NXP Products | Heisener Electronics

BFR31,235
NXP

JFET N-CH 10MA 250MW SOT23

Package: TO-236-3, SC-59, SOT-23-3

Stock5,088
NX3008NBKT,115
NXP

MOSFET N-CH 30V SC-75

Package: SC-75, SOT-416

Stock5,088
BUK962R1-40E,118
NXP

MOSFET N-CH 40V 120A D2PAK

Package: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

Stock5,712
BLF6G24-180PN,112
NXP

TRANSISTOR PWR LDMOS SOT539A

Package: SOT539A

Stock4,256
MRFE6S9060NR1
NXP

FET RF 66V 880MHZ TO270-2

Package: TO-270AA

Stock5,344
MCM69C432TQ20
NXP

IC CAM 1MBIT 50MHZ 100TQFP

Package: 100-LQFP

Stock16,668
SSTUB32865ET/G,518
NXP

IC REG BUFFER 28BIT 160TFBGA

Package: 160-TFBGA

Stock7,824
N74F640D,602
NXP

IC TRANSCVR 3ST 8BIT INV 20SOIC

Package: 20-SOIC (0.295", 7.50mm Width)

Stock4,832
TDA8024T/C1,118
NXP

IC SMART CARD INTERFACE 28-SOIC

Package: 28-SOIC (0.295", 7.50mm Width)

Stock6,624
MPC745CPX350LE
NXP

IC MPU MPC7XX 350MHZ 255FCBGA

Package: 255-BBGA, FCBGA

Stock3,200
KMPC8347ECVRAGDB
NXP

IC MPU MPC83XX 266MHZ 620BGA

Package: 620-BBGA Exposed Pad

Stock6,752
MPC880CZP66
NXP

IC MPU MPC8XX 66MHZ 357BGA

Package: 357-BBGA

Stock9,816
MCIMX6Q4AVT10AC
NXP

IC MPU I.MX6Q 1.0GHZ 624FCBGA

Package: 624-FBGA, FCBGA

Stock4,176
MC9S12GC96VPBE
NXP

IC MCU 16BIT 96KB FLASH 52LQFP

Package: 52-LQFP

Stock6,864
P89LPC9321FN,112
NXP

IC MCU 8BIT 8KB FLASH 28DIP

Package: 28-DIP (0.600", 15.24mm)

Stock4,800
MC9S12DT256MFUE
NXP

IC MCU 16BIT 256KB FLASH 80QFP

Package: 80-QFP

Stock8,316
TFF11092HN/N1
NXP

IC FREQUENCY GENERATOR 24HVQFN

Package: 24-VFQFN Exposed Pad

Stock3,088
MPX2202ASX
NXP

SENSOR ABS PRESS 29PSI MAX

Package: 4-SIP Module

Stock3,456
HT2DC20S20/F/RSP
NXP

RFID HITAG STICK TRANSP 125KHZ

Package: -

Stock3,816
BGA7351,115
NXP

IC AMP VGA 32-HVQFN

Package: 32-VFQFN Exposed Pad

Stock6,984

Part Number	Manufacturer	Description	Package	Stock
BFR31,235	NXP	JFET N-CH 10MA 250MW SOT23 FET Type: N-Channel Voltage - Breakdown (V(BR)GSS): - Drain to Source Voltage (Vdss): 25V Current - Drain (Idss) @ Vds (Vgs=0): 1mA @ 10V Current Drain (Id) - Max: 10mA Voltage - Cutoff (VGS off) @ Id: 2.5V @ 0.5nA Input Capacitance (Ciss) (Max) @ Vds: 4pF @ 10V Resistance - RDS(On): - Power - Max: 250mW Operating Temperature: 150°C (TJ) Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SOT-23 (TO-236AB)	Package: TO-236-3, SC-59, SOT-23-3	Stock5,088
NX3008NBKT,115	NXP	MOSFET N-CH 30V SC-75 FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 30V Current - Continuous Drain (Id) @ 25°C: 350mA (Ta) Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V Vgs(th) (Max) @ Id: 1.1V @ 250µA Gate Charge (Qg) (Max) @ Vgs: 0.68nC @ 4.5V Input Capacitance (Ciss) (Max) @ Vds: 50pF @ 15V Vgs (Max): ±8V FET Feature: - Power Dissipation (Max): 250mW (Ta), 770mW (Tc) Rds On (Max) @ Id, Vgs: 1.4 Ohm @ 350mA, 4.5V Operating Temperature: -55°C ~ 150°C (TJ) Mounting Type: Surface Mount Supplier Device Package: SC-75 Package / Case: SC-75, SOT-416	Package: SC-75, SOT-416	Stock5,088
BUK962R1-40E,118	NXP	MOSFET N-CH 40V 120A D2PAK FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 40V Current - Continuous Drain (Id) @ 25°C: 120A (Tc) Drive Voltage (Max Rds On, Min Rds On): 5V, 10V Vgs(th) (Max) @ Id: 2.1V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 87.8nC @ 5V Input Capacitance (Ciss) (Max) @ Vds: 13160pF @ 25V Vgs (Max): ±10V FET Feature: - Power Dissipation (Max): 293W (Tc) Rds On (Max) @ Id, Vgs: 1.8 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Surface Mount Supplier Device Package: D2PAK Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB	Package: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB	Stock5,712
BLF6G24-180PN,112	NXP	TRANSISTOR PWR LDMOS SOT539A Transistor Type: LDMOS Frequency: 2GHz ~ 2.2GHz Gain: 17.5dB Voltage - Test: - Current Rating: - Noise Figure: - Current - Test: - Power - Output: 50W Voltage - Rated: - Package / Case: SOT539A Supplier Device Package: SOT539A	Package: SOT539A	Stock4,256
MRFE6S9060NR1	NXP	FET RF 66V 880MHZ TO270-2 Transistor Type: LDMOS Frequency: 880MHz Gain: 21.1dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 450mA Power - Output: 14W Voltage - Rated: 66V Package / Case: TO-270AA Supplier Device Package: TO-270-2	Package: TO-270AA	Stock5,344
MCM69C432TQ20	NXP	IC CAM 1MBIT 50MHZ 100TQFP Memory Type: Volatile Memory Format: RAM Technology: CAM Memory Size: 1Mb (16K x 64) Memory Interface: Parallel Clock Frequency: 50MHz Write Cycle Time - Word, Page: - Access Time: - Voltage - Supply: 3.135 V ~ 3.465 V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-TQFP (14x20)	Package: 100-LQFP	Stock16,668
SSTUB32865ET/G,518	NXP	IC REG BUFFER 28BIT 160TFBGA Logic Type: 1:2 Registered Buffer with Parity Supply Voltage: 1.7 V ~ 2 V Number of Bits: 28 Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 160-TFBGA Supplier Device Package: 160-TFBGA (9x13)	Package: 160-TFBGA	Stock7,824
N74F640D,602	NXP	IC TRANSCVR 3ST 8BIT INV 20SOIC Logic Type: Buffer, Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 3mA, 24mA; 15mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SO	Package: 20-SOIC (0.295", 7.50mm Width)	Stock4,832
TDA8024T/C1,118	NXP	IC SMART CARD INTERFACE 28-SOIC Applications: - Interface: Analog Voltage - Supply: 2.7 V ~ 6.5 V Package / Case: 28-SOIC (0.295", 7.50mm Width) Supplier Device Package: 28-SO Mounting Type: Surface Mount	Package: 28-SOIC (0.295", 7.50mm Width)	Stock6,624
MPC745CPX350LE	NXP	IC MPU MPC7XX 350MHZ 255FCBGA Core Processor: PowerPC Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 350MHz Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 255-BBGA, FCBGA Supplier Device Package: 255-FCPBGA (21x21)	Package: 255-BBGA, FCBGA	Stock3,200
KMPC8347ECVRAGDB	NXP	IC MPU MPC83XX 266MHZ 620BGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Security; SEC RAM Controllers: DDR Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-PBGA (29x29)	Package: 620-BBGA Exposed Pad	Stock6,752
MPC880CZP66	NXP	IC MPU MPC8XX 66MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (2), 10/100 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 100°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	Package: 357-BBGA	Stock9,816
MCIMX6Q4AVT10AC	NXP	IC MPU I.MX6Q 1.0GHZ 624FCBGA Core Processor: ARM? Cortex?-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (1) SATA: SATA 3Gbps (1) USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21x21)	Package: 624-FBGA, FCBGA	Stock4,176
MC9S12GC96VPBE	NXP	IC MCU 16BIT 96KB FLASH 52LQFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 35 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 52-LQFP Supplier Device Package: 52-LQFP (10x10)	Package: 52-LQFP	Stock6,864
P89LPC9321FN,112	NXP	IC MCU 8BIT 8KB FLASH 28DIP Core Processor: 8051 Core Size: 8-Bit Speed: 18MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Number of I/O: 26 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 768 x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 28-DIP (0.600", 15.24mm) Supplier Device Package: 28-DIP	Package: 28-DIP (0.600", 15.24mm)	Stock4,800
MC9S12DT256MFUE	NXP	IC MCU 16BIT 256KB FLASH 80QFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, I2C, SCI, SPI Peripherals: PWM, WDT Number of I/O: 59 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	Package: 80-QFP	Stock8,316
TFF11092HN/N1	NXP	IC FREQUENCY GENERATOR 24HVQFN PLL: Yes Main Purpose: Ku band VSAT applications Input: Clock Output: Clock Number of Circuits: 1 Ratio - Input:Output: 1:4 Differential - Input:Output: Yes/No Frequency - Max: 9.22GHz Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-HVQFN (4x4)	Package: 24-VFQFN Exposed Pad	Stock3,088
MPX2202ASX	NXP	SENSOR ABS PRESS 29PSI MAX Pressure Type: Absolute Operating Pressure: 29.01 PSI (200 kPa) Output Type: Wheatstone Bridge Output: 0 mV ~ 40 mV (10V) Accuracy: - Voltage - Supply: 10 V ~ 16 V Port Size: Male - 0.19" (4.93mm) Tube Port Style: Barbed Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 58.02 PSI (400 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 4-SIP Module Supplier Device Package: -	Package: 4-SIP Module	Stock3,456
HT2DC20S20/F/RSP	NXP	RFID HITAG STICK TRANSP 125KHZ Style: Encapsulated Technology: Passive Frequency: 125kHz Memory Type: Read/Write Writable Memory: 256b (User) Standards: ISO 11784, ISO 11785 Operating Temperature: -40°C ~ 85°C Size / Dimension: 11.90mm x 5.90mm x 2.90mm	Package: -	Stock3,816
BGA7351,115	NXP	IC AMP VGA 32-HVQFN Frequency: 50MHz ~ 500MHz P1dB: 15.8dBm Gain: 21.5dB Noise Figure: 6dB RF Type: General Purpose Voltage - Supply: 4.75 V ~ 5.25 V Current - Supply: 280mA Test Frequency: 250MHz Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	Package: 32-VFQFN Exposed Pad	Stock6,984
MKV30F64VLF10	NXP	KINETIS KV30: 100MHZ CORTEX-M4F Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Speed: 100MHz Connectivity: I²C, SPI, UART/USART Peripherals: DMA, PWM, WDT Number of I/O: 35 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 2x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	Package: 48-LQFP	Stock7,716
S912ZVMC12F2VKH	NXP	IC MCU 16BIT FLASH Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 31 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP-EP (10x10)	Package: 64-LQFP Exposed Pad	Stock2,288
S9S08RNA16W2MTJR	NXP	8-BIT MCU S08 CORE 16KB FLASH Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 16 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 10x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	Package: 20-TSSOP (0.173", 4.40mm Width)	Stock7,152
SPC5634MF1MLU80	NXP	IC MCU 32BIT 1.5MB FLASH 176LQFP Core Processor: e200z3 Core Size: 32-Bit Speed: 80MHz Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Number of I/O: 114 Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 94K x 8 Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 34x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C Mounting Type: Surface Mount Package / Case: 176-LQFP Supplier Device Package: 176-LQFP (24x24)	Package: 176-LQFP	Stock7,392
FS32K146HFT0MMHR	NXP	IC MCU 32BIT 1MB FLASH 100MAPBGA Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Speed: 80MHz Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 89 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b SAR; D/A1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 100-LFBGA Supplier Device Package: 100-MAPBGA (11x11)	Package: -	Request a Quote
FC32K146HFT0MLLT	NXP	S32K144 32-BIT MCU, ARM CORTEX-M Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
TJA1442AT-0Z	NXP	IC TRANSCEIVER HALF 1/1 8SO Type: Transceiver Protocol: CANbus Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 50 mV Data Rate: 5Mbps Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	Package: -	Stock5,289
MFS2621AMBA0ADR2	NXP	AUTO SBC Applications: - Current - Supply: 30µA Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	Package: -	Request a Quote