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Microchip Technology |
IC COMP 1.6V DUAL P-P 8MSOP
- Type: General Purpose
- Number of Elements: 2
- Output Type: CMOS, Push-Pull, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): -
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-MSOP
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Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock3,920 |
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2 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
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Microchip Technology |
IC COMP 1.6V DUAL O-D 8SOIC
- Type: General Purpose
- Number of Elements: 2
- Output Type: CMOS, Open-Drain, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): 30mA
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-SOIC
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock4,944 |
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2 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
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Microchip Technology |
IC COMP 1.6V DUAL P-P 8SOIC
- Type: General Purpose
- Number of Elements: 2
- Output Type: CMOS, Push-Pull, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): -
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-SOIC
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock2,272 |
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2 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
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Microchip Technology |
IC COMP 1.6V DUAL O-D 8DIP
- Type: General Purpose
- Number of Elements: 2
- Output Type: CMOS, Open-Drain, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): 30mA
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 8-DIP (0.300", 7.62mm)
- Mounting Type: Through Hole
- Supplier Device Package: 8-PDIP
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Package: 8-DIP (0.300", 7.62mm) |
Stock2,320 |
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2 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-DIP (0.300", 7.62mm) | Through Hole | 8-PDIP |
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Microchip Technology |
IC COMP OPENDRN 1.6V DUAL 8-SOIC
- Type: General Purpose
- Number of Elements: 2
- Output Type: CMOS, Open-Drain, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): 30mA
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-SOIC
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock29,580 |
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2 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
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Microchip Technology |
IC COMP OPENDRN 1.6V DUAL 8-MSOP
- Type: General Purpose
- Number of Elements: 2
- Output Type: CMOS, Open-Drain, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): 30mA
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-MSOP
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Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock200,328 |
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2 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
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Microchip Technology |
IC COMP PUSHPULL 1.6V DUAL 8-DIP
- Type: General Purpose
- Number of Elements: 2
- Output Type: CMOS, Push-Pull, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): -
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 8-DIP (0.300", 7.62mm)
- Mounting Type: Through Hole
- Supplier Device Package: 8-PDIP
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Package: 8-DIP (0.300", 7.62mm) |
Stock17,436 |
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2 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | Through Hole | 8-PDIP |
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Microchip Technology |
IC COMP OPENDRN 1.6V DUAL 8-DIP
- Type: General Purpose
- Number of Elements: 2
- Output Type: CMOS, Open-Drain, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): 30mA
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 8-DIP (0.300", 7.62mm)
- Mounting Type: Through Hole
- Supplier Device Package: 8-PDIP
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Package: 8-DIP (0.300", 7.62mm) |
Stock3,136 |
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2 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | Through Hole | 8-PDIP |
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Microchip Technology |
IC COMP PUSHPULL 1.6V DUAL 8MSOP
- Type: General Purpose
- Number of Elements: 2
- Output Type: CMOS, Push-Pull, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): -
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-MSOP
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Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock32,904 |
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2 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
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Microchip Technology |
IC COMP OPENDRN 1.6V DUAL 8-MSOP
- Type: General Purpose
- Number of Elements: 2
- Output Type: CMOS, Open-Drain, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): 30mA
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-MSOP
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Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock235,908 |
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2 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
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Microchip Technology |
IC COMP SNGL W/REF SC70-5
- Type: with Voltage Reference
- Number of Elements: 1
- Output Type: Open Drain
- Voltage - Supply, Single/Dual (±): 1.5 V ~ 5.5 V
- Voltage - Input Offset (Max): -
- Current - Input Bias (Max): -
- Current - Output (Typ): 20mA
- Current - Quiescent (Max): 3µA
- CMRR, PSRR (Typ): -
- Propagation Delay (Max): 12µs
- Hysteresis: 20mV
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 5-TSSOP, SC-70-5, SOT-353
- Mounting Type: Surface Mount
- Supplier Device Package: SC-70-5
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Package: 5-TSSOP, SC-70-5, SOT-353 |
Stock6,192 |
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1 | Open Drain | 1.5 V ~ 5.5 V | - | - | 20mA | 3µA | - | 12µs | 20mV | -40°C ~ 85°C | 5-TSSOP, SC-70-5, SOT-353 | Surface Mount | SC-70-5 |
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Microchip Technology |
IC COMP 1.6V SGL P-P W/CS 8-SOIC
- Type: General Purpose
- Number of Elements: 1
- Output Type: CMOS, Push-Pull, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): -
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-SOIC
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock2,496 |
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1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
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Microchip Technology |
IC COMP 1.6V SNGL P-P W/CS 8MSOP
- Type: General Purpose
- Number of Elements: 1
- Output Type: CMOS, Push-Pull, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): -
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-MSOP
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Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock2,384 |
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1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
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Microchip Technology |
IC COMP 1.6V SNGL P-P W/CS 8MSOP
- Type: General Purpose
- Number of Elements: 1
- Output Type: CMOS, Push-Pull, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): -
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-MSOP
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Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock19,188 |
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1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
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Microchip Technology |
IC COMP 1.6V SNGL O-D W/CS 8MSOP
- Type: General Purpose
- Number of Elements: 1
- Output Type: CMOS, Open-Drain, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): 30mA
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-MSOP
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Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock6,944 |
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1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
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Microchip Technology |
IC COMP 1.6V SGL O-D W/CS 8MSOP
- Type: General Purpose
- Number of Elements: 1
- Output Type: CMOS, Open-Drain, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): 30mA
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-MSOP
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Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock5,072 |
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1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
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Microchip Technology |
IC COMP 1.6V SNGL P-P W/CS 8SOIC
- Type: General Purpose
- Number of Elements: 1
- Output Type: CMOS, Push-Pull, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): -
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock17,700 |
|
1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
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Microchip Technology |
IC COMP 1.6V SNGL P-P W/CS 8DIP
- Type: General Purpose
- Number of Elements: 1
- Output Type: CMOS, Push-Pull, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): -
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 8-DIP (0.300", 7.62mm)
- Mounting Type: Through Hole
- Supplier Device Package: 8-PDIP
|
Package: 8-DIP (0.300", 7.62mm) |
Stock4,304 |
|
1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-DIP (0.300", 7.62mm) | Through Hole | 8-PDIP |
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Microchip Technology |
IC COMP 1.6V SGL O-D W/CS 8SOIC
- Type: General Purpose
- Number of Elements: 1
- Output Type: CMOS, Open-Drain, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): 30mA
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock2,352 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
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Microchip Technology |
IC COMP 1.6V SNGL O-D W/CS 8SOIC
- Type: General Purpose
- Number of Elements: 1
- Output Type: CMOS, Open-Drain, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): 30mA
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock5,392 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
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Microchip Technology |
IC COMP OPENDRN 1.6V SNGL 8-SOIC
- Type: General Purpose
- Number of Elements: 1
- Output Type: CMOS, Open-Drain, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): 30mA
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock7,872 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
|
|
Microchip Technology |
IC COMP PP I/O SNGL 1.6V 8SOIC
- Type: General Purpose
- Number of Elements: 1
- Output Type: CMOS, Push-Pull, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): -
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock3,840 |
|
1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
|
|
Microchip Technology |
IC COMP PP I/O SNGL 1.6V 8MSOP
- Type: General Purpose
- Number of Elements: 1
- Output Type: CMOS, Push-Pull, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): -
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-MSOP
|
Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock6,640 |
|
1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
|
|
Microchip Technology |
IC COMP OPENDRN 1.6V SNGL 8-MSOP
- Type: General Purpose
- Number of Elements: 1
- Output Type: CMOS, Open-Drain, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): 30mA
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-MSOP
|
Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock7,776 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
|
|
Microchip Technology |
IC COMP OPENDRN 1.6V SNGL 8-SOIC
- Type: General Purpose
- Number of Elements: 1
- Output Type: CMOS, Open-Drain, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): 30mA
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock12,132 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
|
|
Microchip Technology |
IC COMP PP I/O SNGL 1.6V 8SOIC
- Type: General Purpose
- Number of Elements: 1
- Output Type: CMOS, Push-Pull, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): -
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock31,272 |
|
1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
|
|
Microchip Technology |
IC COMP OPENDRN 1.6V SNGL 8-DIP
- Type: General Purpose
- Number of Elements: 1
- Output Type: CMOS, Open-Drain, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): 30mA
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 8-DIP (0.300", 7.62mm)
- Mounting Type: Through Hole
- Supplier Device Package: 8-PDIP
|
Package: 8-DIP (0.300", 7.62mm) |
Stock3,776 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | Through Hole | 8-PDIP |
|
|
Microchip Technology |
IC COMP PP I/O SNGL 1.6V 8DIP
- Type: General Purpose
- Number of Elements: 1
- Output Type: CMOS, Push-Pull, Rail-to-Rail, TTL
- Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
- Voltage - Input Offset (Max): 7mV @ 5.5V
- Current - Input Bias (Max): 1pA @ 5.5V
- Current - Output (Typ): -
- Current - Quiescent (Max): 1µA
- CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
- Propagation Delay (Max): 8µs
- Hysteresis: 6.5mV
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 8-DIP (0.300", 7.62mm)
- Mounting Type: Through Hole
- Supplier Device Package: 8-PDIP
|
Package: 8-DIP (0.300", 7.62mm) |
Stock5,088 |
|
1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | Through Hole | 8-PDIP |