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Xilinx Inc. |
IC PROM SER 1MBIT 3.3V 20-SOIC
- Programmable Type: OTP
- Memory Size: 1Mb
- Voltage - Supply: 3 V ~ 3.6 V
- Operating Temperature: 0°C ~ 70°C
- Package / Case: 20-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 20-SOIC
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Package: 20-SOIC (0.295", 7.50mm Width) |
Stock6,288 |
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Xilinx Inc. |
IC PROM SER 150000 I-TEMP 8-DIP
- Programmable Type: OTP
- Memory Size: 1.5Mb
- Voltage - Supply: 3 V ~ 3.6 V
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 8-DIP (0.300", 7.62mm)
- Supplier Device Package: 8-PDIP
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Package: 8-DIP (0.300", 7.62mm) |
Stock7,888 |
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Xilinx Inc. |
IC SOC CORTEX-A9 ARTIX-7 400BGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 667MHz
- Primary Attributes: Artix?-7 FPGA, 85K Logic Cells
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 400-LFBGA, CSPBGA
- Supplier Device Package: 400-CSPBGA (17x17)
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Package: 400-LFBGA, CSPBGA |
Stock4,208 |
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Xilinx Inc. |
IC FPGA 644 I/O 1517FCBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 600MHz, 1.5GHz
- Primary Attributes: Zynq?UltraScale+? FPGA, 926K+ Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FCBGA (40x40)
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Package: 1517-BBGA, FCBGA |
Stock7,600 |
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Xilinx Inc. |
IC FPGA 464 I/O 1517FCBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 600MHz, 1.5GHz
- Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FCBGA (40x40)
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Package: 1517-BBGA, FCBGA |
Stock4,816 |
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Xilinx Inc. |
IC FPGA 200 I/O 456FBGA
- Number of LABs/CLBs: 384
- Number of Logic Elements/Cells: -
- Total RAM Bits: 442368
- Number of I/O: 200
- Number of Gates: 250000
- Voltage - Supply: 1.425 V ~ 1.575 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 456-BBGA
- Supplier Device Package: 456-FBGA (23x23)
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Package: 456-BBGA |
Stock4,944 |
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Xilinx Inc. |
IC FPGA 1104 I/O 1517FCBGA
- Number of LABs/CLBs: 8448
- Number of Logic Elements/Cells: -
- Total RAM Bits: 2654208
- Number of I/O: 1104
- Number of Gates: 6000000
- Voltage - Supply: 1.425 V ~ 1.575 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FCBGA (40x40)
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Package: 1517-BBGA, FCBGA |
Stock3,616 |
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Xilinx Inc. |
IC FPGA 640 I/O 1136FCBGA
- Number of LABs/CLBs: 7360
- Number of Logic Elements/Cells: 94208
- Total RAM Bits: 8994816
- Number of I/O: 640
- Number of Gates: -
- Voltage - Supply: 0.95 V ~ 1.05 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1136-BBGA, FCBGA
- Supplier Device Package: 1136-FCBGA (35x35)
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Package: 1136-BBGA, FCBGA |
Stock2,208 |
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Xilinx Inc. |
IC FPGA 316 I/O 432MBGA
- Number of LABs/CLBs: 3456
- Number of Logic Elements/Cells: 15552
- Total RAM Bits: 98304
- Number of I/O: 316
- Number of Gates: 661111
- Voltage - Supply: 2.375 V ~ 2.625 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 432-LBGA, Metal
- Supplier Device Package: 432-MBGA (40x40)
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Package: 432-LBGA, Metal |
Stock5,696 |
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Xilinx Inc. |
IC FPGA 316 I/O 432MBGA
- Number of LABs/CLBs: 2400
- Number of Logic Elements/Cells: 10800
- Total RAM Bits: 163840
- Number of I/O: 316
- Number of Gates: 569952
- Voltage - Supply: 1.71 V ~ 1.89 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 432-LBGA, Metal
- Supplier Device Package: 432-MBGA (40x40)
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Package: 432-LBGA, Metal |
Stock7,440 |
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Xilinx Inc. |
IC FPGA 113 I/O 144HQFP
- Number of LABs/CLBs: 576
- Number of Logic Elements/Cells: 1368
- Total RAM Bits: 18432
- Number of I/O: 113
- Number of Gates: 13000
- Voltage - Supply: 3 V ~ 3.6 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 144-LQFP Exposed Pad
- Supplier Device Package: 144-TQFP (20x20)
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Package: 144-LQFP Exposed Pad |
Stock7,648 |
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Xilinx Inc. |
IC FPGA 133 I/O 160QFP
- Number of LABs/CLBs: 324
- Number of Logic Elements/Cells: 1296
- Total RAM Bits: -
- Number of I/O: 133
- Number of Gates: 16000
- Voltage - Supply: 4.75 V ~ 5.25 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 160-BQFP
- Supplier Device Package: 160-PQFP (28x28)
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Package: 160-BQFP |
Stock5,040 |
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Xilinx Inc. |
IC FPGA 640 I/O 1136FCBGA
- Number of LABs/CLBs: 7360
- Number of Logic Elements/Cells: 94208
- Total RAM Bits: 8994816
- Number of I/O: 640
- Number of Gates: -
- Voltage - Supply: 0.95 V ~ 1.05 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1136-BBGA, FCBGA
- Supplier Device Package: 1136-FCBGA (35x35)
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Package: 1136-BBGA, FCBGA |
Stock6,576 |
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Xilinx Inc. |
IC FPGA 480 I/O 1923FCBGA
- Number of LABs/CLBs: 19800
- Number of Logic Elements/Cells: 253440
- Total RAM Bits: 19021824
- Number of I/O: 480
- Number of Gates: -
- Voltage - Supply: 0.95 V ~ 1.05 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1924-BBGA, FCBGA
- Supplier Device Package: 1924-FCBGA (45x45)
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Package: 1924-BBGA, FCBGA |
Stock5,616 |
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Xilinx Inc. |
IC FPGA 400 I/O 676FCBGA
- Number of LABs/CLBs: 31775
- Number of Logic Elements/Cells: 406720
- Total RAM Bits: 29306880
- Number of I/O: 400
- Number of Gates: -
- Voltage - Supply: 0.97 V ~ 1.03 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 676-BBGA, FCBGA
- Supplier Device Package: 676-FCBGA (27x27)
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Package: 676-BBGA, FCBGA |
Stock5,424 |
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Xilinx Inc. |
IC FPGA 256 I/O 676FCBGA
- Number of LABs/CLBs: 27120
- Number of Logic Elements/Cells: 474600
- Total RAM Bits: 35737600
- Number of I/O: 256
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.93 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 676-BBGA, FCBGA
- Supplier Device Package: 676-FCBGA (27x27)
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Package: 676-BBGA, FCBGA |
Stock6,880 |
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Xilinx Inc. |
IC FPGA 240 I/O 484FCBGA
- Number of LABs/CLBs: 5820
- Number of Logic Elements/Cells: 74496
- Total RAM Bits: 5750784
- Number of I/O: 240
- Number of Gates: -
- Voltage - Supply: 0.95 V ~ 1.05 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 484-BBGA, FCBGA
- Supplier Device Package: 484-FCBGA (23x23)
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Package: 484-BBGA, FCBGA |
Stock6,176 |
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Xilinx Inc. |
IC FPGA 448 I/O 668FCBGA
- Number of LABs/CLBs: 2688
- Number of Logic Elements/Cells: 24192
- Total RAM Bits: 1327104
- Number of I/O: 448
- Number of Gates: -
- Voltage - Supply: 1.14 V ~ 1.26 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 668-BBGA, FCBGA
- Supplier Device Package: 668-FCBGA (27x27)
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Package: 668-BBGA, FCBGA |
Stock6,976 |
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Xilinx Inc. |
IC FPGA 400 I/O 676FCBGA
- Number of LABs/CLBs: 12675
- Number of Logic Elements/Cells: 162240
- Total RAM Bits: 11980800
- Number of I/O: 400
- Number of Gates: -
- Voltage - Supply: 0.97 V ~ 1.03 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 676-BBGA, FCBGA
- Supplier Device Package: 676-FCBGA (27x27)
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Package: 676-BBGA, FCBGA |
Stock6,864 |
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Xilinx Inc. |
IC FPGA 204 I/O 672FCBGA
- Number of LABs/CLBs: 352
- Number of Logic Elements/Cells: 3168
- Total RAM Bits: 221184
- Number of I/O: 204
- Number of Gates: -
- Voltage - Supply: 1.425 V ~ 1.575 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 672-BBGA, FCBGA
- Supplier Device Package: 672-FCBGA (27x27)
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Package: 672-BBGA, FCBGA |
Stock5,088 |
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Xilinx Inc. |
IC FPGA 140 I/O 208QFP
- Number of LABs/CLBs: 864
- Number of Logic Elements/Cells: 3888
- Total RAM Bits: 49152
- Number of I/O: 140
- Number of Gates: 150000
- Voltage - Supply: 2.375 V ~ 2.625 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 208-BFQFP
- Supplier Device Package: 208-PQFP (28x28)
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Package: 208-BFQFP |
Stock8,352 |
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Xilinx Inc. |
IC FPGA 186 I/O 256FTBGA
- Number of LABs/CLBs: 715
- Number of Logic Elements/Cells: 9152
- Total RAM Bits: 589824
- Number of I/O: 186
- Number of Gates: -
- Voltage - Supply: 1.14 V ~ 1.26 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 256-LBGA
- Supplier Device Package: 256-FTBGA (17x17)
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Package: 256-LBGA |
Stock3,152 |
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Xilinx Inc. |
IC FPGA 440 I/O 676FCBGA
- Number of LABs/CLBs: 3600
- Number of Logic Elements/Cells: 46080
- Total RAM Bits: 1769472
- Number of I/O: 440
- Number of Gates: -
- Voltage - Supply: 0.95 V ~ 1.05 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 676-BBGA, FCBGA
- Supplier Device Package: 676-FCBGA (27x27)
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Package: 676-BBGA, FCBGA |
Stock6,016 |
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Xilinx Inc. |
IC CPLD 36MC 15NS 44VQFP
- Programmable Type: In System Programmable (min 10K program/erase cycles)
- Delay Time tpd(1) Max: 15.0ns
- Voltage Supply - Internal: 4.75 V ~ 5.25 V
- Number of Logic Elements/Blocks: 2
- Number of Macrocells: 36
- Number of Gates: 800
- Number of I/O: 34
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 44-TQFP
- Supplier Device Package: 44-VQFP (10x10)
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Package: 44-TQFP |
Stock71,124 |
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Xilinx Inc. |
IC CPLD 384MC 9NS 324FBGA
- Programmable Type: In System Programmable (min 1K program/erase cycles)
- Delay Time tpd(1) Max: 9.0ns
- Voltage Supply - Internal: 3 V ~ 3.6 V
- Number of Logic Elements/Blocks: 24
- Number of Macrocells: 384
- Number of Gates: 9000
- Number of I/O: 220
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 324-BBGA
- Supplier Device Package: 324-FBGA (23x23)
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Package: 324-BBGA |
Stock7,936 |
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Xilinx Inc. |
IC CPLD 384MC 9.2NS 144TQFP
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 9.2ns
- Voltage Supply - Internal: 1.7 V ~ 1.9 V
- Number of Logic Elements/Blocks: 24
- Number of Macrocells: 384
- Number of Gates: 9000
- Number of I/O: 118
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 144-LQFP
- Supplier Device Package: 144-TQFP (20x20)
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Package: 144-LQFP |
Stock5,360 |
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Xilinx Inc. |
IC CPLD 288MC 10NS 208QFP
- Programmable Type: In System Programmable (min 10K program/erase cycles)
- Delay Time tpd(1) Max: 10.0ns
- Voltage Supply - Internal: 3 V ~ 3.6 V
- Number of Logic Elements/Blocks: 16
- Number of Macrocells: 288
- Number of Gates: 6400
- Number of I/O: 168
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 208-BFQFP
- Supplier Device Package: 208-PQFP (28x28)
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Package: 208-BFQFP |
Stock6,012 |
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Xilinx Inc. |
XAZU2EG-1SFVA625Q
- Architecture: -
- Core Processor: -
- Flash Size: -
- RAM Size: -
- Peripherals: -
- Connectivity: -
- Speed: -
- Primary Attributes: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock5,952 |
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