|
|
TE Connectivity Passive Product |
RES SMD 6.49M OHM 1% 1/2W 2010
- Resistance: 6.49 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock6,048 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 6.34M OHM 1% 1/2W 2010
- Resistance: 6.34 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock6,552 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 6.19M OHM 1% 1/2W 2010
- Resistance: 6.19 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock2,862 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 6.04M OHM 1% 1/2W 2010
- Resistance: 6.04 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock4,950 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 5.9M OHM 1% 1/2W 2010
- Resistance: 5.9 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock7,938 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 5.76M OHM 1% 1/2W 2010
- Resistance: 5.76 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock7,074 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 5.62M OHM 1% 1/2W 2010
- Resistance: 5.62 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock6,102 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 5.49M OHM 1% 1/2W 2010
- Resistance: 5.49 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock7,920 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 5.36M OHM 1% 1/2W 2010
- Resistance: 5.36 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock6,588 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 5.23M OHM 1% 1/2W 2010
- Resistance: 5.23 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock8,946 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 5.11M OHM 1% 1/2W 2010
- Resistance: 5.11 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock3,598 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 4.99M OHM 1% 1/2W 2010
- Resistance: 4.99 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock4,878 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 4.87M OHM 1% 1/2W 2010
- Resistance: 4.87 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock2,232 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 4.75M OHM 1% 1/2W 2010
- Resistance: 4.75 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock3,546 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 4.64M OHM 1% 1/2W 2010
- Resistance: 4.64 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock7,002 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 4.53M OHM 1% 1/2W 2010
- Resistance: 4.53 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock6,246 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 4.42M OHM 1% 1/2W 2010
- Resistance: 4.42 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock8,622 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 4.32M OHM 1% 1/2W 2010
- Resistance: 4.32 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock4,752 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 4.22M OHM 1% 1/2W 2010
- Resistance: 4.22 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock3,798 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 4.12M OHM 1% 1/2W 2010
- Resistance: 4.12 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock3,420 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 4.02M OHM 1% 1/2W 2010
- Resistance: 4.02 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock7,272 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 3.92M OHM 1% 1/2W 2010
- Resistance: 3.92 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock7,668 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 3.83M OHM 1% 1/2W 2010
- Resistance: 3.83 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock4,014 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 3.74M OHM 1% 1/2W 2010
- Resistance: 3.74 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock2,916 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 3.65M OHM 1% 1/2W 2010
- Resistance: 3.65 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock8,910 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 3.57M OHM 1% 1/2W 2010
- Resistance: 3.57 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock6,696 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 3.48M OHM 1% 1/2W 2010
- Resistance: 3.48 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock7,920 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |
|
|
TE Connectivity Passive Product |
RES SMD 3.4M OHM 1% 1/2W 2010
- Resistance: 3.4 MOhms
- Tolerance: ±1%
- Power (Watts): 0.5W, 1/2W
- Composition: Thick Film
- Features: -
- Temperature Coefficient: ±200ppm/°C
- Operating Temperature: -55°C ~ 125°C
- Package / Case: 2010 (5025 Metric)
- Supplier Device Package: 2010
- Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
- Height - Seated (Max): -
- Number of Terminations: 2
- Failure Rate: -
|
Package: 2010 (5025 Metric) |
Stock5,580 |
|
±1% | 0.5W, 1/2W | Thick Film | - | ±200ppm/°C | -55°C ~ 125°C | 2010 (5025 Metric) | 2010 | 0.197" L x 0.098" W (5.00mm x 2.50mm) | - | 2 | - |