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Microchip Technology |
IC COMP PP I/O SNGL 1.6V 8MSOP
- Type: General Purpose
- Number of Elements: 1
- Output Type: CMOS, Push-Pull, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): -
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-MSOP
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Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock5,056 |
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1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
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Microchip Technology |
IC COMP 1.6V SNGL O-D 8DIP
- Type: General Purpose
- Number of Elements: 1
- Output Type: CMOS, Open-Drain, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): 30mA
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 8-DIP (0.300", 7.62mm)
- Mounting Type: Through Hole
- Supplier Device Package: 8-PDIP
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Package: 8-DIP (0.300", 7.62mm) |
Stock7,664 |
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1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-DIP (0.300", 7.62mm) | Through Hole | 8-PDIP |
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Microchip Technology |
IC COMP 1.6V SGL P-P 8-MSOP
- Type: General Purpose
- Number of Elements: 1
- Output Type: CMOS, Push-Pull, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): -
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-MSOP
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Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock4,384 |
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1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
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Microchip Technology |
IC COMP 1.6V SNGL O-D 8MSOP
- Type: General Purpose
- Number of Elements: 1
- Output Type: CMOS, Open-Drain, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): 30mA
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-MSOP
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Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock6,304 |
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1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
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Microchip Technology |
IC COMP 1.6V SNGL P-P 8MSOP
- Type: General Purpose
- Number of Elements: 1
- Output Type: CMOS, Push-Pull, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): -
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-MSOP
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Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock6,272 |
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1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
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Microchip Technology |
IC COMP 1.6V SNGL O-D 8SOIC
- Type: General Purpose
- Number of Elements: 1
- Output Type: CMOS, Open-Drain, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): 30mA
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-SOIC
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock7,232 |
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1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
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Microchip Technology |
IC COMP 1.6V SNGL O-D 8SOIC
- Type: General Purpose
- Number of Elements: 1
- Output Type: CMOS, Open-Drain, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): 30mA
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-SOIC
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock4,976 |
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1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
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Microchip Technology |
IC COMP 1.6V SNGL P-P 8SOIC
- Type: General Purpose
- Number of Elements: 1
- Output Type: CMOS, Push-Pull, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): -
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-SOIC
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock5,008 |
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1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
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Microchip Technology |
IC COMP OPENDRN 1.6V SNGL 8-SOIC
- Type: General Purpose
- Number of Elements: 1
- Output Type: CMOS, Open-Drain, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): 30mA
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-SOIC
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock2,960 |
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1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
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Microchip Technology |
IC COMP PP I/O SNGL 1.6V 8SOIC
- Type: General Purpose
- Number of Elements: 1
- Output Type: CMOS, Push-Pull, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): -
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-SOIC
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock109,236 |
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1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
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Microchip Technology |
IC COMP OPENDRN 1.6V SNGL 8-MSOP
- Type: General Purpose
- Number of Elements: 1
- Output Type: CMOS, Open-Drain, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): 30mA
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-MSOP
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Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock7,344 |
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1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
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Microchip Technology |
IC COMP PP I/O SNGL 1.6V 8MSOP
- Type: General Purpose
- Number of Elements: 1
- Output Type: CMOS, Push-Pull, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): -
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-MSOP
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Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock15,420 |
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1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
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Microchip Technology |
IC COMP PP I/O SNGL 1.6V 8SOIC
- Type: General Purpose
- Number of Elements: 1
- Output Type: CMOS, Push-Pull, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): -
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-SOIC
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock121,656 |
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1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
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Microchip Technology |
IC COMP PP I/O SNGL 1.6V 8DIP
- Type: General Purpose
- Number of Elements: 1
- Output Type: CMOS, Push-Pull, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): -
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 8-DIP (0.300", 7.62mm)
- Mounting Type: Through Hole
- Supplier Device Package: 8-PDIP
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Package: 8-DIP (0.300", 7.62mm) |
Stock38,568 |
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1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | Through Hole | 8-PDIP |
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Microchip Technology |
IC COMP OPENDRN 1.6V SNGL 8-DIP
- Type: General Purpose
- Number of Elements: 1
- Output Type: CMOS, Open-Drain, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): 30mA
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 8-DIP (0.300", 7.62mm)
- Mounting Type: Through Hole
- Supplier Device Package: 8-PDIP
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Package: 8-DIP (0.300", 7.62mm) |
Stock4,032 |
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1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | Through Hole | 8-PDIP |
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Microchip Technology |
IC COMP PP I/O SNGL 1.6V 8MSOP
- Type: General Purpose
- Number of Elements: 1
- Output Type: CMOS, Push-Pull, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): -
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-MSOP
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Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock4,576 |
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1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
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Microchip Technology |
IC COMP 1.6V SNGL O-D SC70-5
- Type: General Purpose
- Number of Elements: 1
- Output Type: CMOS, Open-Drain, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): 30mA
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 5-TSSOP, SC-70-5, SOT-353
- Mounting Type: Surface Mount
- Supplier Device Package: SC-70-5
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Package: 5-TSSOP, SC-70-5, SOT-353 |
Stock5,600 |
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1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 5-TSSOP, SC-70-5, SOT-353 | Surface Mount | SC-70-5 |
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Microchip Technology |
IC COMP OPENDRN 1.6V SGL SOT23-5
- Type: General Purpose
- Number of Elements: 1
- Output Type: CMOS, Open-Drain, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): 30mA
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 85°C
- Package / Case: SC-74A, SOT-753
- Mounting Type: Surface Mount
- Supplier Device Package: SOT-23-5
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Package: SC-74A, SOT-753 |
Stock5,296 |
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1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | SC-74A, SOT-753 | Surface Mount | SOT-23-5 |
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|
Microchip Technology |
IC COMP 1.6V DUAL O-D 8SOIC
- Type: General Purpose
- Number of Elements: 2
- Output Type: CMOS, Open-Drain, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): 30mA
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock7,536 |
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2 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
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Microchip Technology |
IC COMP PUSH-PULL 1.8V SC70-5
- Type: General Purpose
- Number of Elements: 1
- Output Type: CMOS, Push-Pull, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.8 V ~ 5.5 V
- Voltage - Input Offset (Max): 10mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): 50mA
- Current - Quiescent (Max): 130µA
- CMRR, PSRR (Typ): 66dB CMRR, 70dB PSRR
- Propagation Delay (Max): 80ns
- Hysteresis: 5mV
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 5-TSSOP, SC-70-5, SOT-353
- Mounting Type: Surface Mount
- Supplier Device Package: SC-70-5
|
Package: 5-TSSOP, SC-70-5, SOT-353 |
Stock59,472 |
|
1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.8 V ~ 5.5 V | 10mV @ 5.5V | 1pA @ 5.5V | 50mA | 130µA | 66dB CMRR, 70dB PSRR | 80ns | 5mV | -40°C ~ 125°C | 5-TSSOP, SC-70-5, SOT-353 | Surface Mount | SC-70-5 |
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Microchip Technology |
IC COMP PP I/O DUAL 1.6V 8SOIC
- Type: General Purpose
- Number of Elements: 2
- Output Type: CMOS, Push-Pull, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): -
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock546,264 |
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2 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
|
|
Microchip Technology |
IC COMP 1.6V SNGL O-D SOT23-5
- Type: General Purpose
- Number of Elements: 1
- Output Type: CMOS, Open-Drain, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): 30mA
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 125°C
- Package / Case: SC-74A, SOT-753
- Mounting Type: Surface Mount
- Supplier Device Package: SOT-23-5
|
Package: SC-74A, SOT-753 |
Stock15,924 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | SC-74A, SOT-753 | Surface Mount | SOT-23-5 |
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|
Microchip Technology |
IC COMP QUAD 1.8V OD 14-TSSOP
- Type: General Purpose
- Number of Elements: 4
- Output Type: CMOS, Open-Drain
- Voltage - Supply, Single/Dual (±): 1.8 V ~ 5.5 V
- Voltage - Input Offset (Max): 10mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): 50mA
- Current - Quiescent (Max): 130µA
- CMRR, PSRR (Typ): 66dB CMRR, 70dB PSRR
- Propagation Delay (Max): 80ns
- Hysteresis: 5mV
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 14-TSSOP (0.173", 4.40mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 14-TSSOP
|
Package: 14-TSSOP (0.173", 4.40mm Width) |
Stock6,416 |
|
4 | CMOS, Open-Drain | 1.8 V ~ 5.5 V | 10mV @ 5.5V | 1pA @ 5.5V | 50mA | 130µA | 66dB CMRR, 70dB PSRR | 80ns | 5mV | -40°C ~ 125°C | 14-TSSOP (0.173", 4.40mm Width) | Surface Mount | 14-TSSOP |
|
|
Microchip Technology |
IC COMP QUAD 1.8V PP 14-SOIC
- Type: General Purpose
- Number of Elements: 4
- Output Type: CMOS, Push-Pull, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.8 V ~ 5.5 V
- Voltage - Input Offset (Max): 10mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): 50mA
- Current - Quiescent (Max): 130µA
- CMRR, PSRR (Typ): 66dB CMRR, 70dB PSRR
- Propagation Delay (Max): 80ns
- Hysteresis: 5mV
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 14-SOIC (0.154", 3.90mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 14-SOIC
|
Package: 14-SOIC (0.154", 3.90mm Width) |
Stock6,132 |
|
4 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.8 V ~ 5.5 V | 10mV @ 5.5V | 1pA @ 5.5V | 50mA | 130µA | 66dB CMRR, 70dB PSRR | 80ns | 5mV | -40°C ~ 125°C | 14-SOIC (0.154", 3.90mm Width) | Surface Mount | 14-SOIC |
|
|
Microchip Technology |
IC COMP 1.6V QUAD P-P 14SOIC
- Type: General Purpose
- Number of Elements: 4
- Output Type: CMOS, Push-Pull, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): -
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 14-SOIC (0.154", 3.90mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 14-SOIC
|
Package: 14-SOIC (0.154", 3.90mm Width) |
Stock7,488 |
|
4 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 14-SOIC (0.154", 3.90mm Width) | Surface Mount | 14-SOIC |
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Microchip Technology |
IC COMP OPENDRN 1.6V QUAD 14SOIC
- Type: General Purpose
- Number of Elements: 4
- Output Type: CMOS, Open-Drain, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): 30mA
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 14-SOIC (0.154", 3.90mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 14-SOIC
|
Package: 14-SOIC (0.154", 3.90mm Width) |
Stock4,576 |
|
4 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 14-SOIC (0.154", 3.90mm Width) | Surface Mount | 14-SOIC |
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|
Microchip Technology |
IC COMP PP I/O DUAL 1.6V 8SOIC
- Type: General Purpose
- Number of Elements: 2
- Output Type: CMOS, Push-Pull, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): -
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock301,668 |
|
2 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
|
|
Microchip Technology |
IC COMP 1.6V QUAD P-P 14DIP
- Type: General Purpose
- Number of Elements: 4
- Output Type: CMOS, Push-Pull, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): -
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 14-DIP (0.300", 7.62mm)
- Mounting Type: Through Hole
- Supplier Device Package: 14-PDIP
|
Package: 14-DIP (0.300", 7.62mm) |
Stock11,304 |
|
4 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 14-DIP (0.300", 7.62mm) | Through Hole | 14-PDIP |