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NXP |
MOSFET N-CH 30V 120A I2PAK
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 30V
- Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
- Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
- Vgs(th) (Max) @ Id: 2.1V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs: 113nC @ 5V
- Input Capacitance (Ciss) (Max) @ Vds: 16150pF @ 25V
- Vgs (Max): ±10V
- FET Feature: -
- Power Dissipation (Max): 349W (Tc)
- Rds On (Max) @ Id, Vgs: 1.4 mOhm @ 25A, 10V
- Operating Temperature: -55°C ~ 175°C (TJ)
- Mounting Type: Through Hole
- Supplier Device Package: I2PAK
- Package / Case: TO-262-3 Long Leads, I2Pak, TO-262AA
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Package: TO-262-3 Long Leads, I2Pak, TO-262AA |
Stock3,248 |
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NXP |
MOSFET N-CH 55V 75A D2PAK
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 55V
- Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
- Drive Voltage (Max Rds On, Min Rds On): 10V
- Vgs(th) (Max) @ Id: 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs: 87nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds: 4352pF @ 25V
- Vgs (Max): ±20V
- FET Feature: -
- Power Dissipation (Max): 200W (Tc)
- Rds On (Max) @ Id, Vgs: 8 mOhm @ 25A, 10V
- Operating Temperature: -55°C ~ 175°C (TJ)
- Mounting Type: Surface Mount
- Supplier Device Package: D2PAK
- Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
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Package: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB |
Stock3,968 |
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NXP |
FET RF 68V 880MHZ NI-780S
- Transistor Type: LDMOS
- Frequency: 880MHz
- Gain: 19.7dB
- Voltage - Test: 28V
- Current Rating: -
- Noise Figure: -
- Current - Test: 1.5A
- Power - Output: 33W
- Voltage - Rated: 68V
- Package / Case: NI-780S
- Supplier Device Package: NI-780S
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Package: NI-780S |
Stock7,632 |
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NXP |
DIODE ZENER 15V 300MW SMT3
- Voltage - Zener (Nom) (Vz): 15V
- Tolerance: ±2%
- Power - Max: 300mW
- Impedance (Max) (Zzt): 15 Ohms
- Current - Reverse Leakage @ Vr: 70nA @ 11V
- Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
- Operating Temperature: -65°C ~ 150°C
- Mounting Type: Surface Mount
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Supplier Device Package: SMT3; MPAK
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Package: TO-236-3, SC-59, SOT-23-3 |
Stock5,184 |
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NXP |
IC 3-8 LINE DECODER/DEMUX 16-DIP
- Type: Decoder/Demultiplexer
- Circuit: 1 x 3:8
- Independent Circuits: 1
- Current - Output High, Low: 12mA, 12mA
- Voltage Supply Source: Single Supply
- Voltage - Supply: 1 V ~ 5.5 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Through Hole
- Package / Case: 16-DIP (0.300", 7.62mm)
- Supplier Device Package: 16-DIP
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Package: 16-DIP (0.300", 7.62mm) |
Stock4,368 |
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NXP |
IC GATE OR 4CH 2-INP 14-SSOP
- Logic Type: OR Gate
- Number of Circuits: 4
- Number of Inputs: 2
- Features: -
- Voltage - Supply: 1 V ~ 5.5 V
- Current - Quiescent (Max): 40µA
- Current - Output High, Low: 12mA, 12mA
- Logic Level - Low: 0.3 V ~ 0.8 V
- Logic Level - High: 0.9 V ~ 2 V
- Max Propagation Delay @ V, Max CL: 8ns @ 3.3V, 50pF
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Supplier Device Package: 14-SSOP
- Package / Case: 14-SSOP (0.209", 5.30mm Width)
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Package: 14-SSOP (0.209", 5.30mm Width) |
Stock4,736 |
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NXP |
IC I/O EXPANDER I2C 8B 16TSSOP
- Number of I/O: 8
- Interface: I2C, SMBus
- Interrupt Output: No
- Features: POR
- Output Type: Open Drain, Push-Pull
- Current - Output Source/Sink: 10mA, 20mA
- Clock Frequency: 400kHz
- Voltage - Supply: 2.3 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 16-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 16-TSSOP
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Package: 16-TSSOP (0.173", 4.40mm Width) |
Stock52,056 |
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NXP |
IC MPU MPC83XX 400MHZ 740TBGA
- Core Processor: PowerPC e300
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 400MHz
- Co-Processors/DSP: Communications; QUICC Engine
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (1)
- SATA: -
- USB: USB 1.x (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 740-LBGA
- Supplier Device Package: 740-TBGA (37.5x37.5)
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Package: 740-LBGA |
Stock5,728 |
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NXP |
IC MPU MPC74XX 1.4GHZ 360FCCLGA
- Core Processor: PowerPC G4
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.4GHz
- Co-Processors/DSP: Multimedia; SIMD
- RAM Controllers: -
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 1.5V, 1.8V, 2.5V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 360-CLGA, FCCLGA
- Supplier Device Package: 360-FCCLGA (25x25)
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Package: 360-CLGA, FCCLGA |
Stock3,008 |
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NXP |
IC MPU MPC82XX 266MHZ 408TBGA
- Core Processor: PowerPC G2
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 266MHz
- Co-Processors/DSP: Communications; RISC CPM
- RAM Controllers: DRAM, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100 Mbps (3)
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 480-LBGA
- Supplier Device Package: 408-TBGA (37.5x37.5)
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Package: 480-LBGA |
Stock7,792 |
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NXP |
IC MPU MPC83XX 266MHZ 620BGA
- Core Processor: PowerPC e300
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 266MHz
- Co-Processors/DSP: -
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (3)
- SATA: -
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 620-BBGA Exposed Pad
- Supplier Device Package: 620-PBGA (29x29)
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Package: 620-BBGA Exposed Pad |
Stock4,800 |
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NXP |
IC MCU 32BIT 256KB FLASH 64QFP
- Core Processor: Coldfire V1
- Core Size: 32-Bit
- Speed: 50MHz
- Connectivity: I2C, SCI, SPI
- Peripherals: LVD, PWM, WDT
- Number of I/O: 54
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 20x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 64-QFP
- Supplier Device Package: 64-QFP (14x14)
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Package: 64-QFP |
Stock2,064 |
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NXP |
IC MCU 8BIT ROMLESS 52PLCC
- Core Processor: HC11
- Core Size: 8-Bit
- Speed: 3MHz
- Connectivity: SCI, SPI
- Peripherals: POR, WDT
- Number of I/O: 38
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: 512 x 8
- RAM Size: 512 x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Data Converters: A/D 8x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 52-LCC (J-Lead)
- Supplier Device Package: 52-PLCC (19.1x19.1)
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Package: 52-LCC (J-Lead) |
Stock4,704 |
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NXP |
IC MCU 32BIT 256KB FLASH 81BGA
- Core Processor: Coldfire V2
- Core Size: 32-Bit
- Speed: 80MHz
- Connectivity: I2C, SPI, UART/USART
- Peripherals: DMA, LVD, POR, PWM, WDT
- Number of I/O: 56
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
- Data Converters: A/D 8x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 81-LBGA
- Supplier Device Package: 81-MAPBGA (10x10)
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Package: 81-LBGA |
Stock6,480 |
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NXP |
IC MCU 16BIT 256KB FLASH 112LQFP
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 50MHz
- Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 91
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 16K x 8
- Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
- Data Converters: A/D 16x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 112-LQFP
- Supplier Device Package: 112-LQFP (20x20)
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Package: 112-LQFP |
Stock12,372 |
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NXP |
IC MCU 16BIT 48KB FLASH 48LQFP
- Core Processor: 12V1
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: CAN, IrDA, LIN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 40
- Program Memory Size: 48KB (48K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 1.5K x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
- Data Converters: A/D 12x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP |
Stock3,728 |
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NXP |
IC MCU 16BIT 128KB FLASH 80QFP
- Core Processor: HCS12
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: EBI/EMI, I2C, SCI, SPI
- Peripherals: POR, PWM, WDT
- Number of I/O: 60
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 2.75 V
- Data Converters: A/D 16x10b; D/A 2x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 80-QFP
- Supplier Device Package: 80-QFP (14x14)
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Package: 80-QFP |
Stock9,396 |
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NXP |
IC REMOTE KEYLESS ENTRY 32HVQFN
- Type: -
- Frequency: -
- Standards: -
- Interface: -
- Voltage - Supply: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock8,028 |
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NXP |
IC INTEGRATED CAR RADIO 64-QFP
- Frequency: -
- Sensitivity: -
- Data Rate (Max): -
- Modulation or Protocol: AM, FM, WB
- Applications: AM/FM Radio Receiver
- Current - Receiving: 102mA
- Data Interface: PCB, Surface Mount
- Memory Size: -
- Antenna Connector: PCB, Surface Mount
- Features: -
- Voltage - Supply: 8 V ~ 9 V
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 64-BQFP
- Supplier Device Package: 64-QFP (14x14)
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Package: 64-BQFP |
Stock8,514 |
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NXP |
DUAL CORE 4M FLASH 512K RAM F
- Core Processor: e200z2, e200z4
- Core Size: 32-Bit Dual-Core
- Speed: 80MHz/160MHz
- Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
- Peripherals: DMA, LVD, POR, WDT
- Number of I/O: 129
- Program Memory Size: 4MB (4M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 80x10b, 64x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 176-LQFP Exposed Pad
- Supplier Device Package: 176-LQFP (24x24)
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Package: 176-LQFP Exposed Pad |
Stock6,048 |
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NXP |
8-BIT MCU S08 CORE 60KB FLASH
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 20MHz
- Connectivity: I²C, LINbus, SPI, UART/USART
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 39
- Program Memory Size: 60KB (60K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 256 x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 16x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Package: 48-LQFP |
Stock7,840 |
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NXP |
IC POWER MANAGEMENT LS1043A
- Applications: High Performance i.MX 8, S32x Processor Based
- Current - Supply: -
- Voltage - Supply: 2.5V ~ 5.5V
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount, Wettable Flank
- Package / Case: 56-VFQFN Exposed Pad
- Supplier Device Package: 56-HVQFN (8x8)
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Package: 56-VFQFN Exposed Pad |
Stock3,504 |
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NXP |
SYSTEM BASIS CHIP, DCDC 0.8A VCO
- Applications: System Basis Chip
- Current - Supply: -
- Voltage - Supply: 1V ~ 5V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP Exposed Pad
- Supplier Device Package: 48-HLQFP (7x7)
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Package: - |
Request a Quote |
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NXP |
IC CONSUMER CIRC PQCC32
- Type: -
- Protocol: -
- Number of Drivers/Receivers: -
- Duplex: -
- Receiver Hysteresis: -
- Data Rate: -
- Voltage - Supply: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
IC MCU 32BIT EXT MEM 289MAPBGA
- Core Processor: ARM® Cortex®-M7
- Core Size: 32-Bit Single-Core
- Speed: 800MHz
- Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
- Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
- Number of I/O: 13
- Program Memory Size: -
- Program Memory Type: External Program Memory
- EEPROM Size: -
- RAM Size: 2M x 8
- Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
- Data Converters: A/D 20x12b SAR; D/A 1x12b
- Oscillator Type: External, Internal
- Operating Temperature: 0°C ~ 95°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 289-LFBGA
- Supplier Device Package: 289-LFBGA (14x14)
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Package: - |
Request a Quote |
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NXP |
SOFTWARE DEFINED RADIO
- Type: -
- Interface: -
- Clock Rate: -
- Non-Volatile Memory: -
- On-Chip RAM: -
- Voltage - I/O: -
- Voltage - Core: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
IC MCU 16BIT 128KB FLASH 64LQFP
- Core Processor: S12
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: CANbus, IrDA, LINbus, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 54
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
- Data Converters: A/D 12x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
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Package: - |
Request a Quote |
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NXP |
CAR DISP
- Type: -
- Interface: -
- Clock Rate: -
- Non-Volatile Memory: -
- On-Chip RAM: -
- Voltage - I/O: -
- Voltage - Core: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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