Page 108 - NXP Products | Heisener Electronics

PMR780SN,115
NXP

MOSFET N-CH 60V 0.55A SOT416

Package: SC-75, SOT-416

Stock142,200
MRF21045LSR5
NXP

FET RF 65V 2.17GHZ NI-400S

Package: NI-400S

Stock7,696
BFG520,235
NXP

TRANS RF NPN 9GHZ 15V SOT143

Package: TO-253-4, TO-253AA

Stock7,104
BZX84-B4V3/LF1R
NXP

DIODE ZENER TO-236AB SOT23

Package: TO-236-3, SC-59, SOT-23-3

Stock2,320
74HCT109N,652
NXP

IC JK TYPE POS TRG DUAL 16DIP

Package: 16-DIP (0.300", 7.62mm)

Stock6,512
74ABT544PW,112
NXP

IC TRANSCVR 3ST 8BIT INV 24TSSOP

Package: 24-TSSOP (0.173", 4.40mm Width)

Stock5,056
TDA8594J/N1S
NXP

IC PWR AMP I2C BUS CTRL DBS27P

Package: 27-SIP, Formed Leads

Stock2,576
PCA9501D,112
NXP

IC I/O EXPANDER I2C 8B 20SOIC

Package: 20-SOIC (0.295", 7.50mm Width)

Stock5,888
KMPC8321EVRAFDC
NXP

IC MPU MPC83XX 333MHZ 516BGA

Package: 516-BBGA

Stock3,552
B4860NSN7QUMD
NXP

BASEBAND PROC PILOT REV 1.0

Package: 1020-BBGA, FCBGA

Stock6,480
MPC8360CVVAGDGA
NXP

IC MPU MPC83XX 400MHZ 740TBGA

Package: 740-LBGA

Stock4,320
MCF5206ECFT40
NXP

IC MCU 32BIT ROMLESS 160QFP

Package: 160-BQFP

Stock4,640
MM908E626AVDWB
NXP

IC STEPPER MOTOR DRIVER 54-SOIC

Package: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad

Stock14,436
MSC8144VT1000A
NXP

IC DSP QUAD 1GHZ 783FCBGA

Package: 783-BBGA, FCBGA

Stock7,984
TEF6892H/V3,518
NXP

IC RADIO SIGNAL PROC 44-QFP

Package: 44-QFP

Stock5,760
PTVS5V0S1UAR,115
NXP

TVS DIODE 5VWM SOD123

Package: SOD-123W

Stock6,102
BGB203H1S06UM
NXP

IC RF TXRX+MCU BLUETOOTH 48VFQFN

Package: 48-VFQFN Exposed Pad

Stock6,282
LS1043AXE7KQA
NXP

QORIQ 4XCPU 64-BIT ARM ARCH 1.

Package: -

Stock4,704
LS1026ASN8MQA
NXP

QORIQ LAYERSCAPE 2XA72 64BIT ARM

Package: -

Stock5,232
MCIMX6Q5EYM10AE
NXP

IC MPU I.MX6D ENHANCED 624FCBGA

Package: 624-FBGA, FCBGA

Stock5,536

Part Number	Manufacturer	Description	Package	Stock
PMR780SN,115	NXP	MOSFET N-CH 60V 0.55A SOT416 FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 60V Current - Continuous Drain (Id) @ 25°C: 550mA (Ta) Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs(th) (Max) @ Id: 3V @ 250µA Gate Charge (Qg) (Max) @ Vgs: 1.05nC @ 10V Input Capacitance (Ciss) (Max) @ Vds: 23pF @ 30V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 530mW (Tc) Rds On (Max) @ Id, Vgs: 920 mOhm @ 300mA, 10V Operating Temperature: -55°C ~ 150°C (TJ) Mounting Type: Surface Mount Supplier Device Package: SC-75 Package / Case: SC-75, SOT-416	Package: SC-75, SOT-416	Stock142,200
MRF21045LSR5	NXP	FET RF 65V 2.17GHZ NI-400S Transistor Type: LDMOS Frequency: 2.16GHz ~ 2.17GHz Gain: 15dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 500mA Power - Output: 10W Voltage - Rated: 65V Package / Case: NI-400S Supplier Device Package: NI-400S	Package: NI-400S	Stock7,696
BFG520,235	NXP	TRANS RF NPN 9GHZ 15V SOT143 Transistor Type: NPN Voltage - Collector Emitter Breakdown (Max): 15V Frequency - Transition: 9GHz Noise Figure (dB Typ @ f): 1.1dB ~ 2.1dB @ 900MHz Gain: - Power - Max: 300mW DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 20mA, 6V Current - Collector (Ic) (Max): 70mA Operating Temperature: 175°C (TJ) Mounting Type: Surface Mount Package / Case: TO-253-4, TO-253AA Supplier Device Package: SOT-143B	Package: TO-253-4, TO-253AA	Stock7,104
BZX84-B4V3/LF1R	NXP	DIODE ZENER TO-236AB SOT23 Voltage - Zener (Nom) (Vz): 4.3V Tolerance: ±2% Power - Max: 250mW Impedance (Max) (Zzt): 90 Ohms Current - Reverse Leakage @ Vr: 3µA @ 1V Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	Package: TO-236-3, SC-59, SOT-23-3	Stock2,320
74HCT109N,652	NXP	IC JK TYPE POS TRG DUAL 16DIP Function: Set(Preset) and Reset Type: JK Type Output Type: Differential Number of Elements: 2 Number of Bits per Element: 1 Clock Frequency: 55MHz Max Propagation Delay @ V, Max CL: 35ns @ 4.5V, 50pF Trigger Type: Positive Edge Current - Output High, Low: 4mA, 4mA Voltage - Supply: 4.5 V ~ 5.5 V Current - Quiescent (Iq): 4µA Input Capacitance: 3.5pF Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm)	Package: 16-DIP (0.300", 7.62mm)	Stock6,512
74ABT544PW,112	NXP	IC TRANSCVR 3ST 8BIT INV 24TSSOP Logic Type: Transceiver, Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 24-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 24-TSSOP	Package: 24-TSSOP (0.173", 4.40mm Width)	Stock5,056
TDA8594J/N1S	NXP	IC PWR AMP I2C BUS CTRL DBS27P Type: Class AB Output Type: 4-Channel (Quad) Max Output Power x Channels @ Load: 75W x 4 @ 2 Ohm Voltage - Supply: 8 V ~ 18 V Features: I2C, Mute, Short-Circuit and Thermal Protection, Standby Mounting Type: Through Hole Operating Temperature: -40°C ~ 105°C (TA) Supplier Device Package: DBS27P Package / Case: 27-SIP, Formed Leads	Package: 27-SIP, Formed Leads	Stock2,576
PCA9501D,112	NXP	IC I/O EXPANDER I2C 8B 20SOIC Number of I/O: 8 Interface: I2C, SMBus Interrupt Output: Yes Features: EEPROM, POR Output Type: Push-Pull Current - Output Source/Sink: 100µA, 25mA Clock Frequency: 400kHz Voltage - Supply: 2.5 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SO	Package: 20-SOIC (0.295", 7.50mm Width)	Stock5,888
KMPC8321EVRAFDC	NXP	IC MPU MPC83XX 333MHZ 516BGA Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: USB 2.0 (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	Package: 516-BBGA	Stock3,552
B4860NSN7QUMD	NXP	BASEBAND PROC PILOT REV 1.0 Core Processor: PowerPC e6500 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 1.8GHz Co-Processors/DSP: Signal Processing; SC3900FP FVP - 6 Core RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1/2.5 Gbps (4), 1/2.5/10 Gbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC Package / Case: 1020-BBGA, FCBGA Supplier Device Package: 1020-FCPBGA (33x33)	Package: 1020-BBGA, FCBGA	Stock6,480
MPC8360CVVAGDGA	NXP	IC MPU MPC83XX 400MHZ 740TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 740-LBGA Supplier Device Package: 740-TBGA (37.5x37.5)	Package: 740-LBGA	Stock4,320
MCF5206ECFT40	NXP	IC MCU 32BIT ROMLESS 160QFP Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 40MHz Connectivity: EBI/EMI, I2C, UART/USART Peripherals: DMA, WDT Number of I/O: 8 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: - Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 160-BQFP Supplier Device Package: 160-QFP (28x28)	Package: 160-BQFP	Stock4,640
MM908E626AVDWB	NXP	IC STEPPER MOTOR DRIVER 54-SOIC Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40°C ~ 115°C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP	Package: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad	Stock14,436
MSC8144VT1000A	NXP	IC DSP QUAD 1GHZ 783FCBGA Type: SC3400 Core Interface: Ethernet, I2C, SPI, TDM, UART, UTOPIA Clock Rate: 1GHz Non-Volatile Memory: External On-Chip RAM: 10.5MB Voltage - I/O: 3.30V Voltage - Core: 1.00V Operating Temperature: 0°C ~ 90°C (TJ) Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	Package: 783-BBGA, FCBGA	Stock7,984
TEF6892H/V3,518	NXP	IC RADIO SIGNAL PROC 44-QFP Function: Audio Tone Processor Applications: Automotive Audio Number of Channels: 6 Interface: I2C Voltage - Supply: 8 V ~ 9 V Operating Temperature: -40°C ~ 85°C (TA) Specifications: AM, FM Package / Case: 44-QFP Supplier Device Package: 44-PQFP (10x10)	Package: 44-QFP	Stock5,760
PTVS5V0S1UAR,115	NXP	TVS DIODE 5VWM SOD123 Type: - Unidirectional Channels: - Bidirectional Channels: - Voltage - Reverse Standoff (Typ): 5V Voltage - Breakdown (Min): - Voltage - Clamping (Max) @ Ipp: - Current - Peak Pulse (10/1000µs): - Power - Peak Pulse: 400W Power Line Protection: - Applications: - Capacitance @ Frequency: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: SOD-123W Supplier Device Package: CFP3	Package: SOD-123W	Stock6,102
BGB203H1S06UM	NXP	IC RF TXRX+MCU BLUETOOTH 48VFQFN Type: TxRx + MCU RF Family/Standard: Bluetooth Protocol: Bluetooth v2.1 +EDR, Class 2 and 3 Modulation: - Frequency: 2.4GHz Data Rate (Max): 3Mbps Power - Output: 8dBm Sensitivity: -90dBm Memory Size: 6MB ROM, 48kB RAM Serial Interfaces: - GPIO: - Voltage - Supply: 1.8 V ~ 3.6 V Current - Receiving: - Current - Transmitting: - Operating Temperature: - Package / Case: 48-VFQFN Exposed Pad	Package: 48-VFQFN Exposed Pad	Stock6,282
LS1043AXE7KQA	NXP	QORIQ 4XCPU 64-BIT ARM ARCH 1. Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	Package: -	Stock4,704
LS1026ASN8MQA	NXP	QORIQ LAYERSCAPE 2XA72 64BIT ARM Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	Package: -	Stock5,232
MCIMX6Q5EYM10AE	NXP	IC MPU I.MX6D ENHANCED 624FCBGA Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (1) SATA: SATA 3Gbps (1) USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21x21)	Package: 624-FBGA, FCBGA	Stock5,536
S912XEQ512F0MAL	NXP	16-BIT MCU S12X CORE 512KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 91 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	Package: 112-LQFP	Stock6,160
S912ZVC19F0MKH	NXP	MAGNIV 16-BIT MCU S12Z CORE 19 Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, I²C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 192KB (192K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V Data Converters: A/D 16x10b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP (10x10)	Package: 64-LQFP Exposed Pad	Stock5,552
P1011NXE2DFB	NXP	IC MPU 533MHZ 689-TEPBGA2 Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	Package: 689-BBGA Exposed Pad	Stock3,344
SAF4000EL-101Z23CY	NXP	SAF4000EL Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
FH32K144HFT0VLHT	NXP	S32K144 32-BIT MCU, ARM CORTEX-M Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
MIMXRT1064DVL6B	NXP	IC MCU 32BIT 4MB FLASH 196MAPBGA Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Single-Core Speed: 600MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Number of I/O: 127 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1M x 8 Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 20x12b Oscillator Type: External, Internal Operating Temperature: 0°C ~ 95°C (TJ) Mounting Type: Surface Mount Package / Case: 196-LFBGA Supplier Device Package: 196-MAPBGA (10x10)	Package: -	Stock6,411
LPC55S16JBD64E	NXP	IC MCU 32BIT 256KB FLASH 64HTQFP Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 150MHz Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 36 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 96K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 64-TQFP Exposed Pad Supplier Device Package: 64-HTQFP (10x10)	Package: -	Stock480
FS32R294JCK0MJDR	NXP	S32R29 MULTICORE POWER ARCHITECT Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote