Page 191 - NXP Products | Heisener Electronics

PHB160NQ08T,118
NXP

MOSFET N-CH 75V 75A D2PAK

Package: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

Stock4,960
BUK9510-55A,127
NXP

MOSFET N-CH 55V 75A TO220AB

Package: TO-220-3

Stock3,472
PDTC114EK,135
NXP

TRANS PREBIAS NPN 250MW SMT3

Package: TO-236-3, SC-59, SOT-23-3

Stock6,240
MC07XS6517EK
NXP

IC SWITCH PENTA 54SOIC T07D17

Package: 54-SSOP (0.295", 7.50mm Width) Exposed Pad

Stock5,584
74HCT7731D,118
NXP

IC QUAD 64BIT SHFT REGIST 16SOIC

Package: 16-SOIC (0.154", 3.90mm Width)

Stock6,544
74HCT377N,652
NXP

IC D-TYPE POS TRG SNGL 20DIP

Package: 20-DIP (0.300", 7.62mm)

Stock3,456
74LV367DB,112
NXP

IC BUFF DVR TRI-ST HEX 16SSOP

Package: 16-SSOP (0.209", 5.30mm Width)

Stock3,136
74HCT368N,652
NXP

IC INVERTER DUAL 4,2-INPUT 16DIP

Package: 16-DIP (0.300", 7.62mm)

Stock4,176
SC16C850VIBS,157
NXP

IC UART SINGLE W/FIFO 32-HVQFN

Package: 32-VFQFN Exposed Pad

Stock5,552
PTN3460BS/F2,518
NXP

IC SPECIALIZED

Package: 56-VFQFN Exposed Pad

Stock7,824
AU5780AD,112
NXP

IC TRANSCEIVER VPW 8-SOIC

Package: 8-SOIC (0.154", 3.90mm Width)

Stock5,568
MPC8533VTALF
NXP

IC MPU MPC85XX 667MHZ 783FCBGA

Package: 783-BBGA, FCBGA

Stock12,456
MPC8360EZUAJDG
NXP

IC MPU MPC83XX 533MHZ 740TBGA

Package: 740-LBGA

Stock6,496
P2020NXN2HFC
NXP

IC MPU Q OR IQ 1.2GHZ 689TEBGA

Package: 689-BBGA Exposed Pad

Stock5,520
MC68908GZ8MFJE
NXP

IC MCU 8BIT 8KB FLASH 32LQFP

Package: 32-LQFP

Stock6,480
MC68HC11F1CFN3
NXP

IC MCU 8BIT ROMLESS 68PLCC

Package: 68-LCC (J-Lead)

Stock50,820
SPC5553MVZ132
NXP

IC MCU 32BIT 1.5KB FLASH 324BGA

Package: 324-BBGA

Stock6,304
S9S08SG32E1WTLR
NXP

IC MCU 8BIT 32KB FLASH 28TSSOP

Package: 28-TSSOP (0.173", 4.40mm Width)

Stock5,584
MC9S08QD2VSC
NXP

IC MCU 8BIT 2KB FLASH 8SOIC

Package: 8-SOIC (0.154", 3.90mm Width)

Stock17,664
MMA6827BKW
NXP

ACCELEROMETER 120G SPI 16QFN

Package: 16-QFN Exposed Pad

Stock5,868

Part Number	Manufacturer	Description	Package	Stock
PHB160NQ08T,118	NXP	MOSFET N-CH 75V 75A D2PAK FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 75V Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Drive Voltage (Max Rds On, Min Rds On): 10V Vgs(th) (Max) @ Id: 4V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 91nC @ 10V Input Capacitance (Ciss) (Max) @ Vds: 5585pF @ 25V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 300W (Tc) Rds On (Max) @ Id, Vgs: 5.6 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Surface Mount Supplier Device Package: D2PAK Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB	Package: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB	Stock4,960
BUK9510-55A,127	NXP	MOSFET N-CH 55V 75A TO220AB FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 55V Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs(th) (Max) @ Id: 2V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 68nC @ 5V Input Capacitance (Ciss) (Max) @ Vds: 4307pF @ 25V Vgs (Max): ±15V FET Feature: - Power Dissipation (Max): 200W (Tc) Rds On (Max) @ Id, Vgs: 9 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Through Hole Supplier Device Package: TO-220AB Package / Case: TO-220-3	Package: TO-220-3	Stock3,472
PDTC114EK,135	NXP	TRANS PREBIAS NPN 250MW SMT3 Transistor Type: NPN - Pre-Biased Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 50V Resistor - Base (R1) (Ohms): 10k Resistor - Emitter Base (R2) (Ohms): 10k DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA Frequency - Transition: - Power - Max: 250mW Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	Package: TO-236-3, SC-59, SOT-23-3	Stock6,240
MC07XS6517EK	NXP	IC SWITCH PENTA 54SOIC T07D17 Switch Type: General Purpose Number of Outputs: 6 Ratio - Input:Output: 1:1 Output Configuration: High Side Output Type: N-Channel Interface: SPI Voltage - Load: 7 V ~ 18 V Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Current - Output (Max): 5.5A, 11A Rds On (Typ): 7 mOhm, 17 mOhm Input Type: - Features: Internal PWM Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature Operating Temperature: -40°C ~ 150°C (TJ) Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOIC	Package: 54-SSOP (0.295", 7.50mm Width) Exposed Pad	Stock5,584
74HCT7731D,118	NXP	IC QUAD 64BIT SHFT REGIST 16SOIC Logic Type: Register, Multiplexed Output Type: Push-Pull Number of Elements: 4 Number of Bits per Element: 64 Function: Universal Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	Package: 16-SOIC (0.154", 3.90mm Width)	Stock6,544
74HCT377N,652	NXP	IC D-TYPE POS TRG SNGL 20DIP Function: Standard Type: D-Type Output Type: Non-Inverted Number of Elements: 1 Number of Bits per Element: 8 Clock Frequency: 53MHz Max Propagation Delay @ V, Max CL: 32ns @ 4.5V, 50pF Trigger Type: Positive Edge Current - Output High, Low: 4mA, 5.2mA Voltage - Supply: 4.5 V ~ 5.5 V Current - Quiescent (Iq): 8µA Input Capacitance: 3.5pF Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Through Hole Package / Case: 20-DIP (0.300", 7.62mm)	Package: 20-DIP (0.300", 7.62mm)	Stock3,456
74LV367DB,112	NXP	IC BUFF DVR TRI-ST HEX 16SSOP Logic Type: Buffer, Non-Inverting Number of Elements: 2 Number of Bits per Element: 2, 4 (Hex) Input Type: - Output Type: Push-Pull Current - Output High, Low: 8mA, 8mA Voltage - Supply: 1 V ~ 3.6 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 16-SSOP (0.209", 5.30mm Width) Supplier Device Package: 16-SSOP	Package: 16-SSOP (0.209", 5.30mm Width)	Stock3,136
74HCT368N,652	NXP	IC INVERTER DUAL 4,2-INPUT 16DIP Logic Type: Buffer, Inverting Number of Elements: 2 Number of Bits per Element: 2, 4 (Hex) Input Type: - Output Type: Push-Pull Current - Output High, Low: 6mA, 6mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	Package: 16-DIP (0.300", 7.62mm)	Stock4,176
SC16C850VIBS,157	NXP	IC UART SINGLE W/FIFO 32-HVQFN Features: - Number of Channels: 1, UART FIFO's: 128 Byte Protocol: RS485 Data Rate (Max): 5Mbps Voltage - Supply: 1.8V With Auto Flow Control: Yes With IrDA Encoder/Decoder: Yes With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	Package: 32-VFQFN Exposed Pad	Stock5,552
PTN3460BS/F2,518	NXP	IC SPECIALIZED Applications: LVDS Interface: - Voltage - Supply: 3.3V Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (7x7) Mounting Type: Surface Mount	Package: 56-VFQFN Exposed Pad	Stock7,824
AU5780AD,112	NXP	IC TRANSCEIVER VPW 8-SOIC Type: Transceiver Protocol: J1850 Number of Drivers/Receivers: 1/1 Duplex: Full Receiver Hysteresis: 400mV Data Rate: - Voltage - Supply: 6 V ~ 24 V Operating Temperature: -40°C ~ 150°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	Package: 8-SOIC (0.154", 3.90mm Width)	Stock5,568
MPC8533VTALF	NXP	IC MPU MPC85XX 667MHZ 783FCBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 90°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	Package: 783-BBGA, FCBGA	Stock12,456
MPC8360EZUAJDG	NXP	IC MPU MPC83XX 533MHZ 740TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 533MHz Co-Processors/DSP: Communications; QUICC Engine, Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 740-LBGA Supplier Device Package: 740-TBGA (37.5x37.5)	Package: 740-LBGA	Stock6,496
P2020NXN2HFC	NXP	IC MPU Q OR IQ 1.2GHZ 689TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: - RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: -40°C ~ 125°C (TA) Security Features: - Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	Package: 689-BBGA Exposed Pad	Stock5,520
MC68908GZ8MFJE	NXP	IC MCU 8BIT 8KB FLASH 32LQFP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: LVD, POR, PWM Number of I/O: 21 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	Package: 32-LQFP	Stock6,480
MC68HC11F1CFN3	NXP	IC MCU 8BIT ROMLESS 68PLCC Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 30 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC (25x25)	Package: 68-LCC (J-Lead)	Stock50,820
SPC5553MVZ132	NXP	IC MCU 32BIT 1.5KB FLASH 324BGA Core Processor: e200z6 Core Size: 32-Bit Speed: 132MHz Connectivity: CAN, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 220 Program Memory Size: 1.5KB (1.5K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V Data Converters: A/D 40x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 324-BBGA Supplier Device Package: 324-TEPBGA (23x23)	Package: 324-BBGA	Stock6,304
S9S08SG32E1WTLR	NXP	IC MCU 8BIT 32KB FLASH 28TSSOP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 22 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: - Package / Case: 28-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 28-TSSOP	Package: 28-TSSOP (0.173", 4.40mm Width)	Stock5,584
MC9S08QD2VSC	NXP	IC MCU 8BIT 2KB FLASH 8SOIC Core Processor: S08 Core Size: 8-Bit Speed: 16MHz Connectivity: - Peripherals: LVD, POR, PWM, WDT Number of I/O: 4 Program Memory Size: 2KB (2K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 4x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SOIC	Package: 8-SOIC (0.154", 3.90mm Width)	Stock17,664
MMA6827BKW	NXP	ACCELEROMETER 120G SPI 16QFN Type: Digital Axis: X, Y Acceleration Range: ±120g Sensitivity (LSB/g): 4.096 Sensitivity (mV/g): - Bandwidth: - Output Type: SPI Voltage - Supply: 3.135 V ~ 5.25 V Features: - Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 16-QFN Exposed Pad Supplier Device Package: 16-QFN (6x6)	Package: 16-QFN Exposed Pad	Stock5,868
T1024NXE7MQA	NXP	QORIQ 2XCPU 64-BIT PWR ARCH 1. Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	Package: -	Stock5,696
SPC5603BAVLH4	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 48MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 45 Program Memory Size: 384KB (384K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 28K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	Package: 64-LQFP	Stock4,208
MCIMX7U3CVP06SC	NXP	IC I.MX 7ULP MAPBGA 393 Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 650MHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: LPDDR2, LPDDR3 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-DSI Ethernet: - SATA: - USB: USB 2.0 (2) Voltage - I/O: - Operating Temperature: -40°C ~ 105°C Security Features: Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot Package / Case: - Supplier Device Package: -	Package: -	Stock7,120
FS32K146HFT0MLLR	NXP	IC MCU 32BIT 1MB FLASH 100LQFP Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Speed: 80MHz Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 89 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b SAR; D/A1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	Package: -	Request a Quote
SJA1124BHG-1Z	NXP	IC TRANSCEIVER FULL 4/4 24DHVQFN Type: Transceiver Protocol: LIN Number of Drivers/Receivers: 4/4 Duplex: Full Receiver Hysteresis: - Data Rate: 20kBaud Voltage - Supply: 5V ~ 28V Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-DHVQFN (5.5x3.5)	Package: -	Request a Quote
LPC55S36JBD100K	NXP	IC MCU 32BIT 256KB FLSH 100HLQFP Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 150MHz Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0 Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Number of I/O: 66 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 23x16b; D/A 3x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-HLQFP (14x14)	Package: -	Request a Quote
SCIMX6S6AVM083CR	NXP	I.MX 6 SERIES 32-BIT MPU ARM COR Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
A3V26S004NT6	NXP	RF MOSFET LDMOS 48V 6DFN Transistor Type: LDMOS Frequency: 2.496GHz ~ 2.69GHz Gain: 23.3dB Voltage - Test: 48 V Current Rating: 10µA Noise Figure: - Current - Test: 16 mA Power - Output: 26dBm Voltage - Rated: 105 V Package / Case: 6-LDFN Exposed Pad Supplier Device Package: 6-PDFN (4x4.5)	Package: -	Request a Quote