|
|
TE Connectivity Passive Product |
RES SMD 3.32M OHM 1% 1/2W 2010
- Resistance: 3.32 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock2,232 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 3.24M OHM 1% 1/2W 2010
- Resistance: 3.24 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock5,616 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 3.16M OHM 1% 1/2W 2010
- Resistance: 3.16 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock2,088 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 3.09M OHM 1% 1/2W 2010
- Resistance: 3.09 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock3,672 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 3.01M OHM 1% 1/2W 2010
- Resistance: 3.01 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock4,878 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 2.94M OHM 1% 1/2W 2010
- Resistance: 2.94 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock7,344 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 2.87M OHM 1% 1/2W 2010
- Resistance: 2.87 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock4,338 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 2.8M OHM 1% 1/2W 2010
- Resistance: 2.8 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock2,250 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 2.74M OHM 1% 1/2W 2010
- Resistance: 2.74 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock2,898 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 2.67M OHM 1% 1/2W 2010
- Resistance: 2.67 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock3,258 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 2.61M OHM 1% 1/2W 2010
- Resistance: 2.61 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock5,868 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 2.55M OHM 1% 1/2W 2010
- Resistance: 2.55 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock4,680 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 2.49M OHM 1% 1/2W 2010
- Resistance: 2.49 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock2,970 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 2.43M OHM 1% 1/2W 2010
- Resistance: 2.43 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock4,896 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 2.37M OHM 1% 1/2W 2010
- Resistance: 2.37 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock6,282 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 2.32M OHM 1% 1/2W 2010
- Resistance: 2.32 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock8,064 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 2.26M OHM 1% 1/2W 2010
- Resistance: 2.26 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock4,878 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 2.21M OHM 1% 1/2W 2010
- Resistance: 2.21 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock4,698 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 2.15M OHM 1% 1/2W 2010
- Resistance: 2.15 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock4,176 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 2.1M OHM 1% 1/2W 2010
- Resistance: 2.1 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock3,006 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 2.05M OHM 1% 1/2W 2010
- Resistance: 2.05 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock7,182 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 2M OHM 1% 1/2W 2010
- Resistance: 2 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock7,326 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 1.96M OHM 1% 1/2W 2010
- Resistance: 1.96 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock5,886 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 1.91M OHM 1% 1/2W 2010
- Resistance: 1.91 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock7,848 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 1.87M OHM 1% 1/2W 2010
- Resistance: 1.87 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock8,226 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 1.82M OHM 1% 1/2W 2010
- Resistance: 1.82 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock3,472 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 1.78M OHM 1% 1/2W 2010
- Resistance: 1.78 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock2,448 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 1.74M OHM 1% 1/2W 2010
- Resistance: 1.74 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock5,904 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |