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NXP |
MOSFET N-CH 75V 22A DPAK
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 75V
- Current - Continuous Drain (Id) @ 25°C: 22A (Tc)
- Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
- Vgs(th) (Max) @ Id: 2.8V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs: 21.4nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds: 1280pF @ 25V
- Vgs (Max): ±16V
- FET Feature: -
- Power Dissipation (Max): 60W (Tc)
- Rds On (Max) @ Id, Vgs: 46 mOhm @ 10A, 10V
- Operating Temperature: -55°C ~ 175°C (TJ)
- Mounting Type: Surface Mount
- Supplier Device Package: DPAK
- Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
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Package: TO-252-3, DPak (2 Leads + Tab), SC-63 |
Stock2,896 |
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NXP |
FET RF 65V 1.88GHZ NI780S
- Transistor Type: LDMOS
- Frequency: 1.88GHz
- Gain: 17dB
- Voltage - Test: 28V
- Current Rating: -
- Noise Figure: -
- Current - Test: 1.1A
- Power - Output: 125W
- Voltage - Rated: 65V
- Package / Case: NI-780S
- Supplier Device Package: NI-780S
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Package: NI-780S |
Stock4,512 |
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NXP |
DIODE ZENER 9.1V 300MW SMT3
- Voltage - Zener (Nom) (Vz): 9.1V
- Tolerance: ±2%
- Power - Max: 300mW
- Impedance (Max) (Zzt): 10 Ohms
- Current - Reverse Leakage @ Vr: 500nA @ 6V
- Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
- Operating Temperature: -65°C ~ 150°C
- Mounting Type: Surface Mount
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Supplier Device Package: SMT3; MPAK
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Package: TO-236-3, SC-59, SOT-23-3 |
Stock2,560 |
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NXP |
TOPFET LOGIC LVL 50V SOT-223
- Switch Type: General Purpose
- Number of Outputs: 1
- Ratio - Input:Output: 1:1
- Output Configuration: Low Side
- Output Type: N-Channel
- Interface: On/Off
- Voltage - Load: 50V (Max)
- Voltage - Supply (Vcc/Vdd): Not Required
- Current - Output (Max): 2.1A
- Rds On (Typ): 150 mOhm
- Input Type: Non-Inverting
- Features: -
- Fault Protection: Over Temperature, Over Voltage
- Operating Temperature: 150°C (TJ)
- Package / Case: TO-261-4, TO-261AA
- Supplier Device Package: SOT-223
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Package: TO-261-4, TO-261AA |
Stock3,040 |
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NXP |
IC BUFFER 1.8V 25BIT SOT536-1
- Logic Type: 1:1, 1:2 Configurable Registered Buffer
- Supply Voltage: 1.7 V ~ 1.9 V
- Number of Bits: 25, 14
- Operating Temperature: 0°C ~ 70°C
- Mounting Type: Surface Mount
- Package / Case: 96-LFBGA
- Supplier Device Package: 96-LFBGA (13.5x5.5)
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Package: 96-LFBGA |
Stock4,784 |
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NXP |
IC COMPARATOR MAGNITUDE 20TSSOP
- Type: Identity Comparator
- Number of Bits: 8
- Output: Active Low
- Output Function: A=B
- Voltage - Supply: 4.5 V ~ 5.5 V
- Current - Output High, Low: 4mA, 4mA
- Max Propagation Delay @ V, Max CL: 34ns @ 4.5V, 50pF
- Current - Quiescent (Iq): 8µA
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 20-TSSOP (0.173", 4.40mm Width)
- Mounting Type: Surface Mount
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Package: 20-TSSOP (0.173", 4.40mm Width) |
Stock6,288 |
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NXP |
IC TRANSCVR 8BIT N-INV 24TSSOP
- Logic Type: Transceiver, Non-Inverting
- Number of Elements: 1
- Number of Bits per Element: 8
- Input Type: -
- Output Type: Push-Pull
- Current - Output High, Low: 32mA, 64mA
- Voltage - Supply: 4.5 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 24-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 24-TSSOP
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Package: 24-TSSOP (0.173", 4.40mm Width) |
Stock2,304 |
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NXP |
IC UART DUAL W/FIFO 56-TSSOP
- Features: Configurable GPIO, Internal Oscillator, Timer/Counter
- Number of Channels: 1, UART
- FIFO's: 256 Byte
- Protocol: RS485
- Data Rate (Max): 3.125Mbps
- Voltage - Supply: 3.3V, 5V
- With Auto Flow Control: Yes
- With IrDA Encoder/Decoder: -
- With False Start Bit Detection: Yes
- With Modem Control: Yes
- Mounting Type: Surface Mount
- Package / Case: 56-TFSOP (0.240", 6.10mm Width)
- Supplier Device Package: 56-TSSOP
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Package: 56-TFSOP (0.240", 6.10mm Width) |
Stock6,656 |
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NXP |
IC INTERFACE SW DETECT 32-SOIC
- Applications: Multiple Switch Detection
- Interface: -
- Voltage - Supply: 4.5 V ~ 36 V
- Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Supplier Device Package: 32-SOIC EP
- Mounting Type: Surface Mount
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Package: 32-SSOP (0.295", 7.50mm Width) Exposed Pad |
Stock5,168 |
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NXP |
IC CODEC STER/SUDIO SPDIF 44QFP
- Type: Stereo Audio
- Data Interface: I2C, Serial
- Resolution (Bits): 24 b
- Number of ADCs / DACs: 2 / 2
- Sigma Delta: No
- S/N Ratio, ADCs / DACs (db) Typ: 97 / 98
- Dynamic Range, ADCs / DACs (db) Typ: -
- Voltage - Supply, Analog: 2.7 V ~ 5.5 V
- Voltage - Supply, Digital: 2.7 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 44-QFP
- Supplier Device Package: 44-PQFP (10x10)
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Package: 44-QFP |
Stock7,088 |
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NXP |
IC MPU MPC85XX 1.333GHZ 783BGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.333GHz
- Co-Processors/DSP: Security; SEC
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: SATA 3Gbps (2)
- USB: USB 2.0 (3)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Cryptography
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Package: 783-BBGA, FCBGA |
Stock6,400 |
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NXP |
IC MPU MPC83XX 400MHZ 740TBGA
- Core Processor: PowerPC e300
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 400MHz
- Co-Processors/DSP: Communications; QUICC Engine
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (1)
- SATA: -
- USB: USB 1.x (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 740-LBGA
- Supplier Device Package: 740-TBGA (37.5x37.5)
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Package: 740-LBGA |
Stock4,896 |
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NXP |
IC MPU MPC82XX 266MHZ 357BGA
- Core Processor: PowerPC 603e
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 266MHz
- Co-Processors/DSP: -
- RAM Controllers: SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 357-BBGA
- Supplier Device Package: 357-PBGA (25x25)
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Package: 357-BBGA |
Stock3,664 |
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NXP |
IC MPU MPC83XX 400MHZ 473MAPBGA
- Core Processor: PowerPC e300c3
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 400MHz
- Co-Processors/DSP: -
- RAM Controllers: DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (3)
- SATA: -
- USB: USB 2.0 (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 473-LFBGA
- Supplier Device Package: 473-MAPBGA (19x19)
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Package: 473-LFBGA |
Stock5,120 |
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NXP |
IC MCU 8BIT 8KB OTP 44PLCC
- Core Processor: 8051
- Core Size: 8-Bit
- Speed: 33MHz
- Connectivity: EBI/EMI, UART/USART
- Peripherals: POR, PWM, WDT
- Number of I/O: 32
- Program Memory Size: 8KB (8K x 8)
- Program Memory Type: OTP
- EEPROM Size: -
- RAM Size: 512 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: -
- Package / Case: 44-LCC (J-Lead)
- Supplier Device Package: 44-PLCC (16.59x16.59)
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Package: 44-LCC (J-Lead) |
Stock3,712 |
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NXP |
IC MCU 8BIT 1KB FLASH 14TSSOP
- Core Processor: 8051
- Core Size: 8-Bit
- Speed: 18MHz
- Connectivity: SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
- Number of I/O: 12
- Program Memory Size: 1KB (1K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128 x 8
- Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 14-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 14-TSSOP
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Package: 14-TSSOP (0.173", 4.40mm Width) |
Stock2,576 |
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NXP |
IC MCU 8BIT 60KB FLASH 44LQFP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 39
- Program Memory Size: 60KB (60K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 44-LQFP
- Supplier Device Package: 44-LQFP (10x10)
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Package: 44-LQFP |
Stock4,720 |
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NXP |
IC MCU 16BIT 1MB FLASH 144LQFP
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 50MHz
- Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 119
- Program Memory Size: 1MB (1M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
- Data Converters: A/D 24x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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Package: 144-LQFP |
Stock5,440 |
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NXP |
IC MCU 8BIT 4KB FLASH 16TSSOP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: I2C, LIN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 13
- Program Memory Size: 4KB (4K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 256 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 16-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 16-TSSOP
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Package: 16-TSSOP (0.173", 4.40mm Width) |
Stock18,516 |
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NXP |
BCC14
- Function: Battery Cell Controller
- Battery Chemistry: Lithium-Ion
- Number of Cells: 7 ~ 14
- Fault Protection: Over/Under Voltage
- Interface: SPI
- Operating Temperature: -40°C ~ 105°C (TA)
- Package / Case: 64-LQFP Exposed Pad
- Supplier Device Package: 64-LQFP (10x10)
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Package: 64-LQFP Exposed Pad |
Stock4,096 |
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NXP |
8-BIT MCU S08 CORE 8KB FLASH
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 20MHz
- Connectivity: I²C, LINbus, SPI, UART/USART
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 26
- Program Memory Size: 8KB (8K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 256 x 8
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 12x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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Package: 32-LQFP |
Stock5,680 |
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NXP |
DSP AUDIO AMP CLASS D
- Type: Class D
- Output Type: 1-Channel (Mono)
- Max Output Power x Channels @ Load: 9.5mW x 1 @ 4Ohm, 5.6mW x 1 @ 8Ohm
- Voltage - Supply: 2.7V ~ 5.5V
- Features: -
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Supplier Device Package: 48-WLCSP (2.51x3.55)
- Package / Case: 48-UFBGA, WLCSP
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Package: 48-UFBGA, WLCSP |
Stock32,490 |
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NXP |
IC MCU 32BIT 2MB CRAM 269LFBGA
- Core Processor: -
- Core Size: -
- Speed: -
- Connectivity: -
- Peripherals: -
- Number of I/O: -
- Program Memory Size: -
- Program Memory Type: -
- EEPROM Size: -
- RAM Size: -
- Voltage - Supply (Vcc/Vdd): -
- Data Converters: -
- Oscillator Type: -
- Operating Temperature: -
- Mounting Type: Surface Mount
- Package / Case: 269-LFBGA
- Supplier Device Package: 269-LFBGA (14x14)
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Package: - |
Request a Quote |
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NXP |
IC MCU 32BIT 256KB FLSH 100TFBGA
- Core Processor: ARM® Cortex®-M3
- Core Size: 32-Bit Single-Core
- Speed: 100MHz
- Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
- Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
- Number of I/O: 70
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
- Data Converters: A/D 8x12b SAR
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 100-TFBGA
- Supplier Device Package: 100-TFBGA (9x9)
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Package: - |
Stock5,853 |
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NXP |
POWER MANAGEMENT IC 3 BUCK REGS
- Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
- Current - Supply: -
- Voltage - Supply: 4.1V ~ 6V
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 40-VFQFN Exposed Pad
- Supplier Device Package: 40-HVQFN (5x5)
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Package: - |
Request a Quote |
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NXP |
RF MOSFET LDMOS 10.8V 16DFN
- Transistor Type: LDMOS
- Frequency: 136MHz ~ 941MHz
- Gain: -
- Voltage - Test: 10.8 V
- Current Rating: 2µA
- Noise Figure: -
- Current - Test: 100 mA
- Power - Output: 6.8W
- Voltage - Rated: 30 V
- Package / Case: 16-VDFN Exposed Pad
- Supplier Device Package: 16-DFN (4x6)
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Package: - |
Stock2,826 |
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NXP |
HIGH-SIDE SWITCH, 32V, TRIPLE 7M
- Switch Type: General Purpose
- Number of Outputs: 6
- Ratio - Input:Output: 2:3
- Output Configuration: High Side
- Output Type: N-Channel
- Interface: SPI
- Voltage - Load: 7V ~ 30V
- Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
- Current - Output (Max): -
- Rds On (Typ): 7mOhm
- Input Type: Non-Inverting
- Features: Internal PWM, Slew Rate Controlled, Status Flag
- Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
- Operating Temperature: -40°C ~ 125°C (TA)
- Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
- Supplier Device Package: 54-HSOP
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Package: - |
Request a Quote |
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NXP |
UNIVERSAL LCD DRIVER FOR LOW MUL
- Display Type: LCD
- Configuration: 40 Segment
- Interface: I2C
- Digits or Characters: 10 Characters, 20 Characters, 160 Elements
- Current - Supply: 3.5 µA
- Voltage - Supply: 1.8V ~ 5.5V
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 56-TFSOP (0.240", 6.10mm Width)
- Supplier Device Package: 56-TSSOP
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Package: - |
Request a Quote |
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