Page 17 - NXP Products | Heisener Electronics

MRF5P20180HR6
NXP

FET RF 65V 1.99GHZ NI-1230

Package: NI-1230

Stock7,680
MRF8P9300HSR6
NXP

FET RF 2CH 70V 960MHZ NI-1230HS

Package: NI-1230S

Stock4,336
MWCT1003AVLH
NXP

IC DSP MULTI COIL 5W 5V 64LQFP

Package: 64-LQFP

Stock2,656
MC34PF3001A2EP
NXP

IC POWER MANAGEMENT 48QFN

Package: 48-VFQFN Exposed Pad

Stock7,308
MC34704BEP
NXP

IC POWER MANAGEMENT 56-QFN

Package: 56-QFN

Stock4,528
74HC258D,653
NXP

IC QUAD 2-IN MUX 3-ST INV 16SOIC

Package: 16-SOIC (0.154", 3.90mm Width)

Stock3,712
74HC573N,652
NXP

IC LATCH OCTAL D 3STATE 20DIP

Package: 20-DIP (0.300", 7.62mm)

Stock6,224
74LVT10PW,118
NXP

IC GATE NAND 3CH 3-INP 14-TSSOP

Package: 14-TSSOP (0.173", 4.40mm Width)

Stock3,168
74HCT646D,652
NXP

IC TXRX NON-INV 3-ST 8BIT 24SOIC

Package: 24-SOIC (0.295", 7.50mm Width)

Stock3,440
SC16C752BIB48,128
NXP

IC DUAL UART 64BYTE 48LQFP

Package: 48-LQFP

Stock4,320
MC145574AACR2
NXP

IC TRANSCEIVER ISDN 32-LQFP

Package: 32-LQFP

Stock4,288
P1010PSE5HFA
NXP

IC MPU Q OR IQ 1.0GHZ 425TEBGA1

Package: 425-FBGA

Stock5,280
MC8640DTHX1067NE
NXP

IC MPU MPC86XX 1.067GHZ 1023BGA

Package: 1023-BCBGA, FCCBGA

Stock5,136
KMC7448VU1400NC
NXP

IC MPU MPC74XX 1.4GHZ 360FCCBGA

Package: 360-CBGA, FCCBGA

Stock4,304
MPC8250AZUPIBC
NXP

IC MPU MPC82XX 300MHZ 408TBGA

Package: 480-LBGA

Stock6,192
SPC5644AF0MLU2
NXP

IC MCU 32BIT 4MB FLASH 176LQFP

Package: 176-LQFP

Stock5,216
MC56F84540VLF
NXP

IC MCU 32BIT 64KB FLASH 48LQFP

Package: 48-LQFP

Stock4,624
MC9S08PA16AVTJ
NXP

IC MCU 8BIT 16KB FLASH 20TSSOP

Package: 20-TSSOP (0.173", 4.40mm Width)

Stock2,352
DSPB56724AG
NXP

DSP 24BIT AUD 250MHZ 144-LQFP

Package: 144-LQFP

Stock6,304
OH10/62,116
NXP

TEMPERATURE SENSOR SOD70

Package: -

Stock2,574

Part Number	Manufacturer	Description	Package	Stock
MRF5P20180HR6	NXP	FET RF 65V 1.99GHZ NI-1230 Transistor Type: LDMOS Frequency: 1.93GHz ~ 1.99GHz Gain: 14dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 1.6A Power - Output: 38W Voltage - Rated: 65V Package / Case: NI-1230 Supplier Device Package: NI-1230	Package: NI-1230	Stock7,680
MRF8P9300HSR6	NXP	FET RF 2CH 70V 960MHZ NI-1230HS Transistor Type: LDMOS (Dual) Frequency: 960MHz Gain: 19.4dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 2.4A Power - Output: 100W Voltage - Rated: 70V Package / Case: NI-1230S Supplier Device Package: NI-1230S	Package: NI-1230S	Stock4,336
MWCT1003AVLH	NXP	IC DSP MULTI COIL 5W 5V 64LQFP Applications: Wireless Power Transmitter Current - Supply: - Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	Package: 64-LQFP	Stock2,656
MC34PF3001A2EP	NXP	IC POWER MANAGEMENT 48QFN Applications: Processor Current - Supply: - Voltage - Supply: 2.8 V ~ 5.5 V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (7x7)	Package: 48-VFQFN Exposed Pad	Stock7,308
MC34704BEP	NXP	IC POWER MANAGEMENT 56-QFN Applications: Processor Current - Supply: 86mA Voltage - Supply: 2.7 V ~ 5.5 V Operating Temperature: -20°C ~ 85°C Mounting Type: Surface Mount Package / Case: 56-QFN Supplier Device Package: 56-QFN-EP (7x7)	Package: 56-QFN	Stock4,528
74HC258D,653	NXP	IC QUAD 2-IN MUX 3-ST INV 16SOIC Type: Multiplexer Circuit: 4 x 2:1 Independent Circuits: 1 Current - Output High, Low: 7.8mA, 7.8mA Voltage Supply Source: Single Supply Voltage - Supply: 2 V ~ 6 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	Package: 16-SOIC (0.154", 3.90mm Width)	Stock3,712
74HC573N,652	NXP	IC LATCH OCTAL D 3STATE 20DIP Logic Type: D-Type Transparent Latch Circuit: 8:8 Output Type: Tri-State Voltage - Supply: 2 V ~ 6 V Independent Circuits: 1 Delay Time - Propagation: 14ns Current - Output High, Low: 7.8mA, 7.8mA Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Package / Case: 20-DIP (0.300", 7.62mm) Supplier Device Package: 20-DIP	Package: 20-DIP (0.300", 7.62mm)	Stock6,224
74LVT10PW,118	NXP	IC GATE NAND 3CH 3-INP 14-TSSOP Logic Type: NAND Gate Number of Circuits: 3 Number of Inputs: 3 Features: - Voltage - Supply: 2.7 V ~ 3.6 V Current - Quiescent (Max): - Current - Output High, Low: 20mA, 32mA Logic Level - Low: 0.8V Logic Level - High: 2V Max Propagation Delay @ V, Max CL: 3.8ns @ 3.3V, 50pF Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Supplier Device Package: 14-TSSOP Package / Case: 14-TSSOP (0.173", 4.40mm Width)	Package: 14-TSSOP (0.173", 4.40mm Width)	Stock3,168
74HCT646D,652	NXP	IC TXRX NON-INV 3-ST 8BIT 24SOIC Logic Type: Transceiver, Non-Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 6mA, 6mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 24-SOIC (0.295", 7.50mm Width) Supplier Device Package: 24-SO	Package: 24-SOIC (0.295", 7.50mm Width)	Stock3,440
SC16C752BIB48,128	NXP	IC DUAL UART 64BYTE 48LQFP Features: - Number of Channels: 2, DUART FIFO's: 64 Byte Protocol: - Data Rate (Max): 5Mbps Voltage - Supply: 2.5V, 3.3V, 5V With Auto Flow Control: Yes With IrDA Encoder/Decoder: - With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	Package: 48-LQFP	Stock4,320
MC145574AACR2	NXP	IC TRANSCEIVER ISDN 32-LQFP Type: Transceiver Protocol: - Number of Drivers/Receivers: - Duplex: - Receiver Hysteresis: - Data Rate: - Voltage - Supply: 4.75 V ~ 5.25 V Operating Temperature: - Mounting Type: Surface Mount Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	Package: 32-LQFP	Stock4,288
P1010PSE5HFA	NXP	IC MPU Q OR IQ 1.0GHZ 425TEBGA1 Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Security; SEC 4.4 RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (1) Voltage - I/O: - Operating Temperature: 0°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox Package / Case: 425-FBGA Supplier Device Package: 425-TEPBGA1	Package: 425-FBGA	Stock5,280
MC8640DTHX1067NE	NXP	IC MPU MPC86XX 1.067GHZ 1023BGA Core Processor: PowerPC e600 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.067GHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 1023-BCBGA, FCCBGA Supplier Device Package: 1023-FCCBGA (33x33)	Package: 1023-BCBGA, FCCBGA	Stock5,136
KMC7448VU1400NC	NXP	IC MPU MPC74XX 1.4GHZ 360FCCBGA Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.4GHz Co-Processors/DSP: Multimedia; SIMD RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 360-CBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25x25)	Package: 360-CBGA, FCCBGA	Stock4,304
MPC8250AZUPIBC	NXP	IC MPU MPC82XX 300MHZ 408TBGA Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 300MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 480-LBGA Supplier Device Package: 408-TBGA (37.5x37.5)	Package: 480-LBGA	Stock6,192
SPC5644AF0MLU2	NXP	IC MCU 32BIT 4MB FLASH 176LQFP Core Processor: e200z4 Core Size: 32-Bit Speed: 120MHz Connectivity: CAN, EBI/EMI, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 84 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 192K x 8 Voltage - Supply (Vcc/Vdd): 1.14 V ~ 1.32 V Data Converters: A/D 40x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 176-LQFP Supplier Device Package: 176-LQFP (24x24)	Package: 176-LQFP	Stock5,216
MC56F84540VLF	NXP	IC MCU 32BIT 64KB FLASH 48LQFP Core Processor: 56800EX Core Size: 32-Bit Speed: 80MHz Connectivity: CAN, I2C, LIN, SCI, SPI Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 10x12b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	Package: 48-LQFP	Stock4,624
MC9S08PA16AVTJ	NXP	IC MCU 8BIT 16KB FLASH 20TSSOP Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, LIN, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 18 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	Package: 20-TSSOP (0.173", 4.40mm Width)	Stock2,352
DSPB56724AG	NXP	DSP 24BIT AUD 250MHZ 144-LQFP Type: Audio Processor Interface: Host Interface, I2C, SAI, SPI Clock Rate: 250MHz Non-Volatile Memory: External On-Chip RAM: 112kB Voltage - I/O: 3.30V Voltage - Core: 1.20V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	Package: 144-LQFP	Stock6,304
OH10/62,116	NXP	TEMPERATURE SENSOR SOD70 Sensor Type: - Sensing Temperature - Local: - Sensing Temperature - Remote: - Output Type: - Voltage - Supply: - Resolution: - Features: - Accuracy - Highest (Lowest): - Test Condition: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock2,574
PCF7952XTT/C1CC170	NXP	IC KEYLESS ENTRY/GO 24TSSOP Frequency: - Applications: - Modulation or Protocol: - Data Rate (Max): - Power - Output: - Current - Transmitting: - Data Interface: - Antenna Connector: - Memory Size: - Features: - Voltage - Supply: - Operating Temperature: - Package / Case: -	Package: -	Stock4,446
LS1043AXE8MQB	NXP	QORIQ 4XCPU 64-BIT ARM ARCH 1. Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	Package: -	Stock2,816
LS1012ASN7KKB	NXP	LS1012A ST 1GHZ RV2 Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: 211-VFLGA Supplier Device Package: 211-FCLGA (9.6x9.6)	Package: 211-VFLGA	Stock7,440
S912ZVLA12F0CLC	NXP	S12Z CPU 128K FLASH Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 19 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V Data Converters: A/D 6x10b, A/D 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	Package: 32-LQFP	Stock6,624
LPC865M201JHI33-0E	NXP	IC MCU CORTEX M0+ HVQFN32 Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 60MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Number of I/O: 29 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 12x12b SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	Package: -	Stock1,338
S912ZVC19F1WLFR	NXP	S12Z, 48LQFP, 192K FLASH Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 28 Program Memory Size: 192KB (192K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V Data Converters: A/D 10x10b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	Package: -	Request a Quote
MC33772CTC1AE	NXP	IC 6-CH LI-ION BATT CTRL 48LQFP Function: Battery Cell Controller Battery Chemistry: Lithium Ion Number of Cells: 3 ~ 6 Fault Protection: Over/Under Voltage Interface: I2C, SPI Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	Package: -	Request a Quote
SPC5748CSK0AVMJ2	NXP	IC MCU 32BIT 6MB FLSH 256MAPPBGA Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz, 120MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 178 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 768K x 8 Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 48x10b, 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 256-LBGA Supplier Device Package: 256-MAPPBGA (17x17)	Package: -	Request a Quote