Page 129 - NXP Products - Embedded - Microcontrollers

SPC5673FK0MVR2
NXP

3M FLASH 256K RAM Z7 200MHZ

Package: 416-BBGA

Stock3,888
SPC5673FF3MVR2
NXP

NXP 32-BIT MCU POWER ARCH CORE

Package: 416-BBGA

Stock7,456
SPC5566MZP80
NXP

NXP 32-BIT MCU POWER ARCH CORE

Package: 416-BBGA

Stock4,272
SPC5673FK0MVR2R
NXP

3M FLASH 256K RAM Z7 200MHZ

Package: 416-BBGA

Stock9,672
SPC5673FF3MVR2R
NXP

NXP 32-BIT MCU POWER ARCH CORE

Package: 416-BBGA

Stock4,032
SPC5566MZP80R
NXP

NXP 32-BIT MCU POWER ARCH CORE

Package: 416-BBGA

Stock6,240
SPC5554MVR132
NXP

NXP 32-BIT MCU POWER ARCH CORE

Package: 416-BBGA

Stock5,616
SPC5777MK0MVA8R
NXP

NXP 32-BIT MCU QUAD POWER ARCH

Package: 512-FBGA

Stock7,728
SPC5748GBK0AMMN6
NXP

TRIPLE CORE 6M FLASH

Package: 324-LBGA

Stock6,432
SPC5777CDK3MMO4
NXP

POWER ARCH CORES 8MB FL

Package: 516-BGA

Stock7,904
SPC5777CDK3MME4
NXP

POWER ARCH CORES 8MB FL

Package: 416-BGA

Stock3,792
MPC5554MZP112
NXP

NXP 32-BIT MCU POWER ARCH CORE

Package: 416-BBGA

Stock2,768
SPC5777CDK3MMO4R
NXP

POWER ARCH CORES 8MB FL

Package: 516-BGA

Stock6,384
SPC5675KF0MMM2
NXP

NXP 32-BIT MCU DUAL POWER ARCH

Package: 257-LFBGA

Stock5,568
SPC5675KFAVMS2
NXP

NXP 32-BIT MCU DUAL POWER ARCH

Package: 473-LFBGA

Stock2,944
SPC5675KFF0VMM2
NXP

NXP 32-BIT MCU DUAL POWER ARCH

Package: 257-LFBGA

Stock2,528
SPC5675KFAVMM2
NXP

NXP 32-BIT MCU DUAL POWER ARCH

Package: 257-LFBGA

Stock3,184
SPC5675KF0MMS2
NXP

NXP 32-BIT MCU DUAL POWER ARCH

Package: 473-LFBGA

Stock3,696
SPC5748GHK0AMMN6
NXP

ULTRA RELIABLE MCU WITH VAST PER

Package: 324-LBGA

Stock6,128
SPC5777MK0MVU8R
NXP

NXP 32-BIT MCU QUAD POWER ARCH

Package: 416-BBGA

Stock7,520

Part Number	Manufacturer	Description	Package	Stock	Core Size	Speed	Connectivity	Peripherals	Number of I/O	Program Memory Size	Program Memory Type	EEPROM Size	RAM Size	Voltage - Supply (Vcc/Vdd)	Data Converters	Oscillator Type	Operating Temperature	Mounting Type	Package / Case	Supplier Device Package
SPC5673FK0MVR2	NXP	3M FLASH 256K RAM Z7 200MHZ Core Processor: e200z7 Core Size: 32-Bit Speed: 200MHz Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM Number of I/O: 32 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 192K x 8 Voltage - Supply (Vcc/Vdd): 1.08 V ~ 5.25 V Data Converters: A/D 64x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BBGA Supplier Device Package: 416-PBGA (27x27)	Package: 416-BBGA	Stock3,888	32-Bit	200MHz	CANbus, SCI, SPI	DMA, POR, PWM	32	3MB (3M x 8)	FLASH	-	192K x 8	1.08 V ~ 5.25 V	A/D 64x12b	External	-40°C ~ 125°C (TA)	-	416-BBGA	416-PBGA (27x27)
SPC5673FF3MVR2	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z7 Core Size: 32-Bit Speed: 200MHz Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM Number of I/O: 32 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 192K x 8 Voltage - Supply (Vcc/Vdd): 1.08 V ~ 5.25 V Data Converters: A/D 64x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BBGA Supplier Device Package: 416-PBGA (27x27)	Package: 416-BBGA	Stock7,456	32-Bit	200MHz	CANbus, SCI, SPI	DMA, POR, PWM	32	3MB (3M x 8)	FLASH	-	192K x 8	1.08 V ~ 5.25 V	A/D 64x12b	External	-40°C ~ 125°C (TA)	-	416-BBGA	416-PBGA (27x27)
SPC5566MZP80	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z6 Core Size: 32-Bit Speed: 80MHz Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 256 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V Data Converters: A/D 40x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BBGA Supplier Device Package: 416-PBGA (27x27)	Package: 416-BBGA	Stock4,272	32-Bit	80MHz	CANbus, EBI/EMI, Ethernet, SCI, SPI	DMA, POR, PWM, WDT	256	3MB (3M x 8)	FLASH	-	128K x 8	1.35 V ~ 1.65 V	A/D 40x12b	External	-40°C ~ 125°C (TA)	-	416-BBGA	416-PBGA (27x27)
SPC5673FK0MVR2R	NXP	3M FLASH 256K RAM Z7 200MHZ Core Processor: e200z7 Core Size: 32-Bit Speed: 200MHz Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM Number of I/O: 32 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 192K x 8 Voltage - Supply (Vcc/Vdd): 1.08 V ~ 5.25 V Data Converters: A/D 64x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BBGA Supplier Device Package: 416-PBGA (27x27)	Package: 416-BBGA	Stock9,672	32-Bit	200MHz	CANbus, SCI, SPI	DMA, POR, PWM	32	3MB (3M x 8)	FLASH	-	192K x 8	1.08 V ~ 5.25 V	A/D 64x12b	External	-40°C ~ 125°C (TA)	-	416-BBGA	416-PBGA (27x27)
SPC5673FF3MVR2R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z7 Core Size: 32-Bit Speed: 200MHz Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM Number of I/O: 32 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 192K x 8 Voltage - Supply (Vcc/Vdd): 1.08 V ~ 5.25 V Data Converters: A/D 64x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BBGA Supplier Device Package: 416-PBGA (27x27)	Package: 416-BBGA	Stock4,032	32-Bit	200MHz	CANbus, SCI, SPI	DMA, POR, PWM	32	3MB (3M x 8)	FLASH	-	192K x 8	1.08 V ~ 5.25 V	A/D 64x12b	External	-40°C ~ 125°C (TA)	-	416-BBGA	416-PBGA (27x27)
SPC5566MZP80R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z6 Core Size: 32-Bit Speed: 80MHz Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 256 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V Data Converters: A/D 40x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BBGA Supplier Device Package: 416-PBGA (27x27)	Package: 416-BBGA	Stock6,240	32-Bit	80MHz	CANbus, EBI/EMI, Ethernet, SCI, SPI	DMA, POR, PWM, WDT	256	3MB (3M x 8)	FLASH	-	128K x 8	1.35 V ~ 1.65 V	A/D 40x12b	External	-40°C ~ 125°C (TA)	-	416-BBGA	416-PBGA (27x27)
SPC5554MVR132	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z6 Core Size: 32-Bit Speed: 132MHz Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 256 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V Data Converters: A/D 40x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BBGA Supplier Device Package: 416-PBGA (27x27)	Package: 416-BBGA	Stock5,616	32-Bit	132MHz	CANbus, EBI/EMI, SCI, SPI	DMA, POR, PWM, WDT	256	2MB (2M x 8)	FLASH	-	64K x 8	1.35 V ~ 1.65 V	A/D 40x12b	External	-40°C ~ 125°C (TA)	-	416-BBGA	416-PBGA (27x27)
SPC5777MK0MVA8R	NXP	NXP 32-BIT MCU QUAD POWER ARCH Core Processor: e200z7 Core Size: 32-Bit Tri-Core Speed: 300MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexRAY, I²C, LINbus, SPI, PSI, UART/USART Peripherals: DMA, LVD, POR, Zipwire Number of I/O: - Program Memory Size: 8.64MB (8M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 404K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 12b SAR, 16b Sigma-Delta Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 512-FBGA Supplier Device Package: 512-TEPBGA (25x25)	Package: 512-FBGA	Stock7,728	32-Bit Tri-Core	300MHz	CANbus, EBI/EMI, Ethernet, FlexRAY, I²C, LINbus, SPI, PSI, UART/USART	DMA, LVD, POR, Zipwire	-	8.64MB (8M x 8)	FLASH	-	404K x 8	3 V ~ 5.5 V	A/D 12b SAR, 16b Sigma-Delta	Internal	-40°C ~ 125°C (TA)	-	512-FBGA	512-TEPBGA (25x25)
SPC5748GBK0AMMN6	NXP	TRIPLE CORE 6M FLASH Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 246 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 768K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 324-LBGA Supplier Device Package: 324-MAPBGA (19x19)	Package: 324-LBGA	Stock6,432	32-Bit Tri-Core	80MHz/160MHz	CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG	DMA, LVD, POR, WDT	246	6MB (6M x 8)	FLASH	-	768K x 8	3 V ~ 5.5 V	A/D 80x10b, 64x12b	Internal	-40°C ~ 125°C (TA)	-	324-LBGA	324-MAPBGA (19x19)
SPC5777CDK3MMO4	NXP	POWER ARCH CORES 8MB FL Core Processor: e200z7 Core Size: 32-Bit Tri-Core Speed: 264MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Number of I/O: - Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 16b Sigma-Delta, eQADC Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 516-BGA Supplier Device Package: 516-MAPBGA (27x27)	Package: 516-BGA	Stock7,904	32-Bit Tri-Core	264MHz	CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI	DMA, LVD, POR, Zipwire	-	8MB (8M x 8)	FLASH	-	512K x 8	3 V ~ 5.5 V	A/D 16b Sigma-Delta, eQADC	Internal	-40°C ~ 125°C (TA)	-	516-BGA	516-MAPBGA (27x27)
SPC5777CDK3MME4	NXP	POWER ARCH CORES 8MB FL Core Processor: e200z7 Core Size: 32-Bit Tri-Core Speed: 264MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Number of I/O: - Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 16b Sigma-Delta, eQADC Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BGA Supplier Device Package: 416-MAPBGA (27x27)	Package: 416-BGA	Stock3,792	32-Bit Tri-Core	264MHz	CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI	DMA, LVD, POR, Zipwire	-	8MB (8M x 8)	FLASH	-	512K x 8	3 V ~ 5.5 V	A/D 16b Sigma-Delta, eQADC	Internal	-40°C ~ 125°C (TA)	-	416-BGA	416-MAPBGA (27x27)
MPC5554MZP112	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z6 Core Size: 32-Bit Speed: 112MHz Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 256 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V Data Converters: A/D 40x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BBGA Supplier Device Package: 416-PBGA (27x27)	Package: 416-BBGA	Stock2,768	32-Bit	112MHz	CANbus, EBI/EMI, SCI, SPI	DMA, POR, PWM, WDT	256	2MB (2M x 8)	FLASH	-	64K x 8	1.35 V ~ 1.65 V	A/D 40x12b	External	-40°C ~ 125°C (TA)	-	416-BBGA	416-PBGA (27x27)
SPC5777CDK3MMO4R	NXP	POWER ARCH CORES 8MB FL Core Processor: e200z7 Core Size: 32-Bit Tri-Core Speed: 264MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Number of I/O: - Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 16b Sigma-Delta, eQADC Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 516-BGA Supplier Device Package: 516-MAPBGA (27x27)	Package: 516-BGA	Stock6,384	32-Bit Tri-Core	264MHz	CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI	DMA, LVD, POR, Zipwire	-	8MB (8M x 8)	FLASH	-	512K x 8	3 V ~ 5.5 V	A/D 16b Sigma-Delta, eQADC	Internal	-40°C ~ 125°C (TA)	-	516-BGA	516-MAPBGA (27x27)
SPC5675KF0MMM2	NXP	NXP 32-BIT MCU DUAL POWER ARCH Core Processor: e200z7d Core Size: 32-Bit Dual-Core Speed: 180MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: - Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V Data Converters: A/D 22x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 257-LFBGA Supplier Device Package: 257-MAPBGA (14x14)	Package: 257-LFBGA	Stock5,568	32-Bit Dual-Core	180MHz	CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI	DMA, POR, PWM, WDT	-	2MB (2M x 8)	FLASH	64K x 8	512K x 8	1.14 V ~ 5.5 V	A/D 22x12b	Internal	-40°C ~ 125°C (TA)	-	257-LFBGA	257-MAPBGA (14x14)
SPC5675KFAVMS2	NXP	NXP 32-BIT MCU DUAL POWER ARCH Core Processor: e200z7d Core Size: 32-Bit Dual-Core Speed: 180MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: - Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V Data Converters: A/D 34x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 473-LFBGA Supplier Device Package: 473-MAPBGA (19x19)	Package: 473-LFBGA	Stock2,944	32-Bit Dual-Core	180MHz	CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI	DMA, POR, PWM, WDT	-	2MB (2M x 8)	FLASH	64K x 8	512K x 8	1.14 V ~ 5.5 V	A/D 34x12b	Internal	-40°C ~ 105°C (TA)	-	473-LFBGA	473-MAPBGA (19x19)
SPC5675KFF0VMM2	NXP	NXP 32-BIT MCU DUAL POWER ARCH Core Processor: e200z7d Core Size: 32-Bit Dual-Core Speed: 180MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: - Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V Data Converters: A/D 22x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 257-LFBGA Supplier Device Package: 257-MAPBGA (14x14)	Package: 257-LFBGA	Stock2,528	32-Bit Dual-Core	180MHz	CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI	DMA, POR, PWM, WDT	-	2MB (2M x 8)	FLASH	64K x 8	512K x 8	1.14 V ~ 5.5 V	A/D 22x12b	Internal	-40°C ~ 105°C (TA)	-	257-LFBGA	257-MAPBGA (14x14)
SPC5675KFAVMM2	NXP	NXP 32-BIT MCU DUAL POWER ARCH Core Processor: e200z7d Core Size: 32-Bit Dual-Core Speed: 180MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: - Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V Data Converters: A/D 22x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 257-LFBGA Supplier Device Package: 257-MAPBGA (14x14)	Package: 257-LFBGA	Stock3,184	32-Bit Dual-Core	180MHz	CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI	DMA, POR, PWM, WDT	-	2MB (2M x 8)	FLASH	64K x 8	512K x 8	1.14 V ~ 5.5 V	A/D 22x12b	Internal	-40°C ~ 105°C (TA)	-	257-LFBGA	257-MAPBGA (14x14)
SPC5675KF0MMS2	NXP	NXP 32-BIT MCU DUAL POWER ARCH Core Processor: e200z7d Core Size: 32-Bit Dual-Core Speed: 180MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: - Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V Data Converters: A/D 34x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 473-LFBGA Supplier Device Package: 473-MAPBGA (19x19)	Package: 473-LFBGA	Stock3,696	32-Bit Dual-Core	180MHz	CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI	DMA, POR, PWM, WDT	-	2MB (2M x 8)	FLASH	64K x 8	512K x 8	1.14 V ~ 5.5 V	A/D 34x12b	Internal	-40°C ~ 125°C (TA)	-	473-LFBGA	473-MAPBGA (19x19)
SPC5748GHK0AMMN6	NXP	ULTRA RELIABLE MCU WITH VAST PER Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 246 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 768K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 324-LBGA Supplier Device Package: 324-MAPBGA (19x19)	Package: 324-LBGA	Stock6,128	32-Bit Tri-Core	80MHz/160MHz	CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG	DMA, LVD, POR, WDT	246	6MB (6M x 8)	FLASH	-	768K x 8	3 V ~ 5.5 V	A/D 80x10b, 64x12b	Internal	-40°C ~ 125°C (TA)	-	324-LBGA	324-MAPBGA (19x19)
SPC5777MK0MVU8R	NXP	NXP 32-BIT MCU QUAD POWER ARCH Core Processor: e200z7 Core Size: 32-Bit Tri-Core Speed: 300MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexRAY, I²C, LINbus, SPI, PSI, UART/USART Peripherals: DMA, LVD, POR, Zipwire Number of I/O: - Program Memory Size: 8.64MB (8M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 404K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 12b SAR, 16b Sigma-Delta Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BBGA Supplier Device Package: 416-PBGA (27x27)	Package: 416-BBGA	Stock7,520	32-Bit Tri-Core	300MHz	CANbus, EBI/EMI, Ethernet, FlexRAY, I²C, LINbus, SPI, PSI, UART/USART	DMA, LVD, POR, Zipwire	-	8.64MB (8M x 8)	FLASH	-	404K x 8	3 V ~ 5.5 V	A/D 12b SAR, 16b Sigma-Delta	Internal	-40°C ~ 125°C (TA)	-	416-BBGA	416-PBGA (27x27)
SPC5777CDK3MME4R	NXP	POWER ARCH CORES 8MB FL Core Processor: e200z7 Core Size: 32-Bit Tri-Core Speed: 264MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Number of I/O: - Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 16b Sigma-Delta, eQADC Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BGA Supplier Device Package: 416-MAPBGA (27x27)	Package: 416-BGA	Stock2,592	32-Bit Tri-Core	264MHz	CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI	DMA, LVD, POR, Zipwire	-	8MB (8M x 8)	FLASH	-	512K x 8	3 V ~ 5.5 V	A/D 16b Sigma-Delta, eQADC	Internal	-40°C ~ 125°C (TA)	-	416-BGA	416-MAPBGA (27x27)
SPC5675KF0VMS2	NXP	NXP 32-BIT MCU DUAL POWER ARCH Core Processor: e200z7d Core Size: 32-Bit Dual-Core Speed: 180MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: - Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V Data Converters: A/D 34x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 473-LFBGA Supplier Device Package: 473-MAPBGA (19x19)	Package: 473-LFBGA	Stock6,480	32-Bit Dual-Core	180MHz	CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI	DMA, POR, PWM, WDT	-	2MB (2M x 8)	FLASH	64K x 8	512K x 8	1.14 V ~ 5.5 V	A/D 34x12b	Internal	-40°C ~ 105°C (TA)	-	473-LFBGA	473-MAPBGA (19x19)
SPC5777CSK3MMO3	NXP	NXP 32-BIT MCU POWER ARCH CORES Core Processor: e200z7 Core Size: 32-Bit Tri-Core Speed: 264MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Number of I/O: - Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 16b Sigma-Delta, eQADC Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 516-BGA Supplier Device Package: 516-MAPBGA (27x27)	Package: 516-BGA	Stock5,664	32-Bit Tri-Core	264MHz	CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI	DMA, LVD, POR, Zipwire	-	8MB (8M x 8)	FLASH	-	512K x 8	3 V ~ 5.5 V	A/D 16b Sigma-Delta, eQADC	Internal	-40°C ~ 125°C (TA)	-	516-BGA	516-MAPBGA (27x27)
SPC5675KFAVMS2R	NXP	NXP 32-BIT MCU DUAL POWER ARCH Core Processor: e200z7d Core Size: 32-Bit Dual-Core Speed: 180MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: - Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V Data Converters: A/D 34x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 473-LFBGA Supplier Device Package: 473-MAPBGA (19x19)	Package: 473-LFBGA	Stock7,120	32-Bit Dual-Core	180MHz	CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI	DMA, POR, PWM, WDT	-	2MB (2M x 8)	FLASH	64K x 8	512K x 8	1.14 V ~ 5.5 V	A/D 34x12b	Internal	-40°C ~ 105°C (TA)	-	473-LFBGA	473-MAPBGA (19x19)
SPC5777CLK3MMO3	NXP	NXP 32-BIT MCU POWER ARCH CORES Core Processor: e200z7 Core Size: 32-Bit Tri-Core Speed: 264MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Number of I/O: - Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 16b Sigma-Delta, eQADC Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 516-BGA Supplier Device Package: 516-MAPBGA (27x27)	Package: 516-BGA	Stock5,376	32-Bit Tri-Core	264MHz	CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI	DMA, LVD, POR, Zipwire	-	8MB (8M x 8)	FLASH	-	512K x 8	3 V ~ 5.5 V	A/D 16b Sigma-Delta, eQADC	Internal	-40°C ~ 125°C (TA)	-	516-BGA	516-MAPBGA (27x27)
SPC5777CDK3MMO3	NXP	NXP 32-BIT MCU POWER ARCH CORES Core Processor: e200z7 Core Size: 32-Bit Tri-Core Speed: 264MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Number of I/O: - Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 16b Sigma-Delta, eQADC Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 516-BGA Supplier Device Package: 516-MAPBGA (27x27)	Package: 516-BGA	Stock6,512	32-Bit Tri-Core	264MHz	CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI	DMA, LVD, POR, Zipwire	-	8MB (8M x 8)	FLASH	-	512K x 8	3 V ~ 5.5 V	A/D 16b Sigma-Delta, eQADC	Internal	-40°C ~ 125°C (TA)	-	516-BGA	516-MAPBGA (27x27)
SPC5777CCK3MMO3	NXP	NXP 32-BIT MCU POWER ARCH CORES Core Processor: e200z7 Core Size: 32-Bit Tri-Core Speed: 264MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Number of I/O: - Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 16b Sigma-Delta, eQADC Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 516-BGA Supplier Device Package: 516-MAPBGA (27x27)	Package: 516-BGA	Stock4,624	32-Bit Tri-Core	264MHz	CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI	DMA, LVD, POR, Zipwire	-	8MB (8M x 8)	FLASH	-	512K x 8	3 V ~ 5.5 V	A/D 16b Sigma-Delta, eQADC	Internal	-40°C ~ 125°C (TA)	-	516-BGA	516-MAPBGA (27x27)
SP5748GHK0AMMN6R	NXP	ULTRA RELIABLE MCU WITH VAST PER Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 246 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 768K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 324-LBGA Supplier Device Package: 324-MAPBGA (19x19)	Package: 324-LBGA	Stock7,200	32-Bit Tri-Core	80MHz/160MHz	CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG	DMA, LVD, POR, WDT	246	6MB (6M x 8)	FLASH	-	768K x 8	3 V ~ 5.5 V	A/D 80x10b, 64x12b	Internal	-40°C ~ 125°C (TA)	-	324-LBGA	324-MAPBGA (19x19)