Page 939 - NXP Products | Heisener Electronics

BUK7Y08-40B/C,115
NXP

MOSFET N-CH 40V 75A LFPAK

Package: SC-100, SOT-669

Stock6,576
PHP73N06T,127
NXP

MOSFET N-CH 60V 73A TO220AB

Package: TO-220-3

Stock4,432
PHD3055E,118
NXP

MOSFET N-CH 60V 10.3A DPAK

Package: TO-252-3, DPak (2 Leads + Tab), SC-63

Stock7,328
MRFE6VP6300HR3
NXP

FET RF 2CH 130V 230MHZ NI780-4

Package: NI-780-4

Stock6,192
PZT3906,115
NXP

TRANS PNP 40V 0.1A SOT-223

Package: TO-261-4, TO-261AA

Stock4,080
MC13783VK
NXP

IC PWR MNGMNT ATLAS 3G 247MAPBGA

Package: 247-TFBGA

Stock252,240
MC10XS4200FKR2
NXP

IC SW HIGH SIDE 24V DUAL 23PQFN

Package: 23-PowerQFN

Stock2,720
TDA20140/2,518
NXP

IC HDMI INTERFACE 28-HVQFN

Package: 28-VFQFN Exposed Pad

Stock7,248
SC16C751BIBS,128
NXP

IC UART SINGLE W/FIFO 24-HVQFN

Package: 24-VFQFN Exposed Pad

Stock7,776
PCA8575D,112
NXP

IC I/O EXPANDER I2C 16B 24SOIC

Package: 24-SOIC (0.295", 7.50mm Width)

Stock16,716
MCZ33661EFR2
NXP

IC LIN INTERFACE PHYSICAL 8-SOIC

Package: 8-SOIC (0.154", 3.90mm Width)

Stock105,552
74HC4052D/AUJ
NXP

IC MUX/DEMUX DUAL 4X1 16SOIC

Package: 16-SOIC (0.154", 3.90mm Width)

Stock3,040
MCIMX535DVV1B
NXP

IC MPU I.MX53 1.0GHZ 529TEBGA-2

Package: 529-FBGA

Stock6,560
KMPC860TVR80D4
NXP

IC MPU MPC8XX 80MHZ 357BGA

Package: 357-BBGA

Stock5,648
MC9S08SE8MTG
NXP

IC MCU 8BIT 8KB FLASH 16TSSOP

Package: 16-TSSOP (0.173", 4.40mm Width)

Stock5,232
MC908LJ24CFQE
NXP

IC MCU 8BIT 24KB FLASH 80QFP

Package: 80-QFP

Stock3,696
MPC561MZP56
NXP

IC MCU 32BIT ROMLESS 388PBGA

Package: 388-BBGA

Stock32,544
MK22FX512VLK12
NXP

IC MCU 32BIT 512KB FLASH 80LQFP

Package: 80-LQFP

Stock5,264
MC908GR16ACFAE
NXP

IC MCU 8BIT 16KB FLASH 48LQFP

Package: 48-LQFP

Stock156,744
MK10DX32VLH5
NXP

IC MCU 32BIT 32KB FLASH 64LQFP

Package: 64-LQFP

Stock7,616

Part Number	Manufacturer	Description	Package	Stock
BUK7Y08-40B/C,115	NXP	MOSFET N-CH 40V 75A LFPAK FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 40V Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Drive Voltage (Max Rds On, Min Rds On): 10V Vgs(th) (Max) @ Id: 4V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 36.3nC @ 10V Input Capacitance (Ciss) (Max) @ Vds: 2040pF @ 25V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 105W (Tc) Rds On (Max) @ Id, Vgs: 8 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Surface Mount Supplier Device Package: LFPAK56, Power-SO8 Package / Case: SC-100, SOT-669	Package: SC-100, SOT-669	Stock6,576
PHP73N06T,127	NXP	MOSFET N-CH 60V 73A TO220AB FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 60V Current - Continuous Drain (Id) @ 25°C: 73A (Tc) Drive Voltage (Max Rds On, Min Rds On): 10V Vgs(th) (Max) @ Id: 4V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 54nC @ 10V Input Capacitance (Ciss) (Max) @ Vds: 2464pF @ 25V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 166W (Tc) Rds On (Max) @ Id, Vgs: 14 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Through Hole Supplier Device Package: TO-220AB Package / Case: TO-220-3	Package: TO-220-3	Stock4,432
PHD3055E,118	NXP	MOSFET N-CH 60V 10.3A DPAK FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 60V Current - Continuous Drain (Id) @ 25°C: 10.3A (Tc) Drive Voltage (Max Rds On, Min Rds On): 10V Vgs(th) (Max) @ Id: 4V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 5.8nC @ 10V Input Capacitance (Ciss) (Max) @ Vds: 250pF @ 25V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 33W (Tc) Rds On (Max) @ Id, Vgs: 150 mOhm @ 5.5A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Surface Mount Supplier Device Package: DPAK Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63	Package: TO-252-3, DPak (2 Leads + Tab), SC-63	Stock7,328
MRFE6VP6300HR3	NXP	FET RF 2CH 130V 230MHZ NI780-4 Transistor Type: LDMOS (Dual) Frequency: 230MHz Gain: 26.5dB Voltage - Test: 50V Current Rating: - Noise Figure: - Current - Test: 100mA Power - Output: 300W Voltage - Rated: 130V Package / Case: NI-780-4 Supplier Device Package: NI-780-4	Package: NI-780-4	Stock6,192
PZT3906,115	NXP	TRANS PNP 40V 0.1A SOT-223 Transistor Type: PNP Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 40V Vce Saturation (Max) @ Ib, Ic: 200mV @ 5mA, 50mA Current - Collector Cutoff (Max): 50nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 1V Power - Max: 1.05W Frequency - Transition: 250MHz Operating Temperature: 150°C (TJ) Mounting Type: Surface Mount Package / Case: TO-261-4, TO-261AA Supplier Device Package: SOT-223	Package: TO-261-4, TO-261AA	Stock4,080
MC13783VK	NXP	IC PWR MNGMNT ATLAS 3G 247MAPBGA Applications: Handheld/Mobile Devices Current - Supply: - Voltage - Supply: - Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 247-TFBGA Supplier Device Package: 247-MAPBGA (10x10)	Package: 247-TFBGA	Stock252,240
MC10XS4200FKR2	NXP	IC SW HIGH SIDE 24V DUAL 23PQFN Switch Type: General Purpose Number of Outputs: 2 Ratio - Input:Output: 1:1 Output Configuration: High Side Output Type: N-Channel Interface: SPI Voltage - Load: 8 V ~ 36 V Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Current - Output (Max): 6A Rds On (Typ): 10 mOhm (Max) Input Type: - Features: Internal PWM, Slew Rate Controlled, Watchdog Timer Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 23-PowerQFN Supplier Device Package: 23-PQFN (12x12)	Package: 23-PowerQFN	Stock2,720
TDA20140/2,518	NXP	IC HDMI INTERFACE 28-HVQFN Type: Interface Applications: Video Mounting Type: Surface Mount Package / Case: 28-VFQFN Exposed Pad Supplier Device Package: 28-HVQFN (5x5)	Package: 28-VFQFN Exposed Pad	Stock7,248
SC16C751BIBS,128	NXP	IC UART SINGLE W/FIFO 24-HVQFN Features: - Number of Channels: 1, UART FIFO's: 64 Byte Protocol: - Data Rate (Max): 5Mbps Voltage - Supply: 2.5V, 3.3V, 5V With Auto Flow Control: Yes With IrDA Encoder/Decoder: - With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-HVQFN (4x4)	Package: 24-VFQFN Exposed Pad	Stock7,776
PCA8575D,112	NXP	IC I/O EXPANDER I2C 16B 24SOIC Number of I/O: 16 Interface: I2C Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 100µA, 25mA Clock Frequency: 400kHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-SOIC (0.295", 7.50mm Width) Supplier Device Package: 24-SO	Package: 24-SOIC (0.295", 7.50mm Width)	Stock16,716
MCZ33661EFR2	NXP	IC LIN INTERFACE PHYSICAL 8-SOIC Type: Transceiver Protocol: LIN Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 175mV Data Rate: 20kbps Voltage - Supply: 6 V ~ 18 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SOIC	Package: 8-SOIC (0.154", 3.90mm Width)	Stock105,552
74HC4052D/AUJ	NXP	IC MUX/DEMUX DUAL 4X1 16SOIC Switch Circuit: SP4T Multiplexer/Demultiplexer Circuit: 4:1 Number of Circuits: 2 On-State Resistance (Max): 130 Ohm Channel-to-Channel Matching (ΔRon): 4 Ohm Voltage - Supply, Single (V+): 2 V ~ 6 V Voltage - Supply, Dual (V±): - Switch Time (Ton, Toff) (Max): 34ns, 32ns -3db Bandwidth: - Charge Injection: - Channel Capacitance (CS(off), CD(off)): 10pF Current - Leakage (IS(off)) (Max): 1µA Crosstalk: -50dB @ 1MHz Operating Temperature: -40°C ~ 85°C (TA) Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	Package: 16-SOIC (0.154", 3.90mm Width)	Stock3,040
MCIMX535DVV1B	NXP	IC MPU I.MX53 1.0GHZ 529TEBGA-2 Core Processor: ARM? Cortex?-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100 Mbps (1) SATA: SATA 1.5Gbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (2) Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -20°C ~ 85°C (TC) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 529-FBGA Supplier Device Package: 529-TEPBGA-2 (19x19)	Package: 529-FBGA	Stock6,560
KMPC860TVR80D4	NXP	IC MPU MPC8XX 80MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 80MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (4), 10/100 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	Package: 357-BBGA	Stock5,648
MC9S08SE8MTG	NXP	IC MCU 8BIT 8KB FLASH 16TSSOP Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: LIN, SCI Peripherals: LVD, POR, PWM Number of I/O: 14 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 10x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	Package: 16-TSSOP (0.173", 4.40mm Width)	Stock5,232
MC908LJ24CFQE	NXP	IC MCU 8BIT 24KB FLASH 80QFP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: I2C, IRSCI, SPI Peripherals: LCD, LVD, POR, PWM Number of I/O: 48 Program Memory Size: 24KB (24K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 768 x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 6x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	Package: 80-QFP	Stock3,696
MPC561MZP56	NXP	IC MCU 32BIT ROMLESS 388PBGA Core Processor: PowerPC Core Size: 32-Bit Speed: 56MHz Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 64 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 2.5 V ~ 2.7 V Data Converters: A/D 32x10b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 388-BBGA Supplier Device Package: 388-PBGA (27x27)	Package: 388-BBGA	Stock32,544
MK22FX512VLK12	NXP	IC MCU 32BIT 512KB FLASH 80LQFP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 120MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 56 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 27x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (12x12)	Package: 80-LQFP	Stock5,264
MC908GR16ACFAE	NXP	IC MCU 8BIT 16KB FLASH 48LQFP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: LIN, SCI, SPI Peripherals: LVD, POR, PWM Number of I/O: 37 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	Package: 48-LQFP	Stock156,744
MK10DX32VLH5	NXP	IC MCU 32BIT 32KB FLASH 64LQFP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, IrDA, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 44 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 19x16b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	Package: 64-LQFP	Stock7,616
MF3MOD4101DA4/04,1	NXP	IC DESFIRE EV1 4K EEPROM PLLMC Type: RFID Transponder Frequency: 13.56MHz Standards: ISO 14443, MIFARE Interface: UART Voltage - Supply: - Operating Temperature: -25°C ~ 70°C Package / Case: MOA4, Smart Card Module Supplier Device Package: PLLMC	Package: MOA4, Smart Card Module	Stock2,538
LS1021AXE7KQB	NXP	LS1 32BIT ARM SOC 1GHZ DDR3/4 Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19x19)	Package: 525-FBGA, FCBGA	Stock5,536
FS32K144UAT0MLHT	NXP	S32K144 32-BIT MCU, ARM Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Speed: 112MHz Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: - Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	Package: 64-LQFP	Stock5,968
SPC5775EDK3MME3R	NXP	POWER ARCH CORES 8MB FL Core Processor: e200z7 Core Size: 32-Bit Dual-Core Speed: 264MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Number of I/O: 293 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 40x12b eQADCx2 Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BGA Supplier Device Package: 416-MAPBGA (27x27)	Package: 416-BGA	Stock3,968
MC35FS6505NAE	NXP	SYSTEM BASIS CHIP, DCDC 0.8A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	Package: -	Request a Quote
S32K310NHT0VPAST	NXP	IC MCU 32BIT 512KB FLASH 100QFP Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Speed: 120MHz Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Number of I/O: 84 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 112K x 8 Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 24x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 100-QFP Supplier Device Package: 100-MaxQFP (10x10)	Package: -	Request a Quote
SAF4000EL-101Z233K	NXP	SAF4000EL Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
MC68EC040RC33A-NXP	NXP	MICROPROCESSOR, 32 BIT, MC68000 Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote