: 2V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs: 45nC @ 5V
- Input Capacitance (Ciss) (Max) @ Vds: 3960pF @ 25V
- Vgs (Max): ±15V
- FET Feature: -
- Power Dissipation (Max): 200W (Tc)
- Rds On (Max) @ Id, Vgs: 7 mOhm @ 25A, 10V
- Operating Temperature: -55°C ~ 175°C (TJ)
- Mounting Type: Through Hole
- Supplier Device Package: TO-220AB
- Package / Case: TO-220-3
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Package: TO-220-3 |
Stock5,712 |
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NXP |
FET RF 15V 3.55GHZ 1.5PLD
- Transistor Type: pHEMT FET
- Frequency: 3.55GHz
- Gain: 11dB
- Voltage - Test: 12V
- Current Rating: -
- Noise Figure: -
- Current - Test: 80mA
- Power - Output: 4.5W
- Voltage - Rated: 15V
- Package / Case: PLD-1.5
- Supplier Device Package: PLD-1.5
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Package: PLD-1.5 |
Stock4,848 |
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NXP |
TRANS NPN 40V 25MA SOT54
- Transistor Type: NPN
- Voltage - Collector Emitter Breakdown (Max): 40V
- Frequency - Transition: 150MHz
- Noise Figure (dB Typ @ f): -
- Gain: -
- Power - Max: 300mW
- DC Current Gain (hFE) (Min) @ Ic, Vce: 67 @ 1mA, 10V
- Current - Collector (Ic) (Max): 25mA
- Operating Temperature: 150°C (TJ)
- Mounting Type: Through Hole
- Package / Case: TO-226-3, TO-92-3 (TO-226AA)
- Supplier Device Package: TO-92-3
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Package: TO-226-3, TO-92-3 (TO-226AA) |
Stock2,640 |
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NXP |
DIODE ZENER TO-236AB SOT23
- Voltage - Zener (Nom) (Vz): 10V
- Tolerance: ±2%
- Power - Max: 250mW
- Impedance (Max) (Zzt): 20 Ohms
- Current - Reverse Leakage @ Vr: 100nA @ 8V
- Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
- Operating Temperature: -65°C ~ 150°C
- Mounting Type: Surface Mount
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Supplier Device Package: TO-236AB (SOT23)
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Package: TO-236-3, SC-59, SOT-23-3 |
Stock5,824 |
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NXP |
IC REG LINEAR 3.3V 200MA 6-XSON
- Output Configuration: Positive
- Output Type: Fixed
- Number of Regulators: 1
- Voltage - Input (Max): 5.5V
- Voltage - Output (Min/Fixed): 3.3V
- Voltage - Output (Max): -
- Voltage Dropout (Max): 0.13V @ 200mA
- Current - Output: 200mA
- Current - Quiescent (Iq): -
- Current - Supply (Max): 100µA ~ 250µA
- PSRR: 55dB (1kHz)
- Control Features: Enable
- Protection Features: Over Current, Over Temperature
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 6-XFDFN
- Supplier Device Package: 6-XSON, SOT886 (1.45x1)
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Package: 6-XFDFN |
Stock5,808 |
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NXP |
IC REG LINEAR 2.9V 150MA 4WLCSP
- Output Configuration: Positive
- Output Type: Fixed
- Number of Regulators: 1
- Voltage - Input (Max): 5.5V
- Voltage - Output (Min/Fixed): 2.9V
- Voltage - Output (Max): -
- Voltage Dropout (Max): 0.075V @ 150mA
- Current - Output: 150mA
- Current - Quiescent (Iq): -
- Current - Supply (Max): 100µA ~ 250µA
- PSRR: 55dB (1kHz)
- Control Features: Enable
- Protection Features: Over Current, Over Temperature, Transient Voltage
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 4-XFBGA, WLCSP
- Supplier Device Package: 4-WLCSP (0.76x0.76)
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Package: 4-XFBGA, WLCSP |
Stock3,824 |
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NXP |
IC MOTOR DRIVER PAR 20HSOP
- Motor Type - Stepper: -
- Motor Type - AC, DC: Brushed DC
- Function: Driver - Fully Integrated, Control and Power Stage
- Output Configuration: Half Bridge (2)
- Interface: Parallel
- Technology: CMOS
- Step Resolution: -
- Applications: General Purpose
- Current - Output: 5A
- Voltage - Supply: 5 V ~ 40 V
- Voltage - Load: 5 V ~ 40 V
- Operating Temperature: -40°C ~ 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
- Supplier Device Package: 20-HSOP
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Package: 20-SOIC (0.433", 11.00mm Width) Exposed Pad |
Stock63,768 |
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NXP |
IC BUFFER TRI-ST NON-INV 20DIP
- Logic Type: Buffer, Non-Inverting
- Number of Elements: 2
- Number of Bits per Element: 4
- Input Type: -
- Output Type: Push-Pull
- Current - Output High, Low: 15mA, 64mA
- Voltage - Supply: 4.5 V ~ 5.5 V
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Through Hole
- Package / Case: 20-DIP (0.300", 7.62mm)
- Supplier Device Package: 20-DIP
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Package: 20-DIP (0.300", 7.62mm) |
Stock2,080 |
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NXP |
IC IF-PLL I2C-BUS DEMOD 24-SOIC
- Type: Demodulator
- Applications: TV
- Mounting Type: Surface Mount
- Package / Case: 24-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 24-SO
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Package: 24-SOIC (0.295", 7.50mm Width) |
Stock3,008 |
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NXP |
IC COMP RAIL-TO-RAIL 8XQFN
- Type: General Purpose
- Number of Elements: 2
- Output Type: Rail-to-Rail
- Voltage - Supply, Single/Dual (±): 1.3 V ~ 5.5 V
- Voltage - Input Offset (Max): 30mV @ 5.5V
- Current - Input Bias (Max): 1pA
- Current - Output (Typ): -
- Current - Quiescent (Max): 5µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 0.8µs
- Hysteresis: 20mV
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 8-XFQFN Exposed Pad
- Mounting Type: Surface Mount
- Supplier Device Package: 8-XQFN (1.6x1.6)
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Package: 8-XFQFN Exposed Pad |
Stock33,126 |
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NXP |
IC UART DUAL W/FIFO 32HVQFN
- Features: -
- Number of Channels: 2, DUART
- FIFO's: 128 Byte
- Protocol: RS485
- Data Rate (Max): 5Mbps
- Voltage - Supply: 2.5 V ~ 3.3 V
- With Auto Flow Control: Yes
- With IrDA Encoder/Decoder: Yes
- With False Start Bit Detection: Yes
- With Modem Control: Yes
- Mounting Type: Surface Mount
- Package / Case: 32-VFQFN Exposed Pad
- Supplier Device Package: 32-HVQFN (5x5)
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Package: 32-VFQFN Exposed Pad |
Stock4,544 |
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NXP |
IC I/O EXPANDER I2C 8B 16DIP
- Number of I/O: 8
- Interface: I2C
- Interrupt Output: Yes
- Features: POR
- Output Type: Push-Pull
- Current - Output Source/Sink: 300µA, 25mA
- Clock Frequency: 100kHz
- Voltage - Supply: 2.5 V ~ 6 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Through Hole
- Package / Case: 16-DIP (0.300", 7.62mm)
- Supplier Device Package: 16-DIP
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Package: 16-DIP (0.300", 7.62mm) |
Stock4,480 |
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NXP |
IC TRANSCEIVER 14SOIC
- Type: Transceiver
- Protocol: CAN
- Number of Drivers/Receivers: 1/1
- Duplex: -
- Receiver Hysteresis: -
- Data Rate: -
- Voltage - Supply: 3.3 V ~ 5 V
- Operating Temperature: -
- Mounting Type: Surface Mount
- Package / Case: 14-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 14-SO
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Package: 14-SOIC (0.154", 3.90mm Width) |
Stock3,552 |
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NXP |
IC TXRX LIN 2.1 10KBPS 8SOIC
- Type: Transceiver
- Protocol: LIN
- Number of Drivers/Receivers: 1/1
- Duplex: -
- Receiver Hysteresis: -
- Data Rate: 10kbps
- Voltage - Supply: 7 V ~ 18 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SOIC
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock7,600 |
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NXP |
IC ANALOG SWITCH 8CH SGL HXQFN16
- Switch Circuit: -
- Multiplexer/Demultiplexer Circuit: 8:1
- Number of Circuits: 1
- On-State Resistance (Max): 750 mOhm
- Channel-to-Channel Matching (ΔRon): 70 mOhm
- Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V
- Voltage - Supply, Dual (V±): -
- Switch Time (Ton, Toff) (Max): 45ns, 25ns
- -3db Bandwidth: 15MHz
- Charge Injection: 15pC
- Channel Capacitance (CS(off), CD(off)): 35pF
- Current - Leakage (IS(off)) (Max): 10nA
- Crosstalk: -90dB @ 100kHz
- Operating Temperature: -40°C ~ 125°C (TA)
- Package / Case: 16-XFQFN Exposed Pad
- Supplier Device Package: 16-HXQFN (3x3)
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Package: 16-XFQFN Exposed Pad |
Stock300,318 |
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NXP |
IC MCU 8BIT 20KB OTP 52PLCC
- Core Processor: HC11
- Core Size: 8-Bit
- Speed: 2MHz
- Connectivity: SCI, SPI
- Peripherals: POR, WDT
- Number of I/O: 38
- Program Memory Size: 20KB (20K x 8)
- Program Memory Type: OTP
- EEPROM Size: 512 x 8
- RAM Size: 768 x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Data Converters: A/D 8x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 52-LCC (J-Lead)
- Supplier Device Package: 52-PLCC (19.13x19.13)
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Package: 52-LCC (J-Lead) |
Stock4,384 |
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NXP |
IC MCU 32BIT ROMLESS 208FQFP
- Core Processor: Coldfire V3
- Core Size: 32-Bit
- Speed: 66MHz
- Connectivity: EBI/EMI, I2C, UART/USART
- Peripherals: DMA, POR, WDT
- Number of I/O: 16
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
- Data Converters: -
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 208-BFQFP
- Supplier Device Package: 208-FQFP (28x28)
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Package: 208-BFQFP |
Stock7,648 |
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NXP |
IC TRPL 8BIT VIDEO ADC 144LQFP
- Type: ADC, Video
- Number of Channels: -
- Resolution (Bits): 8 b
- Sampling Rate (Per Second): 140M
- Data Interface: Serial
- Voltage Supply Source: Analog and Digital
- Voltage - Supply: 3 V ~ 3.6 V
- Operating Temperature: -10°C ~ 70°C
- Mounting Type: Surface Mount
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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Package: 144-LQFP |
Stock4,704 |
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NXP |
TVS DIODE 5VWM 17VC 8SOIC
- Type: Zener
- Unidirectional Channels: -
- Bidirectional Channels: 7
- Voltage - Reverse Standoff (Typ): 5V (Max)
- Voltage - Breakdown (Min): 7.2V
- Voltage - Clamping (Max) @ Ipp: 17V
- Current - Peak Pulse (10/1000µs): 2.5A (8/20µs)
- Power - Peak Pulse: 35W
- Power Line Protection: No
- Applications: General Purpose
- Capacitance @ Frequency: 8pF @ 1MHz
- Operating Temperature: -65°C ~ 150°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SO
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock5,472 |
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NXP |
ACCELEROMETER 4-9G ANALOG 14LGA
- Type: Analog
- Axis: X, Y, Z
- Acceleration Range: ±4g, 9g
- Sensitivity (LSB/g): -
- Sensitivity (mV/g): 308 (±4g) ~ 83.6 (±9g)
- Bandwidth: 400Hz (X,Y), 300Hz (Z)
- Output Type: Analog Voltage
- Voltage - Supply: 2.2 V ~ 3.6 V
- Features: Selectable Scale
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 14-VFLGA
- Supplier Device Package: 14-LGA (3x5)
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Package: 14-VFLGA |
Stock8,784 |
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NXP |
IC AM RECEIVER CIRCUIT 16SOIC
- Frequency: AM
- Sensitivity: -
- Data Rate (Max): -
- Modulation or Protocol: AM
- Applications: AM Radio Receiver
- Current - Receiving: 15mA
- Data Interface: PCB, Surface Mount
- Memory Size: -
- Antenna Connector: PCB, Surface Mount
- Features: -
- Voltage - Supply: 7.5 V ~ 10 V
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 16-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 16-SO
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Package: 16-SOIC (0.154", 3.90mm Width) |
Stock2,916 |
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NXP |
SYSTEM BASIS CHIP DCDC 0.8A VCO
- Applications: System Basis Chip
- Current - Supply: -
- Voltage - Supply: -1.0 V ~ 40 V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP Exposed Pad |
Stock5,712 |
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NXP |
MCU S32K118 M0+ 256K 48 LQFP
- Core Processor: -
- Core Size: -
- Speed: -
- Connectivity: -
- Peripherals: -
- Number of I/O: -
- Program Memory Size: -
- Program Memory Type: -
- EEPROM Size: -
- RAM Size: -
- Voltage - Supply (Vcc/Vdd): -
- Data Converters: -
- Oscillator Type: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock4,032 |
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NXP |
IC MPU QORIQ LAYER 1GHZ 448FBGA
- Core Processor: ARM® Cortex®-A72
- Number of Cores/Bus Width: 2 Core, 64-Bit
- Speed: 1GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: 1Gbps (1), 2.5Gbps (5)
- SATA: SATA 6Gbps (1)
- USB: -
- Voltage - I/O: -
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 448-BFBGA
- Supplier Device Package: 448-FBGA (17x17)
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Package: - |
Request a Quote |
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NXP |
S32K142, 256K FLASH, 32K RAM
- Core Processor: -
- Core Size: -
- Speed: -
- Connectivity: -
- Peripherals: -
- Number of I/O: -
- Program Memory Size: -
- Program Memory Type: -
- EEPROM Size: -
- RAM Size: -
- Voltage - Supply (Vcc/Vdd): -
- Data Converters: -
- Oscillator Type: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
CAR DISP
- Type: -
- Interface: -
- Clock Rate: -
- Non-Volatile Memory: -
- On-Chip RAM: -
- Voltage - I/O: -
- Voltage - Core: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
S32K144 32-BIT MCU, ARM CORTEX-M
- Core Processor: -
- Core Size: -
- Speed: -
- Connectivity: -
- Peripherals: -
- Number of I/O: -
- Program Memory Size: -
- Program Memory Type: -
- EEPROM Size: -
- RAM Size: -
- Voltage - Supply (Vcc/Vdd): -
- Data Converters: -
- Oscillator Type: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
IC MPU QORLQ LX2 2GHZ 1517FCPBGA
- Core Processor: ARM® Cortex®-A72
- Number of Cores/Bus Width: 12 Core, 64-Bit
- Speed: 2GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR4
- Graphics Acceleration: Yes
- Display & Interface Controllers: -
- Ethernet: 100Gbps (2)
- SATA: SATA 3.0 (4)
- USB: USB 3.0 (2) + PHY (2)
- Voltage - I/O: 1.2V, 1.8V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TJ)
- Security Features: Secure Boot, TrustZone®
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FCPBGA (40x40)
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Package: - |
Request a Quote |
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