Page 145 - Xilinx Inc. Products | Heisener Electronics

XC17S200AVOG8I
Xilinx Inc.

IC PROM SERIAL 200K 8-SOIC

Package: 8-SOIC (0.154", 3.90mm Width)

Stock67,884
XC1765ELVO8I
Xilinx Inc.

IC PROM SER I-TEMP 3.3V 8-SOIC

Package: 8-SOIC (0.154", 3.90mm Width)

Stock3,248
XCZU19EG-2FFVD1760I
Xilinx Inc.

IC FPGA 308 I/O 1760FCBGA

Package: 1760-BBGA, FCBGA

Stock2,304
XCZU4EV-2FBVB900I
Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

Package: 900-BBGA, FCBGA

Stock2,768
XC6SLX75-N3FG484I
Xilinx Inc.

IC FPGA 280 I/O 484FBGA

Package: 484-BBGA

Stock2,624
XC6SLX45-N3FG484C
Xilinx Inc.

IC FPGA 316 I/O 484FBGA

Package: 484-BBGA

Stock5,328
XC6SLX150T-N3FG900C
Xilinx Inc.

IC FPGA 540 I/O 900FBGA

Package: 900-BBGA

Stock6,320
XC6SLX45-2FGG484CES
Xilinx Inc.

IC FPGA 316 I/O 484FBGA

Package: 484-BBGA

Stock7,648
XCV2000E-7FG860I
Xilinx Inc.

IC FPGA 660 I/O 860FBGA

Package: 860-BGA

Stock6,528
XCV100-4FG256I
Xilinx Inc.

IC FPGA 176 I/O 256FBGA

Package: 256-BGA

Stock4,992
XCS30XL-4CS280C
Xilinx Inc.

IC FPGA 192 I/O 280CSBGA

Package: 280-TFBGA, CSPBGA

Stock10,080
XC4044XL-3HQ208C
Xilinx Inc.

IC FPGA 160 I/O 208HQFP

Package: 208-BFQFP Exposed Pad

Stock3,936
XC3164A-3TQ144C
Xilinx Inc.

IC FPGA 120 I/O 144TQFP

Package: 144-LQFP

Stock3,568
XC2VP100-6FFG1696I
Xilinx Inc.

IC FPGA 1164 I/O 1696FCBGA

Package: 1696-BBGA, FCBGA

Stock6,464
XCKU115-1FLVB1760C
Xilinx Inc.

IC FPGA 702 I/O 1760FCBGA

Package: 1760-BBGA, FCBGA

Stock6,848
XC5VLX110-2FFG1153I
Xilinx Inc.

IC FPGA 800 I/O 1153FCBGA

Package: 1153-BBGA, FCBGA

Stock42,828
XC6VLX195T-2FFG1156I
Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

Package: 1156-BBGA, FCBGA

Stock3,808
XC5VSX50T-2FFG1136C
Xilinx Inc.

IC FPGA 480 I/O 1136FCBGA

Package: 1136-BBGA, FCBGA

Stock3,600
XC4VLX40-11FF668I
Xilinx Inc.

IC FPGA 448 I/O 668FCBGA

Package: 668-BBGA, FCBGA

Stock7,552
XC2VP20-5FF896C
Xilinx Inc.

IC FPGA 556 I/O 896FCBGA

Package: 896-BBGA, FCBGA

Stock17,400

Part Number	Manufacturer	Description	Package	Stock
XC17S200AVOG8I	Xilinx Inc.	IC PROM SERIAL 200K 8-SOIC Programmable Type: OTP Memory Size: 2Mb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-TSOP	Package: 8-SOIC (0.154", 3.90mm Width)	Stock67,884
XC1765ELVO8I	Xilinx Inc.	IC PROM SER I-TEMP 3.3V 8-SOIC Programmable Type: OTP Memory Size: 65kb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-TSOP	Package: 8-SOIC (0.154", 3.90mm Width)	Stock3,248
XCZU19EG-2FFVD1760I	Xilinx Inc.	IC FPGA 308 I/O 1760FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 1143K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5)	Package: 1760-BBGA, FCBGA	Stock2,304
XCZU4EV-2FBVB900I	Xilinx Inc.	IC FPGA 204 I/O 900FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	Package: 900-BBGA, FCBGA	Stock2,768
XC6SLX75-N3FG484I	Xilinx Inc.	IC FPGA 280 I/O 484FBGA Number of LABs/CLBs: 5831 Number of Logic Elements/Cells: 74637 Total RAM Bits: 3170304 Number of I/O: 280 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	Package: 484-BBGA	Stock2,624
XC6SLX45-N3FG484C	Xilinx Inc.	IC FPGA 316 I/O 484FBGA Number of LABs/CLBs: 3411 Number of Logic Elements/Cells: 43661 Total RAM Bits: 2138112 Number of I/O: 316 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	Package: 484-BBGA	Stock5,328
XC6SLX150T-N3FG900C	Xilinx Inc.	IC FPGA 540 I/O 900FBGA Number of LABs/CLBs: 11519 Number of Logic Elements/Cells: 147443 Total RAM Bits: 4939776 Number of I/O: 540 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 900-BBGA Supplier Device Package: 900-FBGA (31x31)	Package: 900-BBGA	Stock6,320
XC6SLX45-2FGG484CES	Xilinx Inc.	IC FPGA 316 I/O 484FBGA Number of LABs/CLBs: 3411 Number of Logic Elements/Cells: 43661 Total RAM Bits: 2138112 Number of I/O: 316 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	Package: 484-BBGA	Stock7,648
XCV2000E-7FG860I	Xilinx Inc.	IC FPGA 660 I/O 860FBGA Number of LABs/CLBs: 9600 Number of Logic Elements/Cells: 43200 Total RAM Bits: 655360 Number of I/O: 660 Number of Gates: 2541952 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 860-BGA Supplier Device Package: 860-FBGA (42.5x42.5)	Package: 860-BGA	Stock6,528
XCV100-4FG256I	Xilinx Inc.	IC FPGA 176 I/O 256FBGA Number of LABs/CLBs: 600 Number of Logic Elements/Cells: 2700 Total RAM Bits: 40960 Number of I/O: 176 Number of Gates: 108904 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	Package: 256-BGA	Stock4,992
XCS30XL-4CS280C	Xilinx Inc.	IC FPGA 192 I/O 280CSBGA Number of LABs/CLBs: 576 Number of Logic Elements/Cells: 1368 Total RAM Bits: 18432 Number of I/O: 192 Number of Gates: 30000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 280-TFBGA, CSPBGA Supplier Device Package: 280-CSBGA (16x16)	Package: 280-TFBGA, CSPBGA	Stock10,080
XC4044XL-3HQ208C	Xilinx Inc.	IC FPGA 160 I/O 208HQFP Number of LABs/CLBs: 1600 Number of Logic Elements/Cells: 3800 Total RAM Bits: 51200 Number of I/O: 160 Number of Gates: 44000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 208-BFQFP Exposed Pad Supplier Device Package: 208-PQFP (28x28)	Package: 208-BFQFP Exposed Pad	Stock3,936
XC3164A-3TQ144C	Xilinx Inc.	IC FPGA 120 I/O 144TQFP Number of LABs/CLBs: 224 Number of Logic Elements/Cells: - Total RAM Bits: 46064 Number of I/O: 120 Number of Gates: 4500 Voltage - Supply: 4.25 V ~ 5.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	Package: 144-LQFP	Stock3,568
XC2VP100-6FFG1696I	Xilinx Inc.	IC FPGA 1164 I/O 1696FCBGA Number of LABs/CLBs: 11024 Number of Logic Elements/Cells: 99216 Total RAM Bits: 8183808 Number of I/O: 1164 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1696-BBGA, FCBGA Supplier Device Package: 1696-FCBGA (42.5x42.5)	Package: 1696-BBGA, FCBGA	Stock6,464
XCKU115-1FLVB1760C	Xilinx Inc.	IC FPGA 702 I/O 1760FCBGA Number of LABs/CLBs: 82920 Number of Logic Elements/Cells: 1451100 Total RAM Bits: 77721600 Number of I/O: 702 Number of Gates: - Voltage - Supply: 0.922 V ~ 0.979 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5)	Package: 1760-BBGA, FCBGA	Stock6,848
XC5VLX110-2FFG1153I	Xilinx Inc.	IC FPGA 800 I/O 1153FCBGA Number of LABs/CLBs: 8640 Number of Logic Elements/Cells: 110592 Total RAM Bits: 4718592 Number of I/O: 800 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1153-BBGA, FCBGA Supplier Device Package: 1153-FCBGA (35x35)	Package: 1153-BBGA, FCBGA	Stock42,828
XC6VLX195T-2FFG1156I	Xilinx Inc.	IC FPGA 600 I/O 1156FCBGA Number of LABs/CLBs: 15600 Number of Logic Elements/Cells: 199680 Total RAM Bits: 12681216 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	Package: 1156-BBGA, FCBGA	Stock3,808
XC5VSX50T-2FFG1136C	Xilinx Inc.	IC FPGA 480 I/O 1136FCBGA Number of LABs/CLBs: 4080 Number of Logic Elements/Cells: 52224 Total RAM Bits: 4866048 Number of I/O: 480 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1136-BBGA, FCBGA Supplier Device Package: 1136-FCBGA (35x35)	Package: 1136-BBGA, FCBGA	Stock3,600
XC4VLX40-11FF668I	Xilinx Inc.	IC FPGA 448 I/O 668FCBGA Number of LABs/CLBs: 4608 Number of Logic Elements/Cells: 41472 Total RAM Bits: 1769472 Number of I/O: 448 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 668-BBGA, FCBGA Supplier Device Package: 668-FCBGA (27x27)	Package: 668-BBGA, FCBGA	Stock7,552
XC2VP20-5FF896C	Xilinx Inc.	IC FPGA 556 I/O 896FCBGA Number of LABs/CLBs: 2320 Number of Logic Elements/Cells: 20880 Total RAM Bits: 1622016 Number of I/O: 556 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FCBGA (31x31)	Package: 896-BBGA, FCBGA	Stock17,400
XC4VLX25-10FFG668I	Xilinx Inc.	IC FPGA 448 I/O 668FCBGA Number of LABs/CLBs: 2688 Number of Logic Elements/Cells: 24192 Total RAM Bits: 1327104 Number of I/O: 448 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 668-BBGA, FCBGA Supplier Device Package: 668-FCBGA (27x27)	Package: 668-BBGA, FCBGA	Stock36,732
XC4VLX15-10FF676I	Xilinx Inc.	IC FPGA 320 I/O 676FCBGA Number of LABs/CLBs: 1536 Number of Logic Elements/Cells: 13824 Total RAM Bits: 884736 Number of I/O: 320 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	Package: 676-BBGA, FCBGA	Stock7,168
XC3S50A-5FTG256C	Xilinx Inc.	IC FPGA 144 I/O 256FTBGA Number of LABs/CLBs: 176 Number of Logic Elements/Cells: 1584 Total RAM Bits: 55296 Number of I/O: 144 Number of Gates: 50000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	Package: 256-LBGA	Stock17,532
XC6SLX9-2TQG144C	Xilinx Inc.	IC FPGA 102 I/O 144TQFP Number of LABs/CLBs: 715 Number of Logic Elements/Cells: 9152 Total RAM Bits: 589824 Number of I/O: 102 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	Package: 144-LQFP	Stock10,356
XC95216-10HQ208C	Xilinx Inc.	IC CPLD 216MC 10NS 208HQFP Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 12 Number of Macrocells: 216 Number of Gates: 4800 Number of I/O: 166 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 208-BFQFP Exposed Pad Supplier Device Package: 208-PQFP (28x28)	Package: 208-BFQFP Exposed Pad	Stock4,672
XC95144-15PQ100I	Xilinx Inc.	IC CPLD 144MC 15NS 100QFP Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 15.0ns Voltage Supply - Internal: 4.5 V ~ 5.5 V Number of Logic Elements/Blocks: 8 Number of Macrocells: 144 Number of Gates: 3200 Number of I/O: 81 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 100-BQFP Supplier Device Package: 100-PQFP (14x20)	Package: 100-BQFP	Stock5,136
XCR3256XL-10CS280I	Xilinx Inc.	IC CPLD 256MC 9NS 280CSP Programmable Type: In System Programmable (min 1K program/erase cycles) Delay Time tpd(1) Max: 9.1ns Voltage Supply - Internal: 2.7 V ~ 3.6 V Number of Logic Elements/Blocks: 16 Number of Macrocells: 256 Number of Gates: 6000 Number of I/O: 164 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 280-TFBGA, CSPBGA Supplier Device Package: 280-CSBGA (16x16)	Package: 280-TFBGA, CSPBGA	Stock4,336
XCR3064XL-7CP56I	Xilinx Inc.	IC CPLD 64MC 7NS 56CSP Programmable Type: In System Programmable (min 1K program/erase cycles) Delay Time tpd(1) Max: 7.0ns Voltage Supply - Internal: 2.7 V ~ 3.6 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 64 Number of Gates: 1500 Number of I/O: 48 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 56-LFBGA, CSPBGA Supplier Device Package: 56-CSBGA (6x6)	Package: 56-LFBGA, CSPBGA	Stock6,672