Page 151 - NXP Products | Heisener Electronics

MRF19030LSR3
NXP

FET RF 65V 1.96GHZ NI-400S

Package: NI-400S

Stock22,848
MMRF1304GNR1
NXP

FET RF 133V 512MHZ TO270-2

Package: TO-270BA

Stock3,248
BZX84-C3V0/LF1VL
NXP

DIODE ZENER TO-236AB SOT23

Package: TO-236-3, SC-59, SOT-23-3

Stock2,848
BZX284-C43,115
NXP

DIODE ZENER 43V 400MW SOD2

Package: SOD-110

Stock4,960
TDA3681ATH/N1C,518
NXP

IC VOLT REG W/SW & IGNIT 20-HSOP

Package: 20-SOIC (0.433", 11.00mm Width) Exposed Pad

Stock6,176
PCF8562TT/S400/2,1
NXP

IC LCD DRIVER 48-TSSOP

Package: 48-TFSOP (0.240", 6.10mm Width)

Stock6,976
74HCT40105D,112
NXP

IC 4X16 FIFO REGISTER 16-SOIC

Package: 16-SOIC (0.154", 3.90mm Width)

Stock5,952
74LV367DB,118
NXP

IC BUFF DVR TRI-ST HEX 16SSOP

Package: 16-SSOP (0.209", 5.30mm Width)

Stock6,256
TJA1042T/1J
NXP

IC TRANSCEIVER CAN HS 8SOIC

Package: 8-SOIC (0.154", 3.90mm Width)

Stock124,860
NX3DV2567HR-Q100X
NXP

IC ANLG SWITCH 4PDT 16HXQFN

Package: 16-XFQFN Exposed Pad

Stock17,994
MC68HC000IEI16R
NXP

IC MPU M680X0 16MHZ 68PLCC

Package: 68-LCC (J-Lead)

Stock5,728
MC68EN360RC33L
NXP

IC MPU M683XX 33MHZ 241PGA

Package: 241-BEPGA

Stock7,040
MC68360CVR25L
NXP

IC MPU M683XX 25MHZ 357BGA

Package: 357-BBGA

Stock78,384
MC9328MXLVM15R2
NXP

IC MPU I.MXL 150MHZ 256MAPBGA

Package: 256-LFBGA

Stock5,856
MC68711E20MFNE3
NXP

IC MCU 8BIT 20KB OTP 52PLCC

Package: 52-LCC (J-Lead)

Stock3,728
MC9S12GC96MFUE
NXP

IC MCU 16BIT 96KB FLASH 80QFP

Package: 80-QFP

Stock5,808
MC100ES6226AC
NXP

IC CLK BUFFER 1:9 3GHZ 32LQFP

Package: 32-LQFP

Stock5,168
MPXV2053DP
NXP

SENSOR PRESSURE DIFF DUAL 8-SOP

Package: 8-SMD Module

Stock8,412
MC33493DTBE
NXP

IC RF TRANSMITTER UHF 14-TSSOP

Package: 14-TSSOP (0.173", 4.40mm Width)

Stock2,448
JN516X-EK001Z
NXP

EVAL KIT JN516X

Package: -

Stock3,436

Part Number	Manufacturer	Description	Package	Stock
MRF19030LSR3	NXP	FET RF 65V 1.96GHZ NI-400S Transistor Type: LDMOS Frequency: 1.96GHz Gain: 13dB Voltage - Test: 26V Current Rating: - Noise Figure: - Current - Test: 300mA Power - Output: 30W Voltage - Rated: 65V Package / Case: NI-400S Supplier Device Package: NI-400S	Package: NI-400S	Stock22,848
MMRF1304GNR1	NXP	FET RF 133V 512MHZ TO270-2 Transistor Type: LDMOS Frequency: 512MHz Gain: 25.4dB Voltage - Test: 50V Current Rating: - Noise Figure: - Current - Test: 10mA Power - Output: 25W Voltage - Rated: 133V Package / Case: TO-270BA Supplier Device Package: TO-270G-2	Package: TO-270BA	Stock3,248
BZX84-C3V0/LF1VL	NXP	DIODE ZENER TO-236AB SOT23 Voltage - Zener (Nom) (Vz): 3V Tolerance: ±5% Power - Max: 250mW Impedance (Max) (Zzt): 95 Ohms Current - Reverse Leakage @ Vr: 10µA @ 1V Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	Package: TO-236-3, SC-59, SOT-23-3	Stock2,848
BZX284-C43,115	NXP	DIODE ZENER 43V 400MW SOD2 Voltage - Zener (Nom) (Vz): 43V Tolerance: ±5% Power - Max: 400mW Impedance (Max) (Zzt): 80 Ohms Current - Reverse Leakage @ Vr: 50nA @ 30.1V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: SOD-110 Supplier Device Package: SOD110	Package: SOD-110	Stock4,960
TDA3681ATH/N1C,518	NXP	IC VOLT REG W/SW & IGNIT 20-HSOP Applications: Ignition Buffer, Regulator Current - Supply: 110µA Voltage - Supply: 9.5 V ~ 18 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad Supplier Device Package: 20-HSOP	Package: 20-SOIC (0.433", 11.00mm Width) Exposed Pad	Stock6,176
PCF8562TT/S400/2,1	NXP	IC LCD DRIVER 48-TSSOP Display Type: LCD Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix Interface: I2C, 2-Wire Serial Digits or Characters: 8 Characters, 16 Characters Current - Supply: 8µA Voltage - Supply: 1.8 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 48-TFSOP (0.240", 6.10mm Width) Supplier Device Package: 48-TSSOP	Package: 48-TFSOP (0.240", 6.10mm Width)	Stock6,976
74HCT40105D,112	NXP	IC 4X16 FIFO REGISTER 16-SOIC Memory Size: 64 (16 x 4) Function: Asynchronous Data Rate: 28MHz Access Time: 40ns Voltage - Supply: 4.5 V ~ 5.5 V Current - Supply (Max): - Bus Directional: Uni-Directional Expansion Type: Depth, Width Programmable Flags Support: No Retransmit Capability: No FWFT Support: No Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	Package: 16-SOIC (0.154", 3.90mm Width)	Stock5,952
74LV367DB,118	NXP	IC BUFF DVR TRI-ST HEX 16SSOP Logic Type: Buffer, Non-Inverting Number of Elements: 2 Number of Bits per Element: 2, 4 (Hex) Input Type: - Output Type: Push-Pull Current - Output High, Low: 8mA, 8mA Voltage - Supply: 1 V ~ 3.6 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 16-SSOP (0.209", 5.30mm Width) Supplier Device Package: 16-SSOP	Package: 16-SSOP (0.209", 5.30mm Width)	Stock6,256
TJA1042T/1J	NXP	IC TRANSCEIVER CAN HS 8SOIC Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 120mV Data Rate: 5Mbps Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 150°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	Package: 8-SOIC (0.154", 3.90mm Width)	Stock124,860
NX3DV2567HR-Q100X	NXP	IC ANLG SWITCH 4PDT 16HXQFN Applications: Networking Multiplexer/Demultiplexer Circuit: - Switch Circuit: 4PDT Number of Channels: 1 On-State Resistance (Max): 700 mOhm Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V Voltage - Supply, Dual (V±): - -3db Bandwidth: 160MHz Features: - Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 16-XFQFN Exposed Pad Supplier Device Package: 16-HXQFN (3x3)	Package: 16-XFQFN Exposed Pad	Stock17,994
MC68HC000IEI16R	NXP	IC MPU M680X0 16MHZ 68PLCC Core Processor: EC000 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 16MHz Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC (25x25)	Package: 68-LCC (J-Lead)	Stock5,728
MC68EN360RC33L	NXP	IC MPU M683XX 33MHZ 241PGA Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 33MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 241-BEPGA Supplier Device Package: 241-PGA (47.24x47.24)	Package: 241-BEPGA	Stock7,040
MC68360CVR25L	NXP	IC MPU M683XX 25MHZ 357BGA Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: -40°C ~ 85°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	Package: 357-BBGA	Stock78,384
MC9328MXLVM15R2	NXP	IC MPU I.MXL 150MHZ 256MAPBGA Core Processor: ARM920T Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 150MHz Co-Processors/DSP: - RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: - SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 3.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 256-LFBGA Supplier Device Package: -	Package: 256-LFBGA	Stock5,856
MC68711E20MFNE3	NXP	IC MCU 8BIT 20KB OTP 52PLCC Core Processor: HC11 Core Size: 8-Bit Speed: 4MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Size: 20KB (20K x 8) Program Memory Type: OTP EEPROM Size: 512 x 8 RAM Size: 768 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1)	Package: 52-LCC (J-Lead)	Stock3,728
MC9S12GC96MFUE	NXP	IC MCU 16BIT 96KB FLASH 80QFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 60 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	Package: 80-QFP	Stock5,808
MC100ES6226AC	NXP	IC CLK BUFFER 1:9 3GHZ 32LQFP Type: Fanout Buffer (Distribution), Divider Number of Circuits: 1 Ratio - Input:Output: 1:9 Differential - Input:Output: Yes/Yes Input: LVPECL Output: LVCMOS, LVPECL Frequency - Max: 3GHz Voltage - Supply: 2.375 V ~ 3.465 V Operating Temperature: 0°C ~ 110°C Mounting Type: Surface Mount Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	Package: 32-LQFP	Stock5,168
MPXV2053DP	NXP	SENSOR PRESSURE DIFF DUAL 8-SOP Pressure Type: Differential Operating Pressure: 7.25 PSI (50 kPa) Output Type: Wheatstone Bridge Output: 0 mV ~ 40 mV (10V) Accuracy: -0.6% ~ 0.4% Voltage - Supply: 10 V ~ 16 V Port Size: Male - 0.13" (3.3mm) Tube, Dual Port Style: Barbed Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 29.01 PSI (200 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 8-SMD Module Supplier Device Package: -	Package: 8-SMD Module	Stock8,412
MC33493DTBE	NXP	IC RF TRANSMITTER UHF 14-TSSOP Frequency: 315 ~ 434MHz, 868 ~ 928MHz Applications: General Data Transfer Modulation or Protocol: FSK, OOK Data Rate (Max): 10 kbps Power - Output: -3dBm Current - Transmitting: 11.6mA Data Interface: PCB, Surface Mount Antenna Connector: PCB, Surface Mount Memory Size: - Features: - Voltage - Supply: 1.9 V ~ 3.6 V Operating Temperature: -40°C ~ 125°C Package / Case: 14-TSSOP (0.173", 4.40mm Width)	Package: 14-TSSOP (0.173", 4.40mm Width)	Stock2,448
JN516X-EK001Z	NXP	EVAL KIT JN516X Type: - Frequency: - For Use With/Related Products: - Supplied Contents: -	Package: -	Stock3,436
MC33FS6512CAER2	NXP	SYSTEM BASIS CHIP DCDC 1.5A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: -1.0 V ~ 40 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP (7x7)	Package: 48-LQFP Exposed Pad	Stock7,568
S912XDP512J1MALR	NXP	16-BIT MCU S12X CORE 512KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 80MHz Connectivity: CANbus, I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 91 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 8x10b, 16x10b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	Package: 112-LQFP	Stock5,024
SPC5603BK0VLL4	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 48MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 79 Program Memory Size: 384KB (384K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 28K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 28x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	Package: 100-LQFP	Stock5,856
S9S12XS256J0VAAR	NXP	16-BIT MCU S12X CORE 256KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 40MHz Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 59 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 8x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	Package: 80-QFP	Stock2,656
MK02FN64VFM10R	NXP	KINETIS K 32-BIT MCU ARM CORTEX Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Speed: 100MHz Connectivity: I²C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM Number of I/O: 26 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 12x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-QFN (5x5)	Package: 32-VFQFN Exposed Pad	Stock2,480
MC33PF8100EQESR2	NXP	POWER MANAGEMENT IC I.MX8 PRE-PR Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	Package: -	Request a Quote
SPC5606BAMLQ6R	NXP	NXP 32-BIT MCU, POWER ARCH CORE Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
S32G274AABK0VUCR	NXP	S32G274A ARM CORTEX-M7 AND -A53, Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 64-Bit/4 Core, 32-Bit Speed: 400MHz, 1GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: GbE (4) SATA: - USB: USB 2.0 OTG (1) Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19x19)	Package: -	Request a Quote