Page 912 - NXP Products | Heisener Electronics

BUK7619-100B,118
NXP

MOSFET N-CH 100V 64A D2PAK

Package: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

Stock6,864
MRF5S21150HSR3
NXP

FET RF 65V 2.17GHZ NI-880S

Package: NI-880S

Stock2,048
BC549C,112
NXP

TRANS NPN 30V 0.1A TO-92

Package: TO-226-3, TO-92-3 (TO-226AA)

Stock2,272
LD6806CX4/13P,315
NXP

IC REG LINEAR 1.3V 200MA 4WLCSP

Package: 4-XFBGA, WLCSP

Stock2,560
MC33886VWR2
NXP

IC MOTOR DRIVER PAR 20HSOP

Package: 20-SOIC (0.433", 11.00mm Width) Exposed Pad

Stock13,356
TEA1623P/N1,112
NXP

IC CTRLR PWM SMPS SMPS HV 8DIP

Package: 8-DIP (0.300", 7.62mm)

Stock5,984
PTN3310D,112
NXP

IC XLATR LVDS-PECL LOGIC 8-SOIC

Package: 8-SOIC (0.154", 3.90mm Width)

Stock3,824
HEF4075BT,653
NXP

IC GATE OR 3CH 3-INP 14-SO

Package: 14-SOIC (0.154", 3.90mm Width)

Stock2,048
74LV32PW,118
NXP

IC GATE OR 4CH 2-INP 14-TSSOP

Package: 14-TSSOP (0.173", 4.40mm Width)

Stock5,424
N74F827N,602
NXP

IC BUFF DVR TRI-ST 10BIT 24DIP

Package: 24-DIP (0.300", 7.62mm)

Stock5,088
TDA20137/1,518
NXP

IC SATELLITE TUNER 56HVQFN

Package: 56-VFQFN Exposed Pad

Stock4,448
UJA1075TW/5V0/WD,1
NXP

IC SBC CAN/LIN HS 5V 32HTSSOP

Package: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

Stock7,680
MC8641VU1250HB
NXP

IC MPU MPC86XX 1.25GHZ 994FCCBGA

Package: 994-BCBGA, FCCBGA

Stock7,520
KMC7457RX1000NC
NXP

IC MPU MPC74XX 1.0GHZ 483FCCBGA

Package: 483-BCBGA, FCCBGA

Stock6,144
C291NSE7FHA
NXP

IC SOC CRYPTO 667MHZ 780FCBGA

Package: 780-BBGA, FCBGA

Stock3,984
MPC8306SCVMACDCA
NXP

IC MPU MPC83XX 200MHZ 369BGA

Package: 369-LFBGA

Stock6,448
MCIMX502CVK8B
NXP

IC MPU I.MX50 800MHZ 416MAPBGA

Package: 416-LFBGA

Stock9,180
LPC812M101FD20FP
NXP

IC MCU 32BIT 16KB FLASH 20SO

Package: 20-SOIC (0.295", 7.50mm Width)

Stock5,632
P87C661X2FA,529
NXP

IC MCU 8BIT 16KB OTP 44PLCC

Package: 44-LCC (J-Lead)

Stock2,288
MMPF0100F6AEPR2
NXP

POWER MANAGEMENT IC I.MX6 PRE-

Package: -

Stock7,824

Part Number	Manufacturer	Description	Package	Stock
BUK7619-100B,118	NXP	MOSFET N-CH 100V 64A D2PAK FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 100V Current - Continuous Drain (Id) @ 25°C: 64A (Tc) Drive Voltage (Max Rds On, Min Rds On): 10V Vgs(th) (Max) @ Id: 4V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 53nC @ 10V Input Capacitance (Ciss) (Max) @ Vds: 3400pF @ 25V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 200W (Tc) Rds On (Max) @ Id, Vgs: 19 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Surface Mount Supplier Device Package: D2PAK Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB	Package: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB	Stock6,864
MRF5S21150HSR3	NXP	FET RF 65V 2.17GHZ NI-880S Transistor Type: LDMOS Frequency: 2.11GHz ~ 2.17GHz Gain: 12.5dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 1.3A Power - Output: 33W Voltage - Rated: 65V Package / Case: NI-880S Supplier Device Package: NI-880S	Package: NI-880S	Stock2,048
BC549C,112	NXP	TRANS NPN 30V 0.1A TO-92 Transistor Type: NPN Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 30V Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 100mA Current - Collector Cutoff (Max): 15nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V Power - Max: 500mW Frequency - Transition: 100MHz Operating Temperature: 150°C (TJ) Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) Supplier Device Package: TO-92-3	Package: TO-226-3, TO-92-3 (TO-226AA)	Stock2,272
LD6806CX4/13P,315	NXP	IC REG LINEAR 1.3V 200MA 4WLCSP Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 1.3V Voltage - Output (Max): - Voltage Dropout (Max): 0.1V @ 200mA Current - Output: 200mA Current - Quiescent (Iq): - Current - Supply (Max): 100µA ~ 250µA PSRR: 55dB (1kHz) Control Features: Enable Protection Features: Over Current, Over Temperature Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 4-XFBGA, WLCSP Supplier Device Package: 4-WLCSP (0.76x0.76)	Package: 4-XFBGA, WLCSP	Stock2,560
MC33886VWR2	NXP	IC MOTOR DRIVER PAR 20HSOP Motor Type - Stepper: - Motor Type - AC, DC: Brushed DC Function: Driver - Fully Integrated, Control and Power Stage Output Configuration: Half Bridge (2) Interface: Parallel Technology: CMOS Step Resolution: - Applications: General Purpose Current - Output: 5A Voltage - Supply: 5 V ~ 40 V Voltage - Load: 5 V ~ 40 V Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad Supplier Device Package: 20-HSOP	Package: 20-SOIC (0.433", 11.00mm Width) Exposed Pad	Stock13,356
TEA1623P/N1,112	NXP	IC CTRLR PWM SMPS SMPS HV 8DIP Output Isolation: Isolated Internal Switch(s): Yes Voltage - Breakdown: 650V Topology: Flyback Voltage - Start Up: 9.5V Voltage - Supply (Vcc/Vdd): 7.5 V ~ 40 V Duty Cycle: 75% Frequency - Switching: 10kHz ~ 200kHz Power (Watts): - Fault Protection: Current Limiting, Over Temperature, Short Circuit Control Features: Frequency Control Operating Temperature: -20°C ~ 85°C (TA) Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-DIP Mounting Type: Through Hole	Package: 8-DIP (0.300", 7.62mm)	Stock5,984
PTN3310D,112	NXP	IC XLATR LVDS-PECL LOGIC 8-SOIC Translator Type: Mixed Signal Channel Type: Unidirectional Number of Circuits: 1 Channels per Circuit: 1 Voltage - VCCA: - Voltage - VCCB: - Input Signal: LVDS Output Signal: PECL Output Type: Differential Data Rate: 800Mbps Operating Temperature: -40°C ~ 85°C (TA) Features: - Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	Package: 8-SOIC (0.154", 3.90mm Width)	Stock3,824
HEF4075BT,653	NXP	IC GATE OR 3CH 3-INP 14-SO Logic Type: OR Gate Number of Circuits: 3 Number of Inputs: 3 Features: - Voltage - Supply: 3 V ~ 15 V Current - Quiescent (Max): 4µA Current - Output High, Low: 3mA, 3mA Logic Level - Low: 1.5 V ~ 4 V Logic Level - High: 3.5 V ~ 11 V Max Propagation Delay @ V, Max CL: 40ns @ 15V, 50pF Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Supplier Device Package: 14-SO Package / Case: 14-SOIC (0.154", 3.90mm Width)	Package: 14-SOIC (0.154", 3.90mm Width)	Stock2,048
74LV32PW,118	NXP	IC GATE OR 4CH 2-INP 14-TSSOP Logic Type: OR Gate Number of Circuits: 4 Number of Inputs: 2 Features: - Voltage - Supply: 1 V ~ 5.5 V Current - Quiescent (Max): 40µA Current - Output High, Low: 12mA, 12mA Logic Level - Low: 0.3 V ~ 0.8 V Logic Level - High: 0.9 V ~ 2 V Max Propagation Delay @ V, Max CL: 8ns @ 3.3V, 50pF Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Supplier Device Package: 14-TSSOP Package / Case: 14-TSSOP (0.173", 4.40mm Width)	Package: 14-TSSOP (0.173", 4.40mm Width)	Stock5,424
N74F827N,602	NXP	IC BUFF DVR TRI-ST 10BIT 24DIP Logic Type: Buffer, Non-Inverting Number of Elements: 1 Number of Bits per Element: 10 Input Type: - Output Type: Push-Pull Current - Output High, Low: 24mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Package / Case: 24-DIP (0.300", 7.62mm) Supplier Device Package: 24-DIP	Package: 24-DIP (0.300", 7.62mm)	Stock5,088
TDA20137/1,518	NXP	IC SATELLITE TUNER 56HVQFN Type: Tuner Applications: Set-Top Boxes Mounting Type: Surface Mount Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Package: 56-VFQFN Exposed Pad	Stock4,448
UJA1075TW/5V0/WD,1	NXP	IC SBC CAN/LIN HS 5V 32HTSSOP Applications: Automotive Interface: CAN, LIN Voltage - Supply: 4.5 V ~ 28 V Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Supplier Device Package: 32-HTSSOP Mounting Type: Surface Mount	Package: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad	Stock7,680
MC8641VU1250HB	NXP	IC MPU MPC86XX 1.25GHZ 994FCCBGA Core Processor: PowerPC e600 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.25GHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 994-BCBGA, FCCBGA Supplier Device Package: 994-FCCBGA (33x33)	Package: 994-BCBGA, FCCBGA	Stock7,520
KMC7457RX1000NC	NXP	IC MPU MPC74XX 1.0GHZ 483FCCBGA Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; SIMD RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 483-BCBGA, FCCBGA Supplier Device Package: 483-FCCBGA (29x29)	Package: 483-BCBGA, FCCBGA	Stock6,144
C291NSE7FHA	NXP	IC SOC CRYPTO 667MHZ 780FCBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: Security; SEC RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: - Operating Temperature: 0°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FCPBGA (23x23)	Package: 780-BBGA, FCBGA	Stock3,984
MPC8306SCVMACDCA	NXP	IC MPU MPC83XX 200MHZ 369BGA Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 200MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: USB 2.0 (1) Voltage - I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 369-LFBGA Supplier Device Package: 369-PBGA (19x19)	Package: 369-LFBGA	Stock6,448
MCIMX502CVK8B	NXP	IC MPU I.MX50 800MHZ 416MAPBGA Core Processor: ARM? Cortex?-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR, LPDDR2, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: LCD Ethernet: 10/100 Mbps (1) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: Boot Security, Cryptography, Secure JTAG Package / Case: 416-LFBGA Supplier Device Package: -	Package: 416-LFBGA	Stock9,180
LPC812M101FD20FP	NXP	IC MCU 32BIT 16KB FLASH 20SO Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 30MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Number of I/O: 18 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SO	Package: 20-SOIC (0.295", 7.50mm Width)	Stock5,632
P87C661X2FA,529	NXP	IC MCU 8BIT 16KB OTP 44PLCC Core Processor: 8051 Core Size: 8-Bit Speed: 33MHz Connectivity: EBI/EMI, I2C, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 32 Program Memory Size: 16KB (16K x 8) Program Memory Type: OTP EEPROM Size: - RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59)	Package: 44-LCC (J-Lead)	Stock2,288
MMPF0100F6AEPR2	NXP	POWER MANAGEMENT IC I.MX6 PRE- Applications: - Voltage - Input: - Number of Outputs: - Voltage - Output: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock7,824
TDA18286HN/C1E	NXP	CABLE FST DEMOD Function: - Interface: - Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock5,216
LPC804M101JDH24J	NXP	32-BIT ARM CORTEX-M0+ Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 15MHz Connectivity: I²C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Number of I/O: 21 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 12x12b, D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 24-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 24-TSSOP	Package: 24-TSSOP (0.173", 4.40mm Width)	Stock7,648
LX2160XC72029B	NXP	IC MPU QORLQ LX2 2GHZ 1517FCPBGA Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 16 Core, 64-Bit Speed: 2GHz Co-Processors/DSP: - RAM Controllers: DDR4 Graphics Acceleration: Yes Display & Interface Controllers: - Ethernet: 100Gbps (2) SATA: SATA 3.0 (4) USB: USB 3.0 (2) + PHY (2) Voltage - I/O: 1.2V, 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: Secure Boot, TrustZone® Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCPBGA (40x40)	Package: -	Request a Quote
MC33FS4508NAER2	NXP	SYSTEM BASIS CHIP, LINEAR 0.5A V Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	Package: -	Request a Quote
LD6816CX4-C20P-315	NXP	IC REG LINEAR FIXED LDO REG Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 2V Voltage - Output (Max): - Voltage Dropout (Max): 0.075V @ 150mA Current - Output: 150mA Current - Quiescent (Iq): 100 µA Current - Supply (Max): 250 µA PSRR: 55dB (1kHz) Control Features: Enable Protection Features: Over Current, Over Temperature, Transient Voltage Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 4-UFBGA, WLCSP Supplier Device Package: 4-WLCSP (0.76x0.76)	Package: -	Request a Quote
FS32K148UIT0VLQT	NXP	S32K148 ARM CORTEX-M4F, 112 MHZ, Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Speed: 112MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT Number of I/O: 128 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 32x12b SAR; D/A 1x8b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	Package: -	Request a Quote
SAF775DHV-N208W-GK	NXP	CAR DISP Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
MFS2301BMMA0EP	NXP	IC Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote