Page 892 - NXP Products | Heisener Electronics

AFT18HW355SR5
NXP

FET RF 2CH 65V 1.88GHZ NI1230S-4

Package: NI-1230S

Stock3,360
BLS3135-10,114
NXP

TRANSISTOR RF POWER SOT445C

Package: SOT-445C

Stock5,648
PZM6.8NB2A,115
NXP

DIODE ZENER 6.8V 220MW SMT3

Package: TO-236-3, SC-59, SOT-23-3

Stock3,552
LD6935L/3118PDX
NXP

IC REG LIN 1.8V/3.1V 8DFN

Package: 8-XFDFN Exposed Pad

Stock7,664
74ABT620D,602
NXP

IC TRANSCEIVER 3ST 8BIT 20SOIC

Package: 20-SOIC (0.295", 7.50mm Width)

Stock4,704
SCC2691AC1N24,602
NXP

IC UART SINGLE 24-DIP

Package: 24-DIP (0.300", 7.62mm)

Stock4,656
MPC8545PXATGD
NXP

IC MPU MPC85XX 1.2GHZ 783FCBGA

Package: 783-BBGA, FCBGA

Stock6,672
MC8640DVU1000HC
NXP

IC MPU MPC86XX 1.0GHZ 1023FCCBGA

Package: 1023-BCBGA, FCCBGA

Stock5,312
KMC7448HX1400NC
NXP

IC MPU MPC74XX 1.4GHZ 360FCCBGA

Package: 360-BCBGA, FCCBGA

Stock6,432
MCIMX6G3DVK05AB
NXP

IC MPU I.MC6UL 528MHZ 272BGA

Package: -

Stock6,032
MPC875VR133
NXP

IC MPU MPC8XX 133MHZ 256BGA

Package: 256-BBGA

Stock14,808
MCIMX257DJM4A
NXP

IC MPU I.MX25 400MHZ 400MAPBGA

Package: 400-LFBGA

Stock6,600
MC9S12XHZ256VAGR
NXP

IC MCU 16BIT 256KB FLASH 144LQFP

Package: 144-LQFP

Stock4,144
MC9S08RD32DWE
NXP

IC MCU 8BIT 32KB FLASH 28SOIC

Package: 28-SOIC (0.295", 7.50mm Width)

Stock6,496
P87C51RC2BN,112
NXP

IC MCU 8BIT 32KB OTP 40DIP

Package: 40-DIP (0.600", 15.24mm)

Stock7,408
MPC564CVR40
NXP

IC MCU 32BIT 512KB FLASH 388BGA

Package: 388-BBGA

Stock4,944
MC9S08QE64CLC
NXP

IC MCU 8BIT 64KB FLASH 32LQFP

Package: 32-LQFP

Stock102,912
DSP56301VF100
NXP

IC DSP 24BIT FIXED-POINT 252-BGA

Package: 252-BGA

Stock4,432
DSP56321VL240
NXP

IC DSP 24BIT 240MHZ 196MAPBGA

Package: 196-BGA

Stock5,776
MMA6811BKCWR2
NXP

ACCELEROMETER 10BIT SPI 16QFN

Package: 16-QFN Exposed Pad

Stock8,172

Part Number	Manufacturer	Description	Package	Stock
AFT18HW355SR5	NXP	FET RF 2CH 65V 1.88GHZ NI1230S-4 Transistor Type: LDMOS (Dual) Frequency: 1.88GHz Gain: 15.2dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 1.1A Power - Output: 63W Voltage - Rated: 65V Package / Case: NI-1230S Supplier Device Package: NI-1230S	Package: NI-1230S	Stock3,360
BLS3135-10,114	NXP	TRANSISTOR RF POWER SOT445C Transistor Type: NPN Voltage - Collector Emitter Breakdown (Max): 75V Frequency - Transition: 3.5GHz Noise Figure (dB Typ @ f): - Gain: 9dB Power - Max: 34W DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 250mA, 5V Current - Collector (Ic) (Max): 1.5A Operating Temperature: 200°C (TJ) Mounting Type: Surface Mount Package / Case: SOT-445C Supplier Device Package: CDFM2	Package: SOT-445C	Stock5,648
PZM6.8NB2A,115	NXP	DIODE ZENER 6.8V 220MW SMT3 Voltage - Zener (Nom) (Vz): 6.8V Tolerance: ±2% Power - Max: 220mW Impedance (Max) (Zzt): 15 Ohms Current - Reverse Leakage @ Vr: 2µA @ 3.5V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: - Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	Package: TO-236-3, SC-59, SOT-23-3	Stock3,552
LD6935L/3118PDX	NXP	IC REG LIN 1.8V/3.1V 8DFN Output Configuration: Positive Output Type: Fixed Number of Regulators: 2 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 1.8V, 3.1V Voltage - Output (Max): - Voltage Dropout (Max): 0.24V @ 300mA (Typ), 0.24V @ 300mA (Typ) Current - Output: 300mA, 300mA Current - Quiescent (Iq): - Current - Supply (Max): 50µA PSRR: 80dB (1kHz) Control Features: Enable Protection Features: Over Current, Over Temperature, Soft Start Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 8-XFDFN Exposed Pad Supplier Device Package: 8-DFN (1.6x1.2)	Package: 8-XFDFN Exposed Pad	Stock7,664
74ABT620D,602	NXP	IC TRANSCEIVER 3ST 8BIT 20SOIC Logic Type: Transceiver, Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SO	Package: 20-SOIC (0.295", 7.50mm Width)	Stock4,704
SCC2691AC1N24,602	NXP	IC UART SINGLE 24-DIP Features: Configurable GPIO, Internal Oscillator, Timer/Counter Number of Channels: 1, UART FIFO's: - Protocol: - Data Rate (Max): - Voltage - Supply: 5V With Auto Flow Control: Yes With IrDA Encoder/Decoder: - With False Start Bit Detection: Yes With Modem Control: - Mounting Type: Through Hole Package / Case: 24-DIP (0.300", 7.62mm) Supplier Device Package: 24-DIP	Package: 24-DIP (0.300", 7.62mm)	Stock4,656
MPC8545PXATGD	NXP	IC MPU MPC85XX 1.2GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	Package: 783-BBGA, FCBGA	Stock6,672
MC8640DVU1000HC	NXP	IC MPU MPC86XX 1.0GHZ 1023FCCBGA Core Processor: PowerPC e600 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 1023-BCBGA, FCCBGA Supplier Device Package: 1023-FCCBGA (33x33)	Package: 1023-BCBGA, FCCBGA	Stock5,312
KMC7448HX1400NC	NXP	IC MPU MPC74XX 1.4GHZ 360FCCBGA Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.4GHz Co-Processors/DSP: Multimedia; SIMD RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25x25)	Package: 360-BCBGA, FCCBGA	Stock6,432
MCIMX6G3DVK05AB	NXP	IC MPU I.MC6UL 528MHZ 272BGA Core Processor: ARM? Cortex?-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 528MHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS Ethernet: 10/100 Mbps (2) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Package / Case: - Supplier Device Package: -	Package: -	Stock6,032
MPC875VR133	NXP	IC MPU MPC8XX 133MHZ 256BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 133MHz Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1), 10/100 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: Cryptography Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23x23)	Package: 256-BBGA	Stock14,808
MCIMX257DJM4A	NXP	IC MPU I.MX25 400MHZ 400MAPBGA Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: - RAM Controllers: LPDDR, DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD, Touchscreen Ethernet: 10/100 Mbps (1) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Operating Temperature: -20°C ~ 70°C (TA) Security Features: - Package / Case: 400-LFBGA Supplier Device Package: 400-MAPBGA (17x17)	Package: 400-LFBGA	Stock6,600
MC9S12XHZ256VAGR	NXP	IC MCU 16BIT 256KB FLASH 144LQFP Core Processor: HCS12X Core Size: 16-Bit Speed: 80MHz Connectivity: CAN, EBI/EMI, I2C, LIN, SCI, SPI Peripherals: LCD, Motor control PWM, POR, PWM, WDT Number of I/O: 117 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 16x8/10b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	Package: 144-LQFP	Stock4,144
MC9S08RD32DWE	NXP	IC MCU 8BIT 32KB FLASH 28SOIC Core Processor: S08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI Peripherals: LVD, POR, PWM, WDT Number of I/O: 23 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: - Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 28-SOIC (0.295", 7.50mm Width) Supplier Device Package: 28-SOIC	Package: 28-SOIC (0.295", 7.50mm Width)	Stock6,496
P87C51RC2BN,112	NXP	IC MCU 8BIT 32KB OTP 40DIP Core Processor: 8051 Core Size: 8-Bit Speed: 33MHz Connectivity: EBI/EMI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 32 Program Memory Size: 32KB (32K x 8) Program Memory Type: OTP EEPROM Size: - RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 40-DIP (0.600", 15.24mm) Supplier Device Package: 40-DIP	Package: 40-DIP (0.600", 15.24mm)	Stock7,408
MPC564CVR40	NXP	IC MCU 32BIT 512KB FLASH 388BGA Core Processor: PowerPC Core Size: 32-Bit Speed: 40MHz Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 56 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 2.5 V ~ 2.7 V Data Converters: A/D 32x10b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 388-BBGA Supplier Device Package: 388-PBGA (27x27)	Package: 388-BBGA	Stock4,944
MC9S08QE64CLC	NXP	IC MCU 8BIT 64KB FLASH 32LQFP Core Processor: S08 Core Size: 8-Bit Speed: 50MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, PWM, WDT Number of I/O: 26 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	Package: 32-LQFP	Stock102,912
DSP56301VF100	NXP	IC DSP 24BIT FIXED-POINT 252-BGA Type: Fixed Point Interface: Host Interface, SSI, SCI Clock Rate: 100MHz Non-Volatile Memory: ROM (9 kB) On-Chip RAM: 24kB Voltage - I/O: 3.30V Voltage - Core: 3.30V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 252-BGA Supplier Device Package: 252-MAPBGA (21x21)	Package: 252-BGA	Stock4,432
DSP56321VL240	NXP	IC DSP 24BIT 240MHZ 196MAPBGA Type: Fixed Point Interface: Host Interface, SSI, SCI Clock Rate: 240MHz Non-Volatile Memory: ROM (576 B) On-Chip RAM: 576kB Voltage - I/O: 3.30V Voltage - Core: 1.60V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 196-BGA Supplier Device Package: 196-MAPBGA (15x15)	Package: 196-BGA	Stock5,776
MMA6811BKCWR2	NXP	ACCELEROMETER 10BIT SPI 16QFN Type: Digital Axis: X, Y Acceleration Range: ±60g, ±25g Sensitivity (LSB/g): - Sensitivity (mV/g): - Bandwidth: - Output Type: SPI Voltage - Supply: 3.135 V ~ 5.25 V Features: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 16-QFN Exposed Pad Supplier Device Package: 16-QFN (6x6)	Package: 16-QFN Exposed Pad	Stock8,172
JN5179KIT/03Z	NXP	DEMO BOARD MCU WIRELESS Type: - Frequency: - For Use With/Related Products: - Supplied Contents: -	Package: -	Stock3,564
TJA1086GHN/0Z	NXP	FLEXRAY TRANSCEIVERS Type: Transceiver Protocol: FlexRay Number of Drivers/Receivers: 1/1 Duplex: Full Receiver Hysteresis: - Data Rate: - Voltage - Supply: 4.75 V ~ 5.25 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 44-VQFN Exposed Pad Supplier Device Package: 44-HVQFN (9x9)	Package: 44-VQFN Exposed Pad	Stock6,832
MPC5567MVR132	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z6 Core Size: 32-Bit Speed: 132MHz Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 238 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 80K x 8 Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V Data Converters: A/D 40x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BBGA Supplier Device Package: 416-PBGA (27x27)	Package: 416-BBGA	Stock5,696
SPC5602DF1CLL3	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 32MHz Connectivity: CANbus, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 79 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 33x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	Package: 100-LQFP	Stock4,928
S9S08DZ32F2CLFR	NXP	8-BIT MCU S08 CORE 32KB FLASH Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	Package: 48-LQFP	Stock3,216
MC33FS6505LAE	NXP	SYSTEM BASIS CHIP, DCDC 0.8A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	Package: -	Request a Quote
S912ZVC19AVLFR	NXP	IC MCU 16BIT 192KB FLASH 48LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 28 Program Memory Size: 192KB (192K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Data Converters: A/D 10x10b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	Package: -	Request a Quote
MPF7100BVBA0ES	NXP	PF7100 PMIC OTP Applications: i.MX Processors Current - Supply: 10µA Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (7x7)	Package: -	Request a Quote