Page 130 - NXP Products - Embedded - Microcontrollers

LPC4367JET256E
NXP

IC MCU 32BIT 1MB FLASH 256LBGA

Package: 256-LBGA

Stock6,960
LPC54616J512BD100E
NXP

32-BIT ARM CORTEX-M4

Package: 100-LQFP

Stock7,368
LPC54606J512BD100E
NXP

32-BIT ARM CORTEX-M4

Package: 100-LQFP

Stock9,036
SC511660MZP40
NXP

NXP 32-BIT MCU POWER ARCH 448

Package: 272-BBGA

Stock4,976
SPC565MZP56DR2
NXP

NXP 32-BIT MCU POWER ARCH CORE

Package: 388-BBGA

Stock3,408
SPC565MZP56D
NXP

NXP 32-BIT MCU POWER ARCH CORE

Package: 388-BBGA

Stock6,784
SPC5674FK0MVY3
NXP

NXP 32-BIT MCU POWER ARCH CORE

Package: 516-BBGA

Stock6,208
SPC5567MVR132
NXP

NXP 32-BIT MCU POWER ARCH CORE

Package: 416-BBGA

Stock5,184
MPC5567MVR132
NXP

NXP 32-BIT MCU POWER ARCH CORE

Package: 416-BBGA

Stock5,696
SPC5674FAMVY3
NXP

NXP 32-BIT MCU POWER ARCH CORE

Package: 516-BBGA

Stock6,544
SPC5674FK0MVY3R
NXP

NXP 32-BIT MCU POWER ARCH CORE

Package: 516-BBGA

Stock4,880
SPC5674FF3MVV3R
NXP

NXP 32-BIT MCU POWER ARCH CORE

Package: 516-BBGA

Stock4,208
SPC5674FAMVY3R
NXP

NXP 32-BIT MCU POWER ARCH CORE

Package: 516-BBGA

Stock3,328
SPC5674FK0MVR3
NXP

4M FLASH 256K RAM Z7 264MHZ

Package: 416-BBGA

Stock2,100
SPC5674FAMVR3
NXP

NXP 32-BIT MCU POWER ARCH CORE

Package: 416-BBGA

Stock2,176
SPC5674FF3MVR3R
NXP

NXP 32-BIT MCU POWER ARCH CORE

Package: 416-BBGA

Stock6,400
SPC5674FAMVR3R
NXP

NXP 32-BIT MCU POWER ARCH CORE

Package: 416-BBGA

Stock5,776
SPC5566MZP144
NXP

NXP 32-BIT MCU POWER ARCH CORE

Package: 416-BBGA

Stock2,784
SPC5673FK0MVY2
NXP

NXP 32-BIT MCU POWER ARCH CORE

Package: 516-BBGA

Stock3,712
SPC5566MZP144R
NXP

NXP 32-BIT MCU POWER ARCH CORE

Package: 416-BBGA

Stock3,024

Part Number	Manufacturer	Description	Package	Stock	Core Size	Speed	Connectivity	Peripherals	Number of I/O	Program Memory Size	Program Memory Type	EEPROM Size	RAM Size	Voltage - Supply (Vcc/Vdd)	Data Converters	Oscillator Type	Operating Temperature	Mounting Type	Package / Case	Supplier Device Package
LPC4367JET256E	NXP	IC MCU 32BIT 1MB FLASH 256LBGA Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Speed: 204MHz Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT Number of I/O: 164 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 16K x 8 RAM Size: 154K x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: A/D 16x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-LBGA (17x17)	Package: 256-LBGA	Stock6,960	32-Bit Dual-Core	204MHz	CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG	Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT	164	1MB (1M x 8)	FLASH	16K x 8	154K x 8	2.4 V ~ 3.6 V	A/D 16x10b; D/A 1x10b	Internal	-40°C ~ 105°C (TA)	-	256-LBGA	256-LBGA (17x17)
LPC54616J512BD100E	NXP	32-BIT ARM CORTEX-M4 Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Speed: 180MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Number of I/O: 64 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 16K x 8 RAM Size: 200K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	Package: 100-LQFP	Stock7,368	32-Bit	180MHz	CANbus, Ethernet, I²C, SPI, UART/USART, USB	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT	64	512KB (512K x 8)	FLASH	16K x 8	200K x 8	1.71 V ~ 3.6 V	A/D 12x12b	Internal	-40°C ~ 105°C (TA)	-	100-LQFP	100-LQFP (14x14)
LPC54606J512BD100E	NXP	32-BIT ARM CORTEX-M4 Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Speed: 180MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Number of I/O: 64 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 16K x 8 RAM Size: 200K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	Package: 100-LQFP	Stock9,036	32-Bit	180MHz	CANbus, Ethernet, I²C, SPI, UART/USART, USB	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT	64	512KB (512K x 8)	FLASH	16K x 8	200K x 8	1.71 V ~ 3.6 V	A/D 12x12b	Internal	-40°C ~ 105°C (TA)	-	100-LQFP	100-LQFP (14x14)
SC511660MZP40	NXP	NXP 32-BIT MCU POWER ARCH 448 Core Processor: PowerPC Core Size: 32-Bit Speed: 40MHz Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 101 Program Memory Size: 448KB (448K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 26K x 8 Voltage - Supply (Vcc/Vdd): 2.5 V ~ 2.7 V Data Converters: A/D 32x10b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 272-BBGA Supplier Device Package: 272-PBGA (27x27)	Package: 272-BBGA	Stock4,976	32-Bit	40MHz	CANbus, EBI/EMI, SCI, SPI, UART/USART	POR, PWM, WDT	101	448KB (448K x 8)	FLASH	-	26K x 8	2.5 V ~ 2.7 V	A/D 32x10b	External	-40°C ~ 125°C (TA)	-	272-BBGA	272-PBGA (27x27)
SPC565MZP56DR2	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: PowerPC Core Size: 32-Bit Speed: 56MHz Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 56 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 36K x 8 Voltage - Supply (Vcc/Vdd): 2.5 V ~ 2.7 V Data Converters: A/D 40x10b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 388-BBGA Supplier Device Package: 388-PBGA (27x27)	Package: 388-BBGA	Stock3,408	32-Bit	56MHz	CANbus, EBI/EMI, SCI, SPI, UART/USART	POR, PWM, WDT	56	1MB (1M x 8)	FLASH	-	36K x 8	2.5 V ~ 2.7 V	A/D 40x10b	External	-40°C ~ 125°C (TA)	-	388-BBGA	388-PBGA (27x27)
SPC565MZP56D	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: PowerPC Core Size: 32-Bit Speed: 56MHz Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 56 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 36K x 8 Voltage - Supply (Vcc/Vdd): 2.5 V ~ 2.7 V Data Converters: A/D 40x10b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 388-BBGA Supplier Device Package: 388-PBGA (27x27)	Package: 388-BBGA	Stock6,784	32-Bit	56MHz	CANbus, EBI/EMI, SCI, SPI, UART/USART	POR, PWM, WDT	56	1MB (1M x 8)	FLASH	-	36K x 8	2.5 V ~ 2.7 V	A/D 40x10b	External	-40°C ~ 125°C (TA)	-	388-BBGA	388-PBGA (27x27)
SPC5674FK0MVY3	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z7 Core Size: 32-Bit Speed: 264MHz Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Number of I/O: 32 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 1.08 V ~ 5.25 V Data Converters: A/D 64x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	Package: 516-BBGA	Stock6,208	32-Bit	264MHz	CANbus, EBI/EMI, SCI, SPI	DMA, POR, PWM	32	4MB (4M x 8)	FLASH	-	256K x 8	1.08 V ~ 5.25 V	A/D 64x12b	External	-40°C ~ 125°C (TA)	-	516-BBGA	516-FPBGA (27x27)
SPC5567MVR132	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z6 Core Size: 32-Bit Speed: 132MHz Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 238 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 80K x 8 Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V Data Converters: A/D 40x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BBGA Supplier Device Package: 416-PBGA (27x27)	Package: 416-BBGA	Stock5,184	32-Bit	132MHz	CANbus, EBI/EMI, Ethernet, SCI, SPI	DMA, POR, PWM, WDT	238	2MB (2M x 8)	FLASH	-	80K x 8	1.35 V ~ 1.65 V	A/D 40x12b	External	-40°C ~ 125°C (TA)	-	416-BBGA	416-PBGA (27x27)
MPC5567MVR132	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z6 Core Size: 32-Bit Speed: 132MHz Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 238 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 80K x 8 Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V Data Converters: A/D 40x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BBGA Supplier Device Package: 416-PBGA (27x27)	Package: 416-BBGA	Stock5,696	32-Bit	132MHz	CANbus, EBI/EMI, Ethernet, SCI, SPI	DMA, POR, PWM, WDT	238	2MB (2M x 8)	FLASH	-	80K x 8	1.35 V ~ 1.65 V	A/D 40x12b	External	-40°C ~ 125°C (TA)	-	416-BBGA	416-PBGA (27x27)
SPC5674FAMVY3	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z7 Core Size: 32-Bit Speed: 264MHz Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Number of I/O: 32 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 1.08 V ~ 5.25 V Data Converters: A/D 64x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	Package: 516-BBGA	Stock6,544	32-Bit	264MHz	CANbus, EBI/EMI, SCI, SPI	DMA, POR, PWM	32	4MB (4M x 8)	FLASH	-	256K x 8	1.08 V ~ 5.25 V	A/D 64x12b	External	-40°C ~ 125°C (TA)	-	516-BBGA	516-FPBGA (27x27)
SPC5674FK0MVY3R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z7 Core Size: 32-Bit Speed: 264MHz Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Number of I/O: 32 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 1.08 V ~ 5.25 V Data Converters: A/D 64x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	Package: 516-BBGA	Stock4,880	32-Bit	264MHz	CANbus, EBI/EMI, SCI, SPI	DMA, POR, PWM	32	4MB (4M x 8)	FLASH	-	256K x 8	1.08 V ~ 5.25 V	A/D 64x12b	External	-40°C ~ 125°C (TA)	-	516-BBGA	516-FPBGA (27x27)
SPC5674FF3MVV3R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z7 Core Size: 32-Bit Speed: 264MHz Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Number of I/O: 32 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 1.08 V ~ 5.25 V Data Converters: A/D 64x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	Package: 516-BBGA	Stock4,208	32-Bit	264MHz	CANbus, EBI/EMI, SCI, SPI	DMA, POR, PWM	32	4MB (4M x 8)	FLASH	-	256K x 8	1.08 V ~ 5.25 V	A/D 64x12b	External	-40°C ~ 125°C (TA)	-	516-BBGA	516-FPBGA (27x27)
SPC5674FAMVY3R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z7 Core Size: 32-Bit Speed: 264MHz Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Number of I/O: 32 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 1.08 V ~ 5.25 V Data Converters: A/D 64x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	Package: 516-BBGA	Stock3,328	32-Bit	264MHz	CANbus, EBI/EMI, SCI, SPI	DMA, POR, PWM	32	4MB (4M x 8)	FLASH	-	256K x 8	1.08 V ~ 5.25 V	A/D 64x12b	External	-40°C ~ 125°C (TA)	-	516-BBGA	516-FPBGA (27x27)
SPC5674FK0MVR3	NXP	4M FLASH 256K RAM Z7 264MHZ Core Processor: e200z7 Core Size: 32-Bit Speed: 264MHz Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM Number of I/O: 32 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 1.08 V ~ 5.25 V Data Converters: A/D 64x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BBGA Supplier Device Package: 416-PBGA (27x27)	Package: 416-BBGA	Stock2,100	32-Bit	264MHz	CANbus, SCI, SPI	DMA, POR, PWM	32	4MB (4M x 8)	FLASH	-	256K x 8	1.08 V ~ 5.25 V	A/D 64x12b	External	-40°C ~ 125°C (TA)	-	416-BBGA	416-PBGA (27x27)
SPC5674FAMVR3	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z7 Core Size: 32-Bit Speed: 264MHz Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM Number of I/O: 32 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 1.08 V ~ 5.25 V Data Converters: A/D 64x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BBGA Supplier Device Package: 416-PBGA (27x27)	Package: 416-BBGA	Stock2,176	32-Bit	264MHz	CANbus, SCI, SPI	DMA, POR, PWM	32	4MB (4M x 8)	FLASH	-	256K x 8	1.08 V ~ 5.25 V	A/D 64x12b	External	-40°C ~ 125°C (TA)	-	416-BBGA	416-PBGA (27x27)
SPC5674FF3MVR3R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z7 Core Size: 32-Bit Speed: 264MHz Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM Number of I/O: 32 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 1.08 V ~ 5.25 V Data Converters: A/D 64x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BBGA Supplier Device Package: 416-PBGA (27x27)	Package: 416-BBGA	Stock6,400	32-Bit	264MHz	CANbus, SCI, SPI	DMA, POR, PWM	32	4MB (4M x 8)	FLASH	-	256K x 8	1.08 V ~ 5.25 V	A/D 64x12b	External	-40°C ~ 125°C (TA)	-	416-BBGA	416-PBGA (27x27)
SPC5674FAMVR3R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z7 Core Size: 32-Bit Speed: 264MHz Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM Number of I/O: 32 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 1.08 V ~ 5.25 V Data Converters: A/D 64x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BBGA Supplier Device Package: 416-PBGA (27x27)	Package: 416-BBGA	Stock5,776	32-Bit	264MHz	CANbus, SCI, SPI	DMA, POR, PWM	32	4MB (4M x 8)	FLASH	-	256K x 8	1.08 V ~ 5.25 V	A/D 64x12b	External	-40°C ~ 125°C (TA)	-	416-BBGA	416-PBGA (27x27)
SPC5566MZP144	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z6 Core Size: 32-Bit Speed: 144MHz Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 256 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V Data Converters: A/D 40x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BBGA Supplier Device Package: 416-PBGA (27x27)	Package: 416-BBGA	Stock2,784	32-Bit	144MHz	CANbus, EBI/EMI, Ethernet, SCI, SPI	DMA, POR, PWM, WDT	256	3MB (3M x 8)	FLASH	-	128K x 8	1.35 V ~ 1.65 V	A/D 40x12b	External	-40°C ~ 125°C (TA)	-	416-BBGA	416-PBGA (27x27)
SPC5673FK0MVY2	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z7 Core Size: 32-Bit Speed: 200MHz Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Number of I/O: 32 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 192K x 8 Voltage - Supply (Vcc/Vdd): 1.08 V ~ 5.25 V Data Converters: A/D 64x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	Package: 516-BBGA	Stock3,712	32-Bit	200MHz	CANbus, EBI/EMI, SCI, SPI	DMA, POR, PWM	32	3MB (3M x 8)	FLASH	-	192K x 8	1.08 V ~ 5.25 V	A/D 64x12b	External	-40°C ~ 125°C (TA)	-	516-BBGA	516-FPBGA (27x27)
SPC5566MZP144R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z6 Core Size: 32-Bit Speed: 144MHz Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 256 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V Data Converters: A/D 40x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BBGA Supplier Device Package: 416-PBGA (27x27)	Package: 416-BBGA	Stock3,024	32-Bit	144MHz	CANbus, EBI/EMI, Ethernet, SCI, SPI	DMA, POR, PWM, WDT	256	3MB (3M x 8)	FLASH	-	128K x 8	1.35 V ~ 1.65 V	A/D 40x12b	External	-40°C ~ 125°C (TA)	-	416-BBGA	416-PBGA (27x27)
SPC5566MZP132	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z6 Core Size: 32-Bit Speed: 132MHz Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 256 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V Data Converters: A/D 40x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BBGA Supplier Device Package: 416-PBGA (27x27)	Package: 416-BBGA	Stock4,192	32-Bit	132MHz	CANbus, EBI/EMI, Ethernet, SCI, SPI	DMA, POR, PWM, WDT	256	3MB (3M x 8)	FLASH	-	128K x 8	1.35 V ~ 1.65 V	A/D 40x12b	External	-40°C ~ 125°C (TA)	-	416-BBGA	416-PBGA (27x27)
SPC5566MVR132	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z6 Core Size: 32-Bit Speed: 132MHz Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 256 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V Data Converters: A/D 40x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 416-BBGA Supplier Device Package: 416-PBGA (27x27)	Package: 416-BBGA	Stock4,720	32-Bit	132MHz	CANbus, EBI/EMI, Ethernet, SCI, SPI	DMA, POR, PWM, WDT	256	3MB (3M x 8)	FLASH	-	128K x 8	1.35 V ~ 1.65 V	A/D 40x12b	External	-40°C ~ 105°C (TA)	-	416-BBGA	416-PBGA (27x27)
SPC5566MZP132R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z6 Core Size: 32-Bit Speed: 132MHz Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 256 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V Data Converters: A/D 40x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BBGA Supplier Device Package: 416-PBGA (27x27)	Package: 416-BBGA	Stock5,664	32-Bit	132MHz	CANbus, EBI/EMI, Ethernet, SCI, SPI	DMA, POR, PWM, WDT	256	3MB (3M x 8)	FLASH	-	128K x 8	1.35 V ~ 1.65 V	A/D 40x12b	External	-40°C ~ 125°C (TA)	-	416-BBGA	416-PBGA (27x27)
SPC5566MVR132R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z6 Core Size: 32-Bit Speed: 132MHz Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 256 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V Data Converters: A/D 40x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 416-BBGA Supplier Device Package: 416-PBGA (27x27)	Package: 416-BBGA	Stock3,328	32-Bit	132MHz	CANbus, EBI/EMI, Ethernet, SCI, SPI	DMA, POR, PWM, WDT	256	3MB (3M x 8)	FLASH	-	128K x 8	1.35 V ~ 1.65 V	A/D 40x12b	External	-40°C ~ 105°C (TA)	-	416-BBGA	416-PBGA (27x27)
SPC5676RDK3MVU1R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z7 Core Size: 32-Bit Dual-Core Speed: 180MHz Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Number of I/O: - Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 384K x 8 Voltage - Supply (Vcc/Vdd): 1.14 V ~ 1.32 V Data Converters: A/D 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BBGA Supplier Device Package: 416-PBGA (27x27)	Package: 416-BBGA	Stock4,144	32-Bit Dual-Core	180MHz	CANbus, EBI/EMI, SCI, SPI	DMA, POR, PWM	-	6MB (6M x 8)	FLASH	-	384K x 8	1.14 V ~ 1.32 V	A/D 64x12b	Internal	-40°C ~ 125°C (TA)	-	416-BBGA	416-PBGA (27x27)
SPC5123YVY400B	NXP	TELEMATICS PROCESSOR W/O MBX GRA Core Processor: e300 Core Size: 32-Bit Speed: 400MHz Connectivity: CANbus, EBI/EMI, Ethernet, I²C, USB OTG Peripherals: DMA, WDT Number of I/O: 147 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.08 V ~ 3.6 V Data Converters: - Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 516-BBGA Exposed Pad Supplier Device Package: 516-FPBGA (27x27)	Package: 516-BBGA Exposed Pad	Stock6,416	32-Bit	400MHz	CANbus, EBI/EMI, Ethernet, I²C, USB OTG	DMA, WDT	147	-	ROMless	-	128K x 8	1.08 V ~ 3.6 V	-	External	-40°C ~ 85°C (TA)	-	516-BBGA Exposed Pad	516-FPBGA (27x27)
SPC5673FK0MVY2R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z7 Core Size: 32-Bit Speed: 200MHz Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Number of I/O: 32 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 192K x 8 Voltage - Supply (Vcc/Vdd): 1.08 V ~ 5.25 V Data Converters: A/D 64x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	Package: 516-BBGA	Stock4,560	32-Bit	200MHz	CANbus, EBI/EMI, SCI, SPI	DMA, POR, PWM	32	3MB (3M x 8)	FLASH	-	192K x 8	1.08 V ~ 5.25 V	A/D 64x12b	External	-40°C ~ 125°C (TA)	-	516-BBGA	516-FPBGA (27x27)
SPC5566MZP112R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z6 Core Size: 32-Bit Speed: 112MHz Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 256 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V Data Converters: A/D 40x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BBGA Supplier Device Package: 416-PBGA (27x27)	Package: 416-BBGA	Stock4,016	32-Bit	112MHz	CANbus, EBI/EMI, Ethernet, SCI, SPI	DMA, POR, PWM, WDT	256	3MB (3M x 8)	FLASH	-	128K x 8	1.35 V ~ 1.65 V	A/D 40x12b	External	-40°C ~ 125°C (TA)	-	416-BBGA	416-PBGA (27x27)